Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroyoshi Sekiguchi

Satoru Mitani

Masaya Sakaguchi

Tadashi Kimura

Hiroyasu Tsuji

Tomohiro Okumura

Ryuichi Murai

Mitsuhiro Furukawa

Isao Muragishi

Takayuki Ashida

Yoshihiro Sakaguchi

Kiyoharu Yamashita

Hiroshi Kurotake

Takahiro Takisawa

A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.

Method for producing plasma display panel

A surface acoustic wave device includes a piezoelectric substrate and an electrode provided on the substrate. The electrode includes a first metal layer provided on the piezoelectric substrate and having a trapezoid shape in the cross section and a second metal layer provided over the piezoelectric substrate at the same position as the first metal layer over the piezoelectric substrate. By controlling the shape of side surfaces of the electrode, the surface acoustic wave device hardly vary in a propagation frequency.

Surface acoustic wave device, electronic component using the device, and composite module

A thin film magnetic head which includes a magnetoresistive layer selectively formed; a magnetic bias layer sandwiching said magnetoresistive layer; a pair of leads for detecting magnetic resistance; and a cap layer formed under the lead between the magnetoresistive layer. This configuration enables to accurately specify a magnetic response region by both ends of the cap layers, concentrating the current from the lead onto the magnetic response region through a tip of the cap layer for improving a S/N ratio.

Thin film magnetic head

As an electrically conductive layer or a lower layer of conductor layers to be patterned, a conductor layer which is dry-etchable with an oxygen-containing gas is provided. A dry etching process of the conductor layer with the oxygen-containing gas is performed highly selectively to a ground film.

Thin film device and method for manufacturing thin film device

Growing community of inventors

Osaka, Japan

Hiroyoshi Sekiguchi