Opnext Japan, Inc.

Oclaro Japan, Inc.

Lumentum Japan, Inc.

Hiroyoshi Ishii

Osamu Kagaya

Fumihide Maeda

Toshikazu Ohtake

Koichi Omori

Satoshi Motohiro

Koichi Takahashi

Koji Takeguchi

Osamu Yamada

Tetsuya Aoki

Hiroki Irie

Koyu Takahashi

Toshikazu Otake

Futoshi Endou

Yasushi Kitajima

An optical module includes at least one optical sub-assembly; at least one control circuit configured to control the at least one optical sub-assembly; and a housing including a first case and a second case, wherein the optical module is configured to be plugged in and unplugged from an optical transmission equipment including a heat sink provided at a joining portion with the first case, wherein, through fitting of the first case and the second case, the housing accommodates the at least one optical sub-assembly and the at least one control circuit inside the housing, and wherein a material of the first case has a thermal conductivity higher than a material of the second case.

Optical module and optical transmission equipment

Provided are a printed circuit board configured to achieve reduction in impedance of a differential transmission line extending in a stacking direction, and an optical module. The printed circuit board includes a stacking-direction differential transmission line extending in the stacking direction, including: a differential signal via pair including a first signal via and a second signal via; and a plurality of conductor plate pairs each including a first conductor plate expanding outward from the first signal via, and a second conductor plate expanding outward from the second signal via. With respect to a perpendicular bisector of a center-of-gravity line segment connecting centers of gravity of the first and second signal vias, in each of the plurality of conductor plate pairs, centers of gravity of contours of the first and second conductor plates are located on inner sides of the centers of gravity.

Printed circuit board and optical module

The optical module includes a housing having a first opening for inputting or outputting a first electric signal, a second opening for inputting or outputting a second electric signal, and an optical signal port, one or more substrates disposed in the housing, to/from which the first electric signal is input/output and to/from which the second electric signal is input/output, an optical subassembly disposed in the housing and optically connected to the optical signal port, and a control circuit disposed in the housing and mounted on the substrate for controlling the optical subassembly, wherein the first electric signal is an electric signal input to or output from the optical subassembly, the second electric signal is an electric signal input to or output from the control circuit, and the second opening is provided on one side different from other side of the housing on which the first opening is provided.

Optical module and transmission device

An optical transceiver is configured to use, as an electric signal, a digital modulation signal having a predetermined bit rate. The optical transceiver includes a case having a space for storing a component therein and a resistor being arranged between upper and lower surfaces of the space and having conductance of from 1 S/m to 1,000 S/m. The space has a height equal to or less than a wavelength in a free space of an electromagnetic wave of a frequency corresponding to the predetermined bit rate. At least a part of the height of the space is larger than a half of the wavelength. The height of the space is smaller than a width of the space. The width of the space is smaller than a depth of the space.

Optical transceiver

Provided is an optical module including: an optical assembly incorporating a light emitting or receiving device for converting one of an electrical signal and an optical signal into another of the electrical signal and the optical signal; a circuit board electrically connected to the optical assembly; an optical fiber optically connected to the optical assembly; a tray for winding the optical fiber therein and pulling out the optical fiber therefrom; and a case receiving the optical assembly, the circuit board, the optical fiber, and the tray. In the optical module, the tray is fixed with respect to the case so as to be reciprocatingly movable only within a restricted range, and the tray is moved from a position to another position within the restricted range so as to be moved away from an electrical connection section between the optical assembly and the circuit board.

Optical module

In an optical transmission module having a communication module which is freely movable in a case, when a tensile force is generated on an optical cable after connection of an optical transmission module, optical coupling surface and an optical axis center follow each other and thus stable optical transmission can be constantly performed.

Optical transmission module

There is provided a pluggable module having grooves, on lateral faces, for latching with a cage and engaging portions for detachment, wherein the module body is detached from the cage by using a module detaching unit which is inserted along the grooves and which locks the engaging portions of the module body in the length direction. Further, there is provided a detaching jig including: latch release portions which are inserted between the pluggable module and the cage; lock portions which allow the pluggable module to be locked in the detaching direction; and a handle portion for detaching the pluggable module from the cage.

Pluggable module and detaching jig thereof

Provided is a metal casing structure capable of avoiding a cavity resonance at 10 GHz and 20 GHz by controlling an eigenmode frequency in an inner space of a casing without involving an increase in cost, and a 10 Gbit/s optical transceiver module which achieves reduction in unnecessary electromagnetic waves and cost. In the optical transceiver module, a metal casing having a cavity therein is formed by an upper casing () and a lower casing (), a metal partition wall () is provided on at least one of the upper casing () and the lower casing () near a central portion of the casing in a direction parallel to a direction connecting a front and a rear thereof, and a length of a gap between the partition wall () and a printed circuit board () is adjusted.

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Kanagawa, Japan

Hiroyoshi Ishii