Momentive Performance Materials Japan LLC

Toshiba Silicone Co., Ltd.

Hiroyoshi Iijima

Hideo Takahashi

Hidefumi Tagai

Isao Iida

Masanari Shimakawa

Makoto Sawada

Toshihiko Matsukura

A heat-curable addition-reactive type silicone rubber composition which gives a molded article having excellent antistatic property, heat resistance, compression set property. The heat-curable addition-reactive type silicone rubber composition includes:

Heat curable addition-reactive type silicone rubber composition

The present invention provides a heat-curable silicone rubber composition capable of giving a stable and high antistatic property for a long time without degrading inherent properties of a silicone rubber, such as thermal stability. The heat-curable silicone rubber composition includes: (A) 100 parts by mass of a mixture of a polyorganosiloxane obtained by polymerization by using an alkali metal hydroxide as a polymerization catalyst and by neutralization, and a curing agent, and (B) 50 to 1000 ppm of an ionic substance containing an anion and a cation, and being a bis(trifluoromethanesulfonyl)imide as the anion.

Heat curable silicone rubber composition

Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 10&#x3a9;&#xb7;cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO.

Resin composition with high dielectric insulation properties

The present invention provides a heat-curable silicone rubber composition having antistatic properties, even after secondary vulcanization at high temperatures. Specifically disclosed is a heat-curable silicone rubber composition which is obtained by adding 0.05 to 1000 ppm of (B) a poorly water-soluble or water-insoluble ionic substance whose anionic component is bis(trifluoromethanesulfonyl)imide, to 100 parts by weight of (A) a heat-curable silicone rubber.

Heat-curable silicone rubber composition

The present invention provides a silica-containing heat curing silicone rubber compound composition which can be produced safely and hardly suffers from inclusion of foreign substances. More specifically, when (A) 100 parts by weight of a polyorganosiloxane base polymer and (B) 1 to 100 parts by weight of a reinforcing silica are mixed together, (C) 0.05 to 80 ppm of an ionic liquid whose anionic component is bis(trifluoromethanesulfonyl)imide is added thereto.

Heat curing silicone rubber compound composition

A silicone rubber sponge composition obtained by compounding a polyorganosiloxane having an average degree of polymerization of 3,000 to 300,000, a reinforcing silica filler, 1,1'-azo-bis(1-acetoxy-1-phenylethane) as a foaming agent, and organic peroxides and/or addition reaction curing agents. The silicone rubber sponge composition can provide a silicone rubber sponge which has a high foaming ratio, has a fine and uniform cell structure, has excellent surface smoothness of the skin layer, does not show a surface tackiness, has a good compression set, and does not require a post cure of a long time.

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Tokyo, Japan

Hiroyoshi Iijima