Seiko Instruments Inc

Sumitomo Cement Co., Ltd.

Seiko Electronic Components Ltd.

Hiroyoshi Hiratsuka

Eiki Arai

Katsuyuki Fujita

Yoshio Katagiri

Shigeaki Ogata

Hiroshi Kihara

Tadahiko Wachigai

Using an organic binder containing at least one water-soluble thermoplastic organic polymer and at least one water-insoluble thermoplastic organic polymer, the water-soluble thermoplastic organic polymer is extracted by debinding treatment in which a plastic molded part such as injection molded part and water are brought into contact with each other to prevent the occurrence of cracks in the molded part. Removal by extraction of the water-soluble thermoplastic polymer reduces the amount of the organic binder contained in the molded part sufficiently, thus preventing the softening and deformation of the molded part at the time of optionally heating and removing the remainder of the organic binder and/or sintering of the molded part and also preventing the occurrence of swelling and cracks by the effect of guide passage formed by the extraction of the organic polymer. Thermal debinding prior to sintering can be eliminated when polyethylene oxide is used as the water-soluble binder, which enables considerable reduction in the time required for debinding.

Process for manufacturing sintered bodies

Growing community of inventors

Sendai, Japan

Hiroyoshi Hiratsuka