Sharp Kabushiki Kaisha Corporation

Hiroyoshi Higashisaka

Tsuyoshi Ono

Toshio Hata

Takashi Ono

Hiroaki Onuma

Katsuji Iguchi

Keiichi Sawai

Yuta Ikawa

Takashi Kurisu

Takanobu Matsuo

Yuhsuke Fujita

Kenichi Murakoshi

Masumi Maegawa

Shigeyuki Akase

A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 &#x3bc;m in a top view.

Semiconductor module, display apparatus, and semiconductor module manufacturing method

A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Semiconductor module, display device, and semiconductor module production method

A semiconductor module includes a base material, an alignment mark provided on a surface of the base material and plural semiconductor elements that are individually provided on the surface of the base material while being juxtaposed to the alignment mark and that are separated from each other. Accordingly, a semiconductor module and a method for manufacturing the semiconductor module are provided which may prevent an alignment mark from being peeled off and remaining as a foreign object and may improve reliability.

Semiconductor module and method for manufacturing same

A light source device includes: a driving circuit; a blue light emitting element made of a group III nitride semiconductor which has a light outgoing surface on a side opposite to a side with the driving circuit, is arranged on the driving circuit, and is electrically connected to the driving circuit; and a color conversion layer which is in contact with the light outgoing surface and converts a wavelength of light emitted from the light outgoing surface. The light outgoing surface is made of a group III nitride semiconductor.

Light source device and light emitting device

Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Bonding equipment

A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.

Location displacement detection method, location displacement detection device, and display device

In a light-emitting element module, at least two or more first electrodes of a first substrate that includes a circuit element are joined to at least two or more light-emitting elements. The first substrate includes a first wiring line to an n-th wiring line (n is an integer of 2 or more) that are formed into layers in order from the at least two or more light-emitting elements in a thickness direction of the first substrate. The first wiring line that is located in one of the layers of the first substrate nearest to the at least two or more light-emitting elements is formed at least in an interelectrode region between the adjacent first electrodes of the first substrate in a plan view.

Growing community of inventors

Sakai, Japan

Hiroyoshi Higashisaka