Opnext Japan, Inc.

Oclaro Japan, Inc.

Hitachi, Ltd.

Lumentum Japan, Inc.

Hiroyasu Sasaki

Takanori Suzuki

Hideo Arimoto

Takashi Suga

Hiroshi Kikuchi

Koichiro Adachi

Naotaka Tanaka

Naoki Matsushima

Kazumi Kawamoto

Hiroaki Inoue

Norio Nakazato

Satoru Isomura

Shigehisa Tanaka

Michihide Sasada

Misuzu Sagawa

Toshiaki Takai

Masanobu Okayasu

Hideko Ando

Kenji Yoshimoto

Koki Iemura

Fujiaki Nose

Mitsuo Akashi

Takashi Kubo

Masanori Fukuhara

Kohichi Robert Tamura

Shigeo Nakamura

Mikio Tokuyama

Makoto Torigoe

Masahito Kobayashi

Kazuhiro Ito

Hiroaki Furuichi

Yasuo Amano

Yuuji Fujita

Osamu Narisawa

Fumitoshi Goto

An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.

Optical device having a substrate and a laser unit that emits light into the substrate

An optical receiver module includes: a lens array including a plurality of condenser lenses arranged in one direction to define a plane with optical axes in parallel to each other; and a light receiving element array including a plurality of light receiving elements each configured to receive light emitted from each of the condenser lenses. The light receiving element array includes: a semiconductor substrate to which the light from each of the condenser lenses is input and through which the light is transmitted; and light receiving portions each configured to receive the light transmitted through the semiconductor substrate and convert the light into an electrical signal. A shift of the optical axis of each of the condenser lenses from a center of each corresponding one of the light receiving portions is larger in a direction perpendicular to the one direction within the plane than in the one direction.

Optical receiver module having a shifted center axis of light receiving element

An optical module includes a semiconductor optical device in which an active layer located at one side, an electrode located at the same side, and a mirror that reflects light toward the side opposite the electrode are monolithically integrated, a sub-mount having one surface on which a first wiring pattern is formed, a substrate in which an optical waveguide and a grating coupler are formed in a surface layer of the substrate, a spacer having an upper surface on which a second wiring pattern is formed, and a wire. The sub-mount is mounted on the spacer. The first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto. The second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

Optical module

High efficiency optical receiver module and optical transmitter module with multiple channels

A laser device capable of preventing deterioration of a light signal and a controlling method therefor are provided. A wavelength tunable laser module provided with a resonator including the wavelength tunable filter and a semiconductor light amplifier having a phase adjustment region and a light amplifying region, in which a wavelength margin between a peak transmission wavelength of a wavelength tunable filter and a mode hop occurring wavelength on a short wave side is smaller than that on a long wave side includes: a wavelength tunable laser module controller including an optical output sampling portion for detecting light intensity of light emitted from the resonator, a dither signal source for generating a dither signal for varying a phase adjustment signal to be applied to the phase adjustment region so that the detected light intensity becomes the maximum, and an FM signal source for generating an FM signal for oscillating the phase adjustment signal to be applied to the phase adjustment region with a period shorter than a variation period of the dither signal. The optical output sampling portion detects the light intensity in synchronization with oscillation of the phase adjustment signal by the FM signal.

Laser device and controlling method therefor

Included are: a gain chip having a gain unit and a phase control region; a current supply for causing a positive current to flow to the phase control region; a voltage supply for applying a bias voltage to the phase control region; and a control unit for selectively driving the current supply or the voltage supply depending on a direction of the wavelength shift. The control unit drives the current supply when a laser wavelength is to be shifted to a shorter wavelength side from a wavelength with the current supply and the voltage supply being turned off, and drives the voltage supply when the laser wavelength is to be shifted to a longer wavelength side from a wavelength with the current supply and the voltage supply being turned off.

Wavelength tunable laser apparatus and wavelength control method

To provide a small-sized and reliable optical module in which a light emitting element and an optical function element respectively remarkably different in a coefficient of thermal expansion are mounted in the same casing, in the invention, the optical function element is mounted on the casing made of first material substantially equal in a coefficient of thermal expansion to the optical function element, a light emitting element unit including the light emitting element (for example, a thermoelectric module over which the light emitting element is mounted) is mounted on a member (base material) made of second material different from the first material and matched with the light emitting element unit in a coefficient of thermal expansion, and the member is, for example, embedded in the bottom of the casing.

The present invention provides a compact, highly reliable optical module in which a light-emitting element and optical modulator element that differ from each other in thermal expansion coefficient are mounted in one casing. In the optical module having a differential thermal expansion coefficient less than 5&#xd7;10[1/K] between the light-emitting element and the casing, and a differential thermal expansion coefficient of at least 5&#xd7;10[1/K] between the optical modulator element and the casing, a section at which the optical modulator element and the casing are fixed is equal to or less than 10 mm wide in the direction of an optical axis.

The present invention provides an optical transmission module comprising: a laser diode; a lens for condensing a laser beam from the laser diode; a fiber ferrule which is placed so that the laser beam condensed by the lens can enter a fiber core; and a lens aperture or a lens aperture portion which is provided at one of the lens itself, a position before the lens and a position after the lens. In addition, the present invention provides an optical transmission module in which instead of the lens aperture, an effective diameter of the lens on the fiber ferrule side is set at a value ranging from 0.1 times to less than 0.2 times of a distance between an emittance plane of the lens and an incidence plane of the fiber ferrule.

Optical transmission module

The present invention relates to an optical transmission module comprising two substrates, each of which has an electronic part mounted on the substrate and a terminal area for inputting/outputting an electric signal into/from the electronic part, wherein an electrical connection is made between the terminal areas of said two substrates by use of a flexible substrate having a structure constituted of at least three layers, and thereby a high frequency signal is transmitted between the electronic part mounted on one substrate and the electronic part mounted on the other substrate through the flexible substrate while confining an electromagnetic field. In addition, the present invention provides an optical transmission module characterized in that a slit formed in a ground plane on a connection section of a three-layer flexible substrate reduces a disturbance in electromagnetic field, making it possible to improve the transmission characteristic of a high frequency signal.

A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Semiconductor device and electronic device

Provided is a magnetic disc apparatus comprising a magnetic head for writing and reading data to and from a magnetic disc, a slider for floating up the magnetic head from the magnetic disc on rotation, a suspension having an IC chip mounting surface, for supporting the slider, a positioning mechanism for positioning a magnetic head at a predetermined position, and an IC chip mounted on the IC chip supporting surface of the suspension, wherein the rate of variation in temperature difference between opposite sides of the IC chip mounting position as a center on the IC chip mounting surface is set to be below about 3.5 K/sec. Thereby it is possible to restrain the averaged seek time for the magnetic disc from becoming longer.

Magnetic disk apparatus

Growing community of inventors

Yokohama, Japan

Hiroyasu Sasaki