Kabushiki Kaisha Toshiba

Toshiba Materials Co., Ltd.

Sony Corporation

Ando Electric Company

Canon Kabushiki Kaisha

Seoul Semiconductor Co., Ltd.

Hiroyasu Kondo

Kazumitsu Morimoto

Ryoji Tsuda

Naoaki Sakurai

Yukihiro Fukuta

Hiroshi Ohno

Yasuhiro Shirakawa

Tsuyoshi Sato

Mitsuaki Kato

Makoto Hayashi

Katsumi Hisano

Hiroshi Koizumi

Tomohiko Inoue

Hiroshi Ichikawa

Ryosuke Hiramatsu

Masami Okamura

Shuichi Kimura

Masahiko Yamakawa

Atsuji Nakagawa

Toshitaka Fujii

Katsuyuki Soeda

Yasumasa Ooya

Kenichi Ooshiro

Yoshitaka Adachi

Hiromichi Hayashihara

Akihisa Saito

Shizuo Kinoshita

Tatsunori Itoga

Junsei Yamabe

Tomoyuki Oozeki

Kenjiro Mori

Takahiro Kawamoto

Daichi Usui

Masahiko Yamakwa

A scintillator array includes: a structure having at least one scintillator segment and a first reflective layer, the at least one scintillator segment and the first reflective layer having a first surface and a second surface, the at least one scintillator segment having a sintered compact containing a rare earth oxysulfide phosphor, and the first reflective layer being configured to reflect light; and a second reflective layer provided above the first surface via an adhesive layer, the adhesive layer having a thickness of 2 μm or more and 40 μm or less, and the second reflective layer having a film configured to reflect light.

Scintillator array, method for manufacturing scintillator array, radiation detector, and radiation inspection device

A scintillator array includes: a structure having scintillator segments and a first reflective layer, the first reflective layer being provided between the scintillator segments and being configured to reflect light, and the scintillator segments having a sintered compact containing a rare earth oxysulfide phosphor; and a layer having a second reflective layer provided above the structure, the second reflective layer being configured to reflect light. The first reflective layer has a portion extending into the layer.

A scintillator array includes: a structure having at least one scintillator segment and a first reflective layer, the at least one scintillator segment and the first reflective layer having a first surface and a second surface, the at least one scintillator segment having a sintered compact containing a rare earth oxysulfide phosphor, and the first reflective layer being configured to reflect light; and a second reflective layer provided above the first surface via an adhesive layer, the adhesive layer having a thickness of 2 &#x3bc;m or more and 40 &#x3bc;m or less, and the second reflective layer having a film configured to reflect light.

A scintillator array includes a first scintillator element, a second scintillator element, and a reflector provided between the first and second scintillator elements and having a width of 80 &#x3bc;m or less therebetween. Each scintillator element includes a polycrystal containing a rare earth oxysulfide phosphor, the polycrystal having a radiation incident surface of 1 mm or less&#xd7;1 mm or less in area. An average crystal grain diameter of the polycrystal is not less than 5 &#x3bc;m nor more than 30 &#x3bc;m, the average crystal grain diameter being defined by an average intercept length of crystal grains in an observation image of the polycrystal with a scanning electron microscope. A maximum length or a maximum diameter of defects on the polycrystal is 40 &#x3bc;m or less.

Scintillator array, method of manufacturing scintillator array, radiation detector, and radiation inspection device

The present invention provides a ceramic circuit board comprising: a ceramic substrate; and at least one of a recess and a through-hole formed in the ceramic substrate, wherein a conductive portion filled with a conductor is provided in the recess or the through-hole, the surface roughness Ra is 1.0 &#x3bc;m or less, and the maximum height Rz is 100 &#x3bc;m or less. It is preferable that the maximum height Rz is 10 &#x3bc;m or less. Further, it is preferable that the surface roughness Ra is 0.5 &#x3bc;m or less. According to the above-described configuration, it is possible to provide a ceramic circuit board having an excellent positionability of the conductive portion for mounting a semiconductor element.

Ceramic circuit board and semiconductor device using the same

A ceramic scintillator array of an embodiment includes: a plurality of scintillator segments each composed of a sintered compact of a rare earth oxysulfide phosphor; and a reflective layer interposed between the scintillator segments adjacent to each other. The reflective layer contains a transparent resin and reflective particles dispersed in the transparent resin. The reflective particles contain titanium oxide and at least one inorganic substance selected from the group consisting of alumina, zirconia, and silica. A glass transition point of the transparent resin is 50&#xb0; C. or higher, and a thermal expansion coefficient of the transparent resin at a temperature higher than the glass transition point is 3.5&#xd7;10/&#xb0; C. or less.

Ceramic scintillator array, method for manufacturing same, radiation detector and radiation inspection device

A light emitting device includes: a first white light source which includes N pieces of first white light emitting diodes and emits a first white light; and a second white light source which includes M pieces of second white light emitting diodes and a first resistance element electrically connected in series to the second white light emitting diodes and having a first resistance value, is electrically connected in parallel to the first white light source, and emits a second white light, the light emitting device emitting a mixed white light of the first white light and the second white light. The drive voltage of the first white light source is higher than a drive voltage of the second white light source, and a color temperature of the mixed white light is higher as a total luminous flux of the mixed white light is higher.

Light emitting device and LED light bulb

A ceramic scintillator array of an embodiment includes: a plurality of scintillator segments each composed of a sintered compact of a rare earth oxysulfide phosphor; a first reflective layer interposed between the scintillator segments adjacent to each other; and a second reflective layer arranged on a side of surfaces, on which an X-ray is incident, of the plurality of scintillator segments. A difference in dimension between an end portion of a surface of the second reflective layer and a most convex portion of the surface of the second reflective layer is 30 &#x3bc;m or less.

Ceramic scintillator array, X-ray detector, and X-ray inspection device

According to one embodiment, a lighting device includes a hollow globe having an opening at an end thereof, a light source housed in the globe and including at least an LED, a pillar portion housed in the globe and supporting the light source, a cap connector directly connected to the pillar portion, or indirectly connected to the pillar portion via another member, and a cap attached to the cap connector and electrically connected to the light source. A thermally conductive layer is provided between the inner surface of the globe and the lateral surface of the pillar portion.

Lighting device

A lighting apparatus according to an embodiment includes a globe, an optical element including a scattering portion inside and transparent to visible light, and a light source disposed to be opposed to a light incident surface of the optical element. The scattering portion is disposed inside the globe.

Lighting apparatus

Light-emitting diode lamp

The present disclosure provides a solid-state image pickup element, including, a pixel portion in which plural pixels each carrying out photoelectric conversion are disposed in a matrix, and a pixel signal reading portion having a function of reading out pixel signals from the pixel portion to signal lines, and sampling reset levels and signal levels of the pixels, wherein the pixel signal reading portion includes column processing units converting analog signals read out into digital signals in correspondence to a column disposition of the pixels, respectively, and each of the column processing units carries out the sampling for the reset level of the pixel plural times, and averages a result of the sampling after the result of the sampling is integrated in a digital integrating circuit within each of the column processing units.

Solid-state image pickup element and camera system

According one embodiment, a film forming apparatus includes a stage, a coating section, a vapor supply section, a blower section, and a controller. On the stage, an coating target is placed. The coating section applies a material to a predetermined region on the coating target placed on the stage to form a coating film. The vapor supply section generates solvent vapor capable of dissolving the coating film. The blower section blows the solvent vapor generated by the vapor supply section onto the coating film on the coating target placed on the stage. The controller controls an amount of the solvent vapor to be blown by the blower section so that: the coating film is dissolved; viscosity in a part of the coating film on a surface layer side is lower than that in a part thereof on the coating target side; and the viscosity in the part on the surface layer side and the viscosity of the coating target side take such values that prevent the coating film on the coating target from spreading.

Film forming apparatus, film forming method, and semiconductor device

Growing community of inventors

Yokohama, Japan

Hiroyasu Kondo