Smc Corporation

Dainippon Screen Mfg. Co., Ltd.

Hiroyasu Goto

Hiroshi Kobayashi

Minobu Matsunaga

Akihiro Hisai

Hiroyuki Sakama

Taro Yamamoto

Masahiro Fukuda

A method and a system for controlling temperature of a liquid in small flow amount, for supplying a liquid whose temperature is highly accurately controlled, as a flow of a small flow amount or an intermittent flow. A liquid supplied from a supply path is pressurized and introduced into a circulation path, and is temperature-controlled by a temperature control device in the circulation path, while being circulated in the circulation path by a pump in the pressurized condition. The liquid is supplied to an exterior device through a discharge path caused to branch from the circulation path, as a consecutive flow in a small amount or an intermittent flow in a small amount in a flow amount less than at least &#xbd; times the flow amount in the circulation path, by adjusting a discharge valve provided in the discharge path.

Temperature regulation method and system for low flow rate liquid

The present invention provides open-circuit detection for detecting an open circuit in parallel-connected thermo modules. Plural rows 10a of plural series-connected thermo modules 11a, . . . 11n are connected in parallel. A detection circuit 12 is provided for each row 10a of modules to detect a change in voltage between a power terminal 17a and an intermediate terminal 18 caused by an open circuit. Switching circuits 20 in the detection circuits 12 are connected in series to an alarm circuit 14, so that if any detection circuit 12 detects an open circuit to preclude the corresponding switching element 20 from conducting, the alarm circuit 14 is activated to cause an alarm 32 to issue an alarm.

Apparatus for detecting open circuits in parallel-wired thermo modules

A substrate thermal processing apparatus easily changes a set temperature at which a substrate is set while thermally processed. A heating plate of the substrate thermal processing apparatus comprises a substrate supporting plate which supports a substrate, an auxiliary heating portion and a main heating portion, and a cooling Peltier element and a water cooling jacket. For heating a substrate, heat which is generated at the main heating portion which comprises a heater portion is transmitted to the substrate supporting plate through the auxiliary heating portion which comprises a Peltier element, so that the substrate is heated up. When the temperature of the substrate supporting plate is to be decreased, the auxiliary heating portion and the cooling Peltier element guide the heat of the substrate supporting plate to the water cooling jacket, and the heat is discharged outside by cooling water.

Apparatus for and method of thermally processing substrate

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Tsukubamirai, Japan

Hiroyasu Goto