Shinkawa Ltd.

Shinikawa Ltd.

Hiroya Yuzawa

Shigeru Hayata

Hiromi Tomiyama

Yuto Hattori

Yusuke Matsuki

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

Bonding apparatus

A bonding apparatushaving a diagonal optical system, the bonding apparatus moves a capillarydown to a first heightwise position to calculate a position A11 of a tip end portion of the capillaryand a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system, and similarly moves the capillarydown to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillaryand a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillaryon a bonding targetbased on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.

Bonding apparatus and method of estimating position of landing point of bonding tool

Provided is a bonding apparatus including a bonding stagefor heating a substrate (lead frame)placed on the upper surface thereof or a semiconductor diemounted on the substrate (lead frame), an imaging devicearranged above the bonding stageto image the substrateplaced on the bonding stageor the semiconductor diemounted on the substrate, and a standing wave generating devicefor generating an ultrasonic standing wave in the space between the upper surface of the bonding stageand the imaging device. This improves the accuracy of image position detection by the imaging device with a simple structure.

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Tokyo, Japan

Hiroya Yuzawa