Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Hirotsugu Tomioka

Yoshifumi Maki

Takuya Ishida

Shinya Hirai

Eiji Iso

Daisuke Katayama

Shinichiro Izumi

Tsuyoshi Kawada

A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.

Method for manufacturing ceramic electronic component, and ceramic electronic component

A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.

Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light

In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.

Electronic component and method of manufacturing same

Growing community of inventors

Nagaokakyo, Japan

Hirotsugu Tomioka