Disco Corporation

Hirotoshi Hoshikawa

Takashi Mori

Shinya Watanabe

Takatoshi Masuda

Setsuo Yamamoto

Keiichi Kajiyama

Shinichi Namioka

Seiji Harada

Masaaki Suzuki

Yoshikazu Kobayashi

Noriko Ito

Masaaki Nagashima

Naoto Takata

Katsubumi Iida

Hidetaka Ochi

Osamu Miura

Shigehiko Aoki

A determining tool for use in determining the shape of the tip end of a machining tool that machines a workpiece held on a table while the machining tool moves relatively to the table includes a bottom surface adapted to be held on the table and a flat slanting surface inclined to the bottom surface and oriented across a direction in which the machining tool moves relatively to the table, the flat slanting surface being adapted to be cut through by the tip end of the machining tool.

Determining tool and shape determining method

A grinding apparatus includes a chuck table that holds a workpiece through a protective tape, where the protective tape is attached to one surface of an annular frame so as to cover an opening of the annular frame and the workpiece is attached to the protective tape on an inner side of an inner circumferential edge of the opening of the annular frame; a grinding unit for grinding the workpiece; and a frame cleaning unit that cleans the other surface located on a side opposite to the one surface of the annular frame obtained after grinding of the workpiece, and wherein the frame cleaning unit has either: (i) a first cleaning member configured and arranged for making contact with the other surface of the annular frame and having flexibility, or (ii) a second cleaning member that jets at least either gas or liquid from above the other surface of the annular frame.

Annular frame cleaning accessory for grinding apparatus

A dressing tool, to be used in dressing a plurality of grindstones arrayed in an annular pattern on one surface side of a grinding wheel, includes a dressing section for dressing the plurality of grindstones, a support plate that is located on a side opposite to a front surface side of the dressing section making contact with the plurality of grindstones and that supports a back surface side of the dressing section, and an RFID tag from and in which information concerning the dressing tool is read and written. One of or both the support plate and the dressing section are provided with a recess, and the RFID tag is disposed in the recess and is fixed by a non-conductive material provided in the recess.

Dressing tool

A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.

Grinding apparatus

A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of each device at about 1,000 MPa or more. The grinding wheel is composed of a frame and an abrasive member fixed to the free end of the frame. The abrasive member is produced by fixing diamond abrasive grains having a grain size of less than or equal to 1 &#x3bc;m with a vitrified bond. A protective member is attached to the front side of the wafer and the wafer is held on a chuck table in the condition where the protective member is in contact with the chuck table. The grinding wheel is rotated as rotating the chuck table to thereby grind the back side of the wafer by means of the abrasive member so that the average surface roughness of the back side of the wafer becomes less than or equal to 0.003 &#x3bc;m and the thickness of a strain layer remaining on the back side of the wafer becomes 0.05 &#x3bc;m.

Grinding method for wafer

Growing community of inventors

Tokyo, Japan

Hirotoshi Hoshikawa