The Furukawa Electric Co., Ltd.

Hirotoki Yokoi

Tomoaki Uchiyama

Yoshifumi Oka

Yukihiro Matsubara

Yusuke Goto

Akira Akutsu

A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 μm, and wherein the adhesive layer has a thickness of 40 μm or more and the storage elastic modulus at 25° C. of 2000 MPa or less.

Semiconductor-processing tape

A mask-integrated surface protective tape, containing:

Mask-integrated surface protective tape

A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order,

Mask-integrated surface protective tape with release liner

A mask-integrated surface protective tape for production of semiconductor chips, with the production containing steps (a) to (d), which tape comprises a base film and a mask material layer provided thereon, wherein a wetting tension of the base film on the side from which the mask material layer has been peeled is from 20.0 mN/m to 48.0 mN/m, and wherein a surface roughness Ra of the base film on the side from which the mask material layer has been peeled is within a range from 0.05 &#x3bc;m to 2.0 &#x3bc;m when measured in conformity to JIS B0601,

A mask-integrated surface protective film, containing:

Mask-integrated surface protective film

A surface side is irradiated with an SFgas plasma to etch a semiconductor wafer which has been peeled off in street portions, and divide the semiconductor wafer into a plurality of individual semiconductor chips. A removing agent is subsequently supplied from the surface side. At that time, it is preferable that the semiconductor wafer divided into the plurality of chips is rotated at high speed. Accordingly, a mask material layer remaining on the surface is removed by the removing agent. Moreover, the removing agent is preferably an organic solvent, and more preferably, methyl ethyl ketone, ethanol, and ethyl acetate, or a combination of these.

Method for producing semiconductor chips

A method of producing a semiconductor chip, including the following steps (a) to (d):

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Tokyo, Japan

Hirotoki Yokoi