Mitsui Chemicals Ict Materia, Inc.

Hiroto Yasui

Hiroyoshi Kurihara

Jin Kinoshita

A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E' (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured, E′ (100° C.) is 1.0×10to 3.5×10Pa, and E′ (100° C.)/E′ (−15° C.) is 2.0×10to 1.5×10.

Back grinding adhesive film and method for manufacturing electronic device

A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E' (5° C.) after curing of 2.0×10to 2.0×10Pa, and a storage elastic modulus at 100° C. E′ (100° C.) of 1.0×10to 3.0×10Pa.

Growing community of inventors

Sodegaura, Japan

Hiroto Yasui