Matsushita Electric Industrial Co., Ltd.

Hiroto Toba

Yukifumi Tsuda

Yuji Maruyama

Kazutoshi Ikegaya

Kunio Sannomiya

Keiji Shintani

Kazuyuki Kobayashi

Yoko Koseki

Toshiro Obi

Kouji Ohura

Takeshi Masaki

Koichi Kawata

Katsumasa Yamaguchi

Nobuhiro Araki

Yukuo Sakagaito

Hiromichi Kinoshiro

Kunjo Sannomiya

Takumi Seto

A three-dimensional resolution chart is used to adjust the position of a solid-state image detector 4 in a given image-forming optical system. A plurality of blocks 10a are provided on an upper surface of a resolution chart 10. Each block 10a has an adjusting pattern A-D depicted on a slant surface thereof. An image of each adjusting pattern A-D is formed on the solid-state image detector 4 through a master lens 2. The contrast integration value F is calculated based on the image of the adjusting pattern at each of a plurality of designated areas hj (j=1 - - - n) on the slant surface of each block 10a provided on the resolution chart 10, to find out a specific position on each block where the contrast integration value F becomes maximum, thereby identifying the specific position as focus point of the master lens 2. The back focus of the solid-state image detector 4 is calculated based on thus obtained focus point. An optimum gradient (.alpha., .beta.) of the solid-state image detector 4 is calculated based on a three-dimensional relationship between plural focus points of the master lens 2 detected on the plural blocks 10a. Finally, each positioning mechanism 11 adjusts each solid-state image detector 4 to the calculated optimum position or at the optimum gradient.

Method for adjusting a position of a solid-state image detector in a

A three-dimensional resolution chart is used to adjust the position of a solid-state image detector 4 in a given image-forming optical system. A plurality of blocks 10a are provided on an upper surface of a resolution chart 10. Each block 10a has an adjusting pattern A-D depicted on a slant surface thereof. An image of each adjusting pattern A-D is formed-on the solid-state image detector 4 through a master lens 2. The contrast integration value F is calculated based on the image of the adjusting pattern at each of a plurality of designated areas hj (j=1 - - - n) on the slant surface of each block 10a provided on the resolution chart 10, to find out a specific position on each block where the contrast integration value F becomes maximum, thereby identifying the specific position as focus point of the master lens 2. The back focus of the solid-state image detector 4 is calculated based on thus obtained focus point. An optimum gradient (.alpha., .beta.) of the solid-state image detector 4 is calculated based on three-dimensional relationship between plural focus points of the master lens 2 detected on the plural blocks 10a. Finally, each positioning mechanism 11 adjusts each solid-state image detector 4 to the calculated optimum position or at the optimum gradient.

A system for inspecting a condition of parts packaged on a printed-circuit board. The inspection system includes a position detecting device to receive scattered light due to illumination of the printed-circuit board with a laser beam and convert the received scattered light into a position signal. This position signal is used for obtaining luminance data and at least two height data of the parts on the printed-circuit board. Proper height data of the parts is determined on the basis of the difference between the two height data. The inspection system determines the package condition by comparing the final height data with a predetermined reference data.

System for optically inspecting conditions of parts packaged on substrate

A beam of light is applied to a surface of a circuit board provided with at least one solder portion. The light beam scans the surface of the circuit board. Height data are derived from a portion of the light beam which is scattered at the surface of the circuit board. The height data represent a height of a currently-scanned point of the surface of the circuit board. The height data are accumulatively added for the solder portion. A variation in the height data is calculated. The accumulative addition of the height data is executed and suspended in response to the calculated variation in the height data. A decision is made as to whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulative addition.

Apparatus for inspecting solder portion of a circuit board

A printed-circuit board inspection apparatus for checking the condition of each circuit component mounted by soldering on a printed-circuit board is disclosed in which a luminance signal obtained from the reflected light scattering from the printed-circuit board being illuminated is converted through a given threshold level to binary signals, then the binary signals and mask data are processed to calculate the ratio of an area represented by the number of binary '1' signals to an area represented by the number of binary '0' signals, and the soldering condition of the component is judged based on the area ratio. With this arrangement, the inspection is not negatively influenced by the misalignment of the component with a mating soldering land, is capable of judging the amount of solder, and can be performed automatically and efficiently. The binary signals may be converted into code data by assigning a code '1' or '0' to each of a plurality of split masks set on each soldering land, depending on the largeness of the area in which the number of binary '1' signals '1' is larger than the number of binary '0' signals or vice versa. In this case, the judgment of the soldering condition is made by comparing the code data with code patterns contained in a predetermined code table.

Electro-optical inspection apparatus for printed-circuit boards with

A linescan apparatus for detecting salient pattern on a surface of a product comprises: a laser light source for continuously emitting a laser beam; a polygon mirror for reflecting the laser beam; a drive for rotating the polygon mirror to scan said laser beam; an f.theta. lens arranged such that the linescan laser beam strikes against the plane perpendicularly; a carrying device for moving the product in the direction substantially perpendicular to the plane; a mirror for reflecting the linescan laser beam reflected at a surface of the product to direct the linescan laser beam to the polygon mirror through the f.theta. lens, the mirror being positioned apart from the second plane; and a beam position detector for detecting unidimensional position of a spot mede by the linescan laser beam projected thereon from the mirror via the polygon mirror. This linescan apparatus provides three-dimensional data of a surface of the product. The detected position signal is compared by reference data for inspecting the product. An linescan apparatus further comprises second beam position detector and an averaging circuit for averaging outputs from first mentioned and second beam detectors.

Linescan apparatus for detecting salient pattern of a product

Processing of plural works can be made simultaneously by using divided laser beams which is issued from one large Co.sub.2 laser beam source, the dividing being made by one or more rotary chopper mirror(s) comprising reflecting parts and light passing parts, and its ration and pulsive start and stop of laser oscillation are controlled in interrelated manner and by controlling the duty time of the laser oscillation in PWM manner. The distribution of powers of the laser beams divided by the rotary chopper mirrors is desirably selectable, thereby enabling simultaneous processing of plural works under the different processing conditions.

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Yokohama, Japan

Hiroto Toba