Nichia Corporation

Other

Futaba Corporation

Laser Systems Inc.

Hiroto Tamaki

Takuya Nakabayashi

Masatoshi Kameshima

Suguru Takashima

Tomohide Miki

Takahiro Naitou

Yoshinori Murazaki

Shinji Nishijima

Tadao Hayashi

Yuichiro Tanda

Takeshi Ikegami

Yoichi Bando

Junji Takeichi

Masato Fujitomo

Suguru Beppu

Yoshitaka Bando

Shoji Hosokawa

Tomohisa Kishimoto

Shinpei Kinoshita

Motokazu Yamada

Tadaaki Miyata

Ryohei Yamashita

Ryoma Suenaga

Yukitoshi Marutani

Yuta Oka

Yoshiki Sato

Kunihiro Izuno

Kazuhiko Sakai

Shinsuke Sofue

Masafumi Kuramoto

Yoshitaka Sato

Masaki Hayashi

Shinichi Nagahama

Tadaaki Ikeda

Daisuke Oyamatsu

Takafumi Sugiyama

Yukihiro Hayashi

Takayoshi Wakaki

Atsutomo Hama

Takao Kosugi

Takayuki Sano

Tomotaka Honda

Masatsugu Ichikawa

Daisuke Iwakura

Takashi Murayama

Masakazu Sakamoto

Eiko Minato

Takayuki Shinohara

Shoichi Yamada

Masato Aihara

Yasunori Shimizu

Takahiro Tani

Masayuki Hayashida

Morito Kanada

Tadashi Maruta

Kock Khuen Seet

Masahito Fujitomo

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

Manufacturing method of processed resin substrate and laser processing apparatus

A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.

Light emitting device

A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Optical-semiconductor device including a wavelength converting member and method for manufacturing the same

A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.

Light emitting device with protected fluorescent substance

A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

A light emitting device including a light emitting element including an element substrate and semiconductor layers formed thereon, an encapsulating member that covers the sides of the light emitting element and forms a cavity at the upper surface of the light emitting element, and a wavelength-conversion layer in the cavity. The wavelength-conversion layer being capable of converting that converts the wavelength of light emitted by the light emitting element. The wavelength-conversion layer includes a first wavelength-conversion sub layer which is disposed at the upper surface of the light emitting element, and a second wavelength-conversion sub layer which is disposed on the first wavelength-conversion sub layer. The first wavelength-conversion sub layer includes first phosphors having a first resistance to environmental exposure, and the second wavelength-conversion sub layer includes second phosphors having a second resistance which is higher than that of the first wavelength-conversion sub layer.

Light emitting device and method of manufacturing the same

A light emitting device includes first and second light emitting elements, first and second color conversion material layers, a support member and a light reflective member. The first color conversion material layer has a first color conversion surface facing a first light extraction surface of the first light emitting element. The second color conversion material layer has a second color conversion surface facing a second light extraction surface of the second light emitting element. The support member supports the first and second color conversion material layers. The light reflective member covers a first side surface of the first light emitting element and a second side surface of the second light emitting element. At least a part of an upper surface of the light reflective member is positioned closer to the support member than the first color conversion material layer and the second color conversion material layer.

A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member, and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface is exposed. The second light reflecting member surrounds an outer periphery of the light emitting element, and is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member includes a wavelength conversion substance, and is disposed inside the second light reflecting member and positioned higher than a lower surface of the light emitting element. The sealing member covers the second light reflecting member and the light transmissive member. An outer edge of the sealing member coincides with an outer edge of the mounting board.

A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Light emitting device and method for producing the same

A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. The second light reflecting member surrounds an outer periphery of the light emitting element in a plan view. The second light reflecting member is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member is disposed inside the second light reflecting member. The light transmissive member includes a wavelength conversion substance. The sealing member covers the first and second light reflecting members and the light transmissive member.

A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.

Method for manufacturing light emitting device including light emitting element and color conversion material layer

A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within &#xb1;10 ppm/&#xb0; C. of a linear expansion coefficient of the light emitting element.

Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same

Growing community of inventors

Anan, Japan

Hiroto Tamaki