Ube Industries, Inc.

Ube Nitto Kasei Co., Ltd.

Hiroto Shimokawa

Hiroaki Yamaguchi

Takeshi Uekido

Ken Kawagishi

Tomohiko Yamamoto

Masami Sasaki

Atsushi Okabe

Takuro Kochiyama

Jun Takagi

Naoyuki Matsumoto

Yoshitaka Mineki

A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.

Polyimide-metal laminate and solar cell

Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25&#xb0; C. to 500&#xb0; C. within a range of from &#x2212;0.3% to +0.6% based on the initial dimension at 25&#xb0; C. The polyimide film may be used as a substrate for a CIS solar cell.

Aromatic polyimide film, laminate and solar cell

A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm&#xd7;26 mm.

Method for producing flexible metal laminate

The present invention relates to a metal foil laminated polyimide resin substrate wherein

Metal foil laminated polyimide resin substrate

A metal-plated aromatic polyimide film composed of an aromatic polyimide resin film, a surface layer of which contains a dispersed palladium metal or a palladium compound, and a metal layer which is chemically plated on the surface layer of the polyimide resin film. The surface layer is preferably formed by placing a palladium compound on a self-supporting aromatic polyimide precursor film and heating the self-supporting film having the palladium compound on its surface layer to a temperature at which the polyimide precursor is converted into its corresponding aromatic polyimide.

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Ube, Japan

Hiroto Shimokawa