Dowa Metaltech Co., Ltd.

Yazaki Corporation

Dowa Holdings Co., Ltd.

Dowa Thermotech Co., Ltd.

The Goodsystem Corporation

Thegoodsystem Corp.

Hiroto Narieda

Akira Sugawara

Tomotsugu Aoyama

Yuta Sonoda

Hirotaka Kotani

Hisashi Suda

Weilin Gao

Yukiya Kato

Akifumi Onodera

Tatsuhiro Doi

Takao Tomiya

Hideki Endo

Masatoshi Nakamura

Takanobu Sugimoto

Tsuyoshi Ito

Kazuki Yoshida

Yuya Kishibata

Takaya Kondo

Jyun Toyoizumi

Naota Higami

Kuniaki Miyagi

Takashi Suga

Hirotaka Takahashi

Tatsunori Murata

Yoshitaka Ito

Young-suk Kim

Meoung-whan Cho

Il-ho Kim

Seog-woo Lee

Ilho Kim

Akira Sigawara

Masaaki Izaki

Meoung Whan Cho

Hisahi Suda

A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.

Composite material, method for producing composite material, and terminal

There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

Copper alloy plate and method for producing same

There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

Composite plating material and method for producing the same

There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.

Composite plated product and method for producing same

There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers, which has a metal filmof a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal filmto contact the Cu-graphite layer, the layers are heated while a pressure is applied between the Cu-graphite layerand the Mo—Cu layers

Clad material and method for producing same

There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.0% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, wherein the total of the content of silicon and six times as much as the content of phosphorus is 1% by weight or more and wherein the copper alloy plate has a crystal orientation satisfying I{220}/I{420}&#x2264;2.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

An inexpensive sheet material of a copper alloy has excellent bending workability and excellent stress corrosion cracking resistance while maintaining high strength. The sheet material is produced by a method including melting and casting raw materials of a copper alloy which has a chemical composition having 17 to 32 wt. % of zinc, 0.1 to 4.5 wt. % of tin, 0.01 to 2.0 wt. % of silicon, 0.01 to 5.0 wt. % of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy at 900&#xb0; C. to 400&#xb0; C.; cooling the hot-rolled copper alloy at 1 to 15&#xb0; C./min. from 400&#xb0; C. to 300&#xb0; C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at 300 to 800&#xb0; C.; and then, ageing-annealing the recrystallization-annealed copper alloy at 300 to 600&#xb0; C.

Sheet matertal of copper alloy and method for producing same

A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.

Heat sink plate

There are provided a composite plated product, which has little uneven appearance, a low contact resistance and good wear resistance, and a method for producing the same without the need of any silver-plating solutions containing cyanides and any silver-plating solutions containing silver nitrate as a silver salt. After carbon particles are caused to be suspended in water, an oxidizing agent is added thereto for carrying out a wet oxidation treatment of the carbon particles, and a silver-plating solution, which contains at least one sulfonic acid and the carbon particles treated by the wet oxidation treatment, is used for electroplating a base material to form a coating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.

There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.

A tin-plated product contains: a substrateof copper or a copper alloy; an underlying layerof nickel which is formed on the surface of the substrate; and an outermost layercontaining tin, the outermost layerbeing formed on the surface of the underlying layer, the outermost layerbeing composed of a copper-tin alloy layerof a large number of crystal grains of a copper-tin alloy, tin layersof tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layersof a copper-nickel-tin alloy, each of the tin layersbeing formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layersbeing arranged on the side of the underlying layerin the copper-tin alloy layerso as to be apart from each other.

Tin-plated product and method for producing same

After drying the surface of a tin plating layer having a thickness of 0.4 to 3 &#x3bc;m which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dmin a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

There are provided a tin-plated product which has a zinc plating layer on the surface thereof and which has good corrosion resistance and good adhesion of the zinc plating even if the connecting portion of a terminal of the tin-plated product to an electric wire of aluminum or an aluminum alloy is not processed during press fitting such as swaging (or caulking) when the tin-plated product is used as the material of the terminal which is to be connected to the electric wire by press fitting, and a method for producing the same.

A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P&#x2014;Fe/3.6)0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) ' 100 is 50% or more. The density of an Fe&#x2014;P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mmor less, and the density of an Mg&#x2014;P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mmor less. The Cu&#x2014;Fe&#x2014;P&#x2014;Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.

Copper alloy sheet material and current-carrying component

A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NOf fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mmor more and a ratio N/Nof a number density N(per 0.012 mm) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the Nof 0.50 or less.

Growing community of inventors

Tokyo, Japan

Hiroto Narieda