Shin-etsu Polymer Co., Ltd.

Futaba Denshi Kogyo K.k.

Saitama University

Hiroto Komatsu

Yusuke Kobayashi

Tsutomu Ogino

Takashi Kawamura

Koji Nishizawa

Toshiyuki Kawaguchi

Hideki Suzuki

Junichi Ikeno

Kouichi Yamazaki

Kazuhiko Tojo

Tomohiro Nozaki

Satoshi Shimada

Kenji Fujino

Shoji Yamazaki

Sumitaka Araki

Atsuko Tanaka

Yousuke Kunishi

Tatsuya Yoshino

A transparent electrode capacitance sensor includes a transparent resin substrate; at least one transparent electrode formed on the transparent resin substrate; a pseudo auxiliary electrode formed in at least a portion of an outer periphery of the transparent electrode; and a lead wire connected to the pseudo auxiliary electrode, wherein the pseudo auxiliary electrode is thicker than the transparent electrode, and includes the same material as the transparent electrode.

Transparent electrode capacitance sensor and process for manufacturing the same

A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.

Capacitive sensor sheet producing method and capacitive sensor sheet

A production method of a capacitive sensor sheet, comprising: a film forming step forming of a optically-transparent electroconductive filmon the surface of a substratehaving optical transparency; a supplemental electrode forming step of setting an electrode regionwhich functions as the transparent electrodeat least in part of the film, and laminating a supplemental electrodewhich has a lower electrical resistance than the electrical resistance of the filmto cover at least part of a periphery of the electrode region; a wire forming step of laminating a wirein which one end thereof is connected to the supplemental electrodeon the film; a resist laminating step of laminating a resistto cover all of the electrode regionand at least part of the supplemental electrode; and a conductive film removing step of removing a part of the filmformed on the substratehaving optical transparency placed at a position not overlapping with the resist, the supplemental electrode, or the wire

Capacitive sensor sheet and production method thereof

A member for an electrostatic capacitance-type sensor which suppresses a decrease in the variation amount of the electrostatic capacitance caused between an input body and the electrode through a proximate operation or a touch operation by the input body and has a metallic luster appearance which does not degrade with time, and is economical, and an electrostatic capacitance-type sensor using the same. The disclosed member includes a sheet member having an operation surface S on which a proximate operation or a touch operation by an input body is carried out and an electrode which is disposed on the opposite side of the operation surface of the sheet member, in which the sheet member includes a decorative layer having a metallic luster, and the decorative layer is a continuous film made of silicon or an alloy of silicon and a metal.

Member for electrostatic capacitance-type sensor and electrostatic capacitance-type sensor using the same

In a capacitive input switch that is accommodated in a housing of electronic equipment, the capacitive input switch includes a rigidity imparting layer having rigidity and a laminate sheet laminated on the rigidity imparting layer. The rigidity imparting layer and the laminate sheet are three dimensionally formed. The laminate sheet is formed by a substrate sheet, a conductive pattern layer for capacitor formation, and a decorative layer that is laminated at least on any one of the substrate sheet and the conductive pattern layer. A separate conductor is caused to contact with the conductive pattern layer and the conductive pattern layer is caused to be electrically connected to an external electric circuit by the conductor.

Capacitive input switch

A transparent conductive film () including a transparent base material () having insulation properties; and a mesh member made of a conductive metal and provided in the transparent base material (), wherein the transparent base material () is provided with a conductive portion in which the mesh member is arranged, and an insulating portion (I) in which a gap () formed by removing the mesh member is arranged.

Transparent conductive film and conductive substrate using the same

Proposed is a novel connector for display inspection of a liquid crystal display panel, by which the display panel per se can be inspected before mounting of a driver IC chip thereon to greatly improve the productivity of the display inspection. The inventive display inspection connector comprises:

Connector for display inspection of a liquid crystal display panel and

A display panel which can reduce the number of external terminals for a fluorescent display tube and has its simplified assembled structure difficult to cause conduction failure. The base substrate of the container for a fluorescent display tube protrudes partially outward. Conductors electrically connected to the electrodes inside the container are derived out from the container to electrically connect to the external electrodes on the substrate. Connection terminals are formed on the substrate. The conductive rubber connector includes a non-conductive portion 39 with a nearly L-shaped cross section in which plural conductive fine wires bent in a nearly U-shaped form are buried at predetermined intervals. The fluorescent display tube is mounted on the upper surface of the printed board. The conductive rubber connector is placed at a predetermined position. The fluorescent display tube and the conductive rubber connector are fixed by means of a fixture. The external terminals of the fluorescent display tube is electrically connected to the connection terminals of the printed board via the conductive rubber connector.

Display device having angled connector

A socket for the inspection of semiconductor devices is disclosed which has laterally extended leads. The device is mounted in a mounting seat of the socket body and results in improvement of the inspection process because difficult steps such as soldering can be omitted. The socket is composed of a socket body which is mountable on a circuit board having a mounting seat therefor, a lead frame intervening between the socket body and the circuit board and an anisotropically electroconductive elastic connector sheet.

Socket for inspection of semiconductor device

Proposed is a novel wiring circuit board for mounting of a semiconductor chip suitable for free mounting and demounting thereof. The wiring circuit board comprises: an insulating base plate provided with electrodes on one surface and having an opening for insertion of the semiconductor chip; bonding wires each connected to one of the electrodes at one end, with the other end appearing in the opening at a position just to come into contact with the electrode of a semiconductor chip inserted into the opening; and a resinous encapsulating layer covering the opening and embedding the bonding wires. A method for the preparation of this wiring circuit board is also disclosed in which accurate positioning of the ends of the bonding wires appearing in the opening of the base plate is accomplished by using a dummy chip provided with etching-resistant false electrodes and inserted into the opening followed by subsequent removal by etching after completion of the bonding work of the bonding wires.

Method for the preparation of a wiring circuit board for mounting of a

A liquid crystal display panel inspection device capable of reducing a manufacturing cost and significantly reducing intervals or pitches between connection wires and a method for manufacturing the same. The device includes a panel holder formed with a mounting hole in which a liquid crystal display panel is mounted and electrodes arranged around the mounting hole on one surface of the panel holder. Also, it includes connection wires of a dog-legged shape each connected at one end thereof to one of the electrodes of the panel holder and arranged so as to extend into the mounting hole. The connection wires are each formed at the other end thereof with a terminal, which is rendered abuttable against one of the electrodes of the liquid crystal display panel. The panel holder is mounted on the other surface thereof with a holding plate for selectively closing the mounting hole. The holding plate functions to pressedly contact the electrodes of the liquid crystal display panel and the terminals of the connection wires with each other.

Growing community of inventors

Saitama, Japan

Hiroto Komatsu