Tokuyama Corporation

Dowa Metaltech Co., Ltd.

Hiroto Aoki

Hideyo Osanai

Yukihiro Kanechika

Yukihiro Kitamura

Yasuko Takeda

Ken Sugawara

After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrateof aluminum nitride sintered body so that the ceramic substratehas a residual stress of not higher than &#x2212;50 MPa and so that the surface of the ceramic substrateto be bonded to the metal platehas an arithmetic average roughness Ra of 0.15 to 0.30 &#x3bc;m, a ten-point average roughness Rz of 0.7 to 1.1 &#x3bc;m and a maximum height Ry of 0.9 to 1.7 &#x3bc;m while causing the ceramic substrate to have a flexural strength of not higher than 500 MPa and causing the thickness of a residual stress layerformed along the surface of the ceramic substrateto be 25 &#x3bc;m or less, the metal plateof copper or a copper alloy is bonded to the ceramic substrate, which is obtained by the wet blasting treatment, via a brazing filler metalto produce a metal/ceramic bonding substrate which has an excellent bonding strength of the ceramic substrateto the metal plateand which has an excellent heat cycle resistance.

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Yamaguchi, Japan

Hiroto Aoki