Rohm Co., Ltd.

Hirotaka Takihara

Toshiyuki Ishikawa

Daiki Yanagishima

Makoto Ikenaga

Akio Sasabe

Shintaro Takahashi

A semiconductor integrated circuit includes first to fourth transistor arrangement regions. A portion of the third transistor arrangement region is located on a second side in a first direction of the second transistor arrangement region. A portion of the first transistor arrangement region connected to the second transistor arrangement region is sandwiched in the first direction by the second transistor arrangement region and the portion of the third transistor arrangement region. The portion of the first transistor arrangement region is located on a first side in the first direction of the fourth transistor arrangement region. The portion of the third transistor arrangement region connected to the fourth transistor arrangement region is sandwiched in the first direction by the fourth transistor arrangement region and the portion of the first transistor arrangement region.

Semiconductor integrated circuit, motor driver, and motor drive system

A signal transmission device includes a signal transmission chip, and a first lead frame supporting the signal transmission chip. A first inductor spiral ring is on a surface of the signal transmission chip, a second inductor spiral ring is inside the signal transmission chip, a first bonding pad is electrically coupled between the first and second inductor spiral rings, a guard ring covers the first and second inductor spiral rings in a plan view, and bonding pads are outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other. The signal transmission device further includes a semiconductor chip and a second lead frame supporting the semiconductor chip, wherein the signal transmission chip and the semiconductor chip face each other.

Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device

A signal transmission device includes a first lead frame supporting a signal transmission chip that includes first and second inductor spiral rings, a first bonding pad electrically coupled between the first and second inductor spiral rings, and a guard ring provided to roundly cover the first and second inductor spiral rings in a plan view. Bonding pads are provided outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other so that the first and second inductor spiral rings are disposed substantially symmetrically about the first bonding pad. A second lead frame supports a semiconductor chip, with the signal transmission chip and the semiconductor chip facing each other.

Disclosed is a signal transmission circuit device () including a feedback signal transmission unit () that feeds back a control output signal (Sout) as a feedback signal (Sf) to an input side circuit (A). A logical comparison circuit () detects 'mismatch' between input and output by performing logical comparison between a control input signal (Sin) and the feedback signal (Sf). When a state of 'mismatch' between input and output occurs, a first pulse generating circuit () or a second pulse generating circuit () outputs a first correction signal (Sa) or a second correction signal (Sa) corresponding to a potential (high level or low level) of the control input signal (Sin), and corrects the control output signal (Sout) to the same potential (high level or low level) as the control input signal (Sin). With such configuration, the mismatch between input and output can be automatically corrected.

A temperature detecting apparatus includes a temperature detecting circuit configured to output a first pulse signal according to a temperature detected by a temperature sensor, and an insulating transformer configured to transmit the first pulse signal to an integrated circuit which is operated by an operation voltage different from that of the temperature detecting circuit. The insulating transformer is installed between the temperature detecting circuit and the integrated circuit. The temperature detecting circuit and the insulating transformer are mounted on a common substrate.

Temperature detecting circuit and temperature detecting apparatus using the same

A signal-transferring device having a first circuit and a second circuit that operate on different ground references, and a third circuit for transferring signals while providing insulation between the first circuit and the second circuit. The second circuit switches a logic level of an output signal in accordance with the logic level of an input signal notified by the first circuit, and notifies the first circuit about the logic level of the output signal. The first circuit notifies the second circuit about the logic level of the input signal not only when the logic level of the input signal has been switched, but also when the logic level of the output signal notified by the second circuit does not match the logic level of the input signal.

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Kyoto, Japan

Hirotaka Takihara