Kabushiki Kaisha Toyota Chuo Kenkyusho

Other

Toyota Jidosha Kabushiki Kaisha

Toyota Boshoku Kabushiki Kaisha

Adeka Corporation

Towa Corporation

Toyoda Gosei Co., Ltd.

Hirotaka Okamoto

Arimitsu Usuki

Makoto Mouri

Makoto Kato

Norio Sato

Mitsumasa Matsushita

Mitsuru Nakano

Katsumi Nakashima

Hidenobu Honda

Masao Owaki

Naoki Hasegawa

Osamu Watanabe

Yasuyuki Suzuki

Hisashi Okuyama

Toru Yoshida

Takeshi Kanamori

Masayuki Kito

Kenzo Fukumori

Katsumasa Takeuchi

Tamotsu Watanabe

Jumpei Kawada

Makoto Ouchi

Noriyuki Suzuki

Toshiyuki Ario

Naomi Okuyama, Legal Representative

Masahito Fukuta

Hitoshi Saito

Shoji Yamamoto

Akane Okada

Hiromitsu Tanaka

Masaya Kawasumi

Michio Osada

Hisato Takeuchi

Takayuki Nagai

Etsuo Tobita

Naoshi Kawamoto

Shinji Takase

Tsuyoshi Urushihara

Toshio Watanabe

Takaki Kuno

Yuji Kageyama

Hiroshi Urayama

Seiji Yamashita

Shigeki Otsuka

Kazuhiko Umemoto

Yuji Kaneko

Yoshihide Katagiri

Yasumitsu Isobe

Shuxin Dong

Kenichi Hayashida

Masami Okamoto

Takashi Inou

Kouichi Araki

Teikou Odashima

Takeshi Uyama

Yusuke Yagi

An object is to provide a metal-resin bonded member that is easy to manufacture and has high bonding strength. The metal-resin bonded member includes a metal body having an iron oxide layer on the surface and a resin body bonded to the metal body via the iron oxide layer. The iron oxide layer has a thickness of 50 nm to 10 &#x3bc;m. The iron oxide layer comprises 60-40 at % Fe and 40-60 at % O at the outermost surface side. The iron oxide layer contains magnetite (FeO). The iron oxide layer is formed by heating the surface of an iron-based substrate at 200-850&#xb0; C. in an oxidation atmosphere. The resin body is composed of polyphenylene sulfide (PPS). The bonding of the metal body and the resin body via the iron oxide layer can be carried out by insert molding, thermal adhesion utilizing friction heating, etc.

Metal-resin bonded member and method of manufacturing the same

The purpose of the present invention is to provide: a thermoplastic resin composition which exhibits excellent rigidity, while having excellent impact strength characteristics; and a method for producing the thermoplastic resin composition. This thermoplastic resin composition, wherein a polyolefin resin contains a polyamide resin that is dispersed therein, is characterized in that: the thermoplastic resin composition is obtained by melting and kneading a polyolefin resin and a mixed resin that is obtained by melting and kneading a polyamide resin and a compatibilizer; and the compatibilizer is a modified elastomer that is obtained by providing an elastomer (such as an olefin-based thermoplastic elastomer or a styrene-based thermoplastic elastomer) with a reactive group that is reactive with the polyamide resin. The present invention also relates to a thermoplastic resin composition which is obtained by melting and kneading from 1% by mass to 80% by mass (inclusive) of a plant-derived polyamide resin such as polyamide 11, from 5% by mass to 75% by mass (inclusive) of a polyolefin resin and from 1% by mass to 30% by mass (inclusive) of a compatibilizer that is an olefin-based thermoplastic elastomer that is modified with an acid.

Thermoplastic resin composition, method for producing same, and molded body

A resin composite material includes: fine graphite particles including plate-like graphite particles, an aromatic vinyl copolymer which is adsorbed on the plate-like graphite particles, and which contains a vinyl aromatic monomer unit represented by the following formula (1):&#x2014;(CH&#x2014;CHX)&#x2014;&#x2003;&#x2003;(1)

Resin composite material

A thermoplastic resin composition contains a polyamide resin that is dispersed therein, is characterized in that the thermoplastic resin composition is obtained by melting and kneading a polyolefin resin and a mixed resin obtained by melting and kneading a polyamide resin and a compatibilizer; and the compatibilizer is a modified elastomer that is obtained by providing an elastomer (such as an olefin-based thermoplastic elastomer or a styrene-based thermoplastic elastomer) with a reactive group that is reactive with the polyamide resin. Also, a thermoplastic resin composition is obtained by melting and kneading from 1% by mass to 80% by mass (inclusive) of a plant-derived polyamide resin such as polyamide 11, from 5% by mass to 75% by mass (inclusive) of a polyolefin resin and from 1% by mass to 30% by mass (inclusive) of a compatibilizer that is an olefin-based thermoplastic elastomer that is modified with an acid.

A polylactic acid resin composition in which polylactic acid is blended with dibasic acid bis(benzoylhydrazide) represented by general formula (I) below; and a process for producing heat-resistant polylactic acid resin moldings, wherein after the polylactic acid resin composition is melted, the polylactic acid resin composition melted is filled in a die of a molding machine and molded accompanied with crystallization, in which the temperature of the die has been set in a range not higher than the initiation temperature of crystallization and not lower than the glass transition temperature determined with a differential scanning calorimeter (DSC). (In the formula, R represents a alkylene, alkenylene, cycloalkylene, alkylene having an ether bond, or alkylene interrupted with a cycloalkylene, the groups each having 1 to 12 carbon atoms; and R, R, R, and Reach represent a hydrogen atom, halogen atom, alkyl, cycloalkyl, aryl, aralkyl, or alkylaryl, the groups each having 1 to 12 carbon atoms, or Rand Rand/or Rand Rbond to each other to form a five- to eight-membered ring.)

Polylactic acid resin composition, moldings, and process for production thereof

This invention provides a polylactic acid resin composition in which stereocomplex crystals of poly-L-lactic acid and poly-D-lactic acid can be selectively crystallized to obtain polylactic acid having a sufficiently high speed of crystallization and a sufficiently high ratio of stereocomplex crystal and a molded article thereof obtained via melt molding and crystallization of the same. Such polylactic acid resin composition comprises polylactic acid capable of generating stereocomplex crystallization and an aromatic urea compound represented by formula (1): wherein Rrepresents an alkylene group having 1 to 10 carbon atoms; Rrepresents an alkyl group having 1 to 25 carbon atoms; and m is an integer between 1 to 6.

Polylactic acid resin and composition and molded article of the same

A polylactic acid composition containing polylactic acid and ester-based plasticizer, wherein a content of the ester-based plasticizer is 16 to 33 wt %, and when the composition is highly deformed by stress loading as the relation between the stress and the deformation deviates from linear viscoelastic behavior and thereafter the stress is released, residual deformation measured after the stress is released is not less than 66.0% after 0.2 minute of the stress release, and is not more than 34.0% after 240 hours of the stress release.

Polylactic acid composition

The polylactic acid composite material of the present invention comprises a polylactic acid, a low molecular weight compound which has an amide group, and a layered clay mineral that is organically modified by means of an organic onium salt. As a result, a polylactic acid composite material that has a sufficiently rapid crystallization rate, and that is superior in terms of heat resistance, moldability and mold release characteristics can be obtained.

Polylactic acid composite material and molded body

Process for producing polymer/filler composite material

Method of reclaiming crosslinked rubber, and molded article of reclaimed rubber

Method of reclaiming crosslinked rubber

Polymeric composites may be produced by a process comprising melt-kneading an organophilic clay and a polymer at an average reduced pressure of at 5&times;10 Pa, a maximum reduced pressure of at least 1&times;10 Pa, and a total shear strain between 10 and 10 , and/or a total shear energy per unit volume falling between 10 and 10 Pa. Polymeric composites produced under these conditions may have 50% or more of the entire layers of the layered organophilic clay dispersed as monolayers.

Polymer composite material and process for preparing the same

A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.

Electronic component, method of sealing electronic component with resin, and apparatus therefor

A resin sealing method for sealing a gap between a substrate and a semiconductor chip mounted thereon includes the following steps: applying a predetermined amount of resin at and along the circumference of the semiconductor chip in such a manner so as to maintain a space between the resin and a side face of the semiconductor chip; reducing the pressure of the atmosphere around the substrate to exhaust air from the gap; reducing the viscosity of the applied resin to partially fill the gap with resin, thereby leaving a closed cavity reduced in pressure; pressurizing the atmosphere around the substrate to compress the closed cavity due to the pressure difference from the surrounding atmosphere to entirely fill the gap with resin. The exhausting of the air is very stable, and a concentration of resin at the corner of the semiconductor chip can be suppressed, thereby avoiding the spattering of resin onto the top of the chip.

Method of resin sealing a gap between a semiconductor chip and a substrate

Rubber composition and method for producing the same

Growing community of inventors

Aichi, Japan

Hirotaka Okamoto