Dowa Metaltech Co., Ltd.

Yazaki Corporation

Hirotaka Kotani

Hiroto Narieda

Akira Sugawara

Yuta Sonoda

Hideki Endo

Hideyo Osanai

Satoru Ideguchi

Yukiya Kato

Tatsuhiro Doi

Takao Tomiya

Jyun Toyoizumi

Yuya Kishibata

Takaya Kondo

Hideki Ohsumi

Tetsuo Kato

Hirotaka Takahashi

Takayuki Takahashi

Tatsunori Murata

Yoshitaka Ito

A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.

Composite material, method for producing composite material, and terminal

There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

Composite plating material and method for producing the same

There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.

Composite plated product and method for producing same

A heat radiating plateof a metal material includes a flat plate portion, a large number of columnar protruding portionswhich protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate memberof a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.

Heat radiating plate and method for producing same

A tin-plated product contains: a substrateof copper or a copper alloy; an underlying layerof nickel which is formed on the surface of the substrate; and an outermost layercontaining tin, the outermost layerbeing formed on the surface of the underlying layer, the outermost layerbeing composed of a copper-tin alloy layerof a large number of crystal grains of a copper-tin alloy, tin layersof tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layersof a copper-nickel-tin alloy, each of the tin layersbeing formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layersbeing arranged on the side of the underlying layerin the copper-tin alloy layerso as to be apart from each other.

Tin-plated product and method for producing same

After drying the surface of a tin plating layer having a thickness of 0.4 to 3 &#x3bc;m which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dmin a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

In a tin-plated product wherein a surface of a substrateof copper or a copper alloy is plated with tin, an underlying layerof at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate, and an outermost layer formed on the surface of the underlying layeris composed of a copper-tin alloy layerand tin layers, the copper-tin alloybeing formed of a large number of crystal grains of a copper-tin alloy, each of the tin layersbeing arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layerson the outermost surface being 20 to 80%, and the maximum thickness of the tin layersbeing smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layeris formed on a substrateof copper or a copper alloy so as to have a thickness of 0.1 to 1.5 &#x3bc;m by electroplating, a tin-copper plating layercontaining tinmixed with a copper-tin alloyis formed thereon so as to have a thickness of 0.6 to 10 &#x3bc;m by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layeris formed thereon so as to have a thickness of 1 &#x3bc;m or less by electroplating if necessary.

Heat radiating plate with supporting members and protrusion members

A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

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Tokyo, Japan

Hirotaka Kotani