Murata Manufacturing Co., Ltd.

Hirotaka Fujii

Kaoru Sudo

Toshiro Hiratsuka

Shingo Ito

Eiichi Kobayashi

Naoki Gouchi

Kazutaka Muraoka

Noboru Kato

Shigeru Tago

Shoji Nagumo

Koji Shiroki

Hiromasa Koyama

Koichi Takizawa

Yoichi Saito

Yoshihiko Goto

Koji Kamada

Daisuke Doi

Mie Shimizu

Tomohiro Furumura

Keisuke Teranishi

Kazuyuki Furuya

In a multilayer substrate, first interlayer connection conductors pass through resin layers in a lamination direction and electrically connect first and second signal conductors. Second interlayer connection conductors pass through the resin layers in the lamination direction and electrically connect the first and second signal conductors. The first interlayer connection conductors are aligned in a first row extending along the first signal conductor when viewed in the lamination direction. The second interlayer connection conductors are aligned in a second row extending along the first signal conductor when viewed in the lamination direction. A direction perpendicular to the direction in which the first signal conductor extends, when viewed in the lamination direction, is a line width direction. A position of the second row in the line width direction is different from a position of the first row in the line width direction.

Multilayer substrate

An antenna element includes a body including laminated insulator layers, a first ground conductor, and a radiation conductor overlapping the first ground conductor along a first direction from the first ground conductor. Guard ground conductors are provided in the body along the first direction to surround the radiation conductor. The guard ground conductors include second ground conductors electrically interconnected, and one or more first interlayer connection conductors piercing the insulator layers. The second ground conductors are shaped to not make a circuit of the radiation conductor, and are positioned at multiple positions relative to up-down directions. The second ground conductors each have an overlapping portion that overlaps the second ground conductor positioned adjacent to the overlapping portion in an upward or downward direction, and a non-overlapping portion that does not overlap the second ground conductor positioned adjacent to the non-overlapping portion in the upward or downward direction.

Antenna element

A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Multilayer resin substrate, and method of manufacturing multilayer resin substrate

A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

Multilayer substrate and method of manufacturing the same

A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.

Multilayer substrate and electronic device

This disclosure provides a wideband antenna including a feed line, a ground conductor plate and a radiating conductor element connected to the feed line and facing the ground conductor plate at a distance from the ground conductor plate. A parasitic conductor element is provided on a side opposite to the ground conductor plate as viewed from the radiating conductor plate and is insulated from these plates. A coupling adjusting conductor plate is positioned between the radiating conductor element and the parasitic conductor element, is configured to adjust an amount of coupling between them, overlaps an area where the radiating conductor element and the parasitic conductor element overlap, and straddles the radiating conductor element in a direction orthogonal to the direction of a current I that flows therein. Both end sides of the coupling adjusting conductor plate are electrically connected to the ground conductor plate via via-holes.

Wideband antenna

A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.

Antenna device

This disclosure provides a horizontal radiation antenna including a grounded conductor plate on the back surface of a multilayer substrate, a radiation element to which a microstrip line is connected on a front surface of the multilayer substrate, and a passive element on an end portion side of the multilayer substrate compared with the radiation element. An intermediate grounded conductor plate is provided within the multilayer substrate between insulation layers and faces the microstrip line. The intermediate grounded conductor plate defines a notch portion whose end portion side is open. The intermediate grounded conductor surrounds the radiation element and the passive element in the notch portion. The intermediate grounded conductor is electrically connected to the grounded conductor plate.

Horizontal radiation antenna

This disclosure provides a horizontal radiation antenna. The antenna includes a back-surface-side grounded conductor plate on a back surface of a substrate, a radiation element to which a coplanar line is connected on the front surface of the substrate, and a passive element closer to an end portion side of the substrate than the radiation element. A front-surface-side grounded conductor plate is provided at a substantially same height as the radiation element with respect to a thickness direction of the substrate, and a conductive wall surface capable of reflecting a high-frequency signal radiated from the radiation element is provided between the front-surface-side grounded conductor plate and the back-surface-side grounded conductor plate.

A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.

Flat cable and electronic apparatus

A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals.

High-frequency module and communication apparatus

In an antenna structure in which a base is mounted in a ground region on a circuit board, the base having formed thereon a driven radiating electrode and a parasitic radiating electrode, the parasitic radiating electrode causing multiple resonance at least in a harmonic resonant frequency band of the driven radiating electrode, capacitance loading means for loading a capacitance to a harmonic-mode zero voltage region of the driven radiating electrode is provided. The capacitance loading means is electrically connected to a ground electrode in the ground region on the circuit board via a grounding conduction path and switching means. By switching the switching means ON/OFF, capacitance loading by the capacitance loading means to the harmonic-mode zero voltage region of the driven radiating electrode is switched ON/OFF to switch a base resonant frequency in a base resonant frequency band of the driven radiating electrode.

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Nagaokakyo, Japan

Hirotaka Fujii