Fujitsu Corporation

Ricoh Company, Ltd.

Disco Corporation

Casio Computer Co., Ltd.

Nkk Corporation

Hiroshi Yoshimura

Junichi Kasai

Mitsutaka Sato

Akira Takashima

Michio Sono

Tetsuya Fujisawa

Katsuhiro Hayashida

Kosuke Otokita

Masataka Mizukoshi

Masahiko Ishiguri

Nobuo Iwata

Akio Kosuge

Kazuto Tsuji

Masahiro Wada

Katsuhiko Maeda

Noboru Sawayama

Atsushi Takehara

Masanori Yoshimoto

Hiroko Okuda

Hiroshi Sawada

Tadashi Uno

Norio Taniguchi

Kouji Maeda

Shigeyoshi Nakamura

Toshiyasu Rikiishi

Eiichi Ebihara

Keizou Ueno

Kazuhiro Tamada

Hiroyuki Kaneda

Akihisa Sota

Kouichi Kawahara

Morimitsu Iwai

Takamitsu Aoki

Kouki Ishihara

Masayuki Horii

Chisato Nakamura

Kousuke Otokita

Kohji Omori

Takumi Imajuku

Yasuhiro Torimaru

A tape mounter includes at least two storage units storing respective tape sets therein, a reader for reading information of the tape sets stored in the respective storage units from RFIDs attached to tubes around which the tape sets are wound as tape rolls, the storage units having shafts inserted in the tubes and being disposed such that they are spaced from the reader by respective different distances, a time measuring unit for measuring reading times spent until the reader receives radio waves generated and transmitted by the RFIDs and reads the information of the tape sets represented by the radio waves, a mapping table containing positions of the storage units corresponding to the respective reading times, and a recognizing section for checking the reading times against the mapping table, and recognizing the positions of the storage units and types of the tape sets.

Tape mounter and merchandise management warehouse

A tape affixing apparatus includes: a holding unit including a frame holding unit and a wafer holding portion; a feeding unit configured to feed a tape unit; a winding unit configured to wind a sheet from which a dicing tape is peeled off; a plate configured to be brought into contact with the sheet and peel the tape off from the sheet by bending the tape unit with the sheet on the inside; an affixing roller configured to affix the peeled-off tape to a frame and a wafer; and a nozzle configured to blow air so as to make the peeled-off tape conform to the affixing roller.

Tape affixing apparatus

A video information item obtained by photographing and an audio information item obtained by recording are digitized to obtain a digitized video data item and a digitized audio data item each accompanied by a time information item, respectively. The digitized video data item is stored in such a manner as to be separated into the time information item and the digitized video data item. The digitized audio data item is stored in such a manner as to be separated into the time information item and the digitized audio data item. The separately-stored time information item and the digitized video data item and the separately-stored time information item and the digitized audio data item are combined in synchronization with each other. The combined time information items, the digitized video data item, and the digitized audio data item are stored in a predetermined format.

Moving image recording method and information processing device

The microcomputer includes the oscillation circuit which outputs an oscillation signal and stops output of the oscillation signal when it receives an oscillation stop signal. The microcomputer receives the wakeup signal of a predetermined cycle at the wakeup terminal. There is provided the clock control circuit which receives the wakeup signal and the oscillation signal, outputs the oscillation stop signal thereby making the oscillation circuit stop output of the oscillation signal, and stops output of the oscillation stop signal based on the wakeup signal thereby making the oscillation circuit restart output of the oscillation signal.

Microcomputer and computer system

A flat display unit has a chassis combining a display panel and circuit boards for driving the display panel into a unit in which the display panel and the circuit boards are mounted on respective opposite surfaces of the chassis. The chassis is provided with a bank (i.e., sidewall) extending about the periphery of opposite main surfaces of the chassis including at least the surface on which the display panel is mounted, perpendicularly to that surface and surrounding the periphery of the display panel, and hence protecting the display panel without requiring a protector, as is conventionally used during the processes of assembling, testing and transporting thereof. The chassis is also provided with through-holes and optionally with a cut-out, which are formed in the periphery of the chassis, for facilitating interconnections between the display panel and the circuit boards by flexible cables which pass therethrough.

Flat display unit and method fabricating same

The present invention is aimed at carrying out high-precision and stable image formation using a gray-level image forming technique. In carrying out image formation by a gray-level electrophotographic process, the relationship between the layer thickness Tp of the photosensitive layer on the photosensitive member and the exposure diameter Db of a light beam emitted onto the photosensitive member is defined as 2Tp <Db, so that the charge diffusion and electric field in the photosensitive layer on the photosensitive member can be small. The maximum exposure within the exposure diameter Db is set at a value that can sufficiently reduce the differential sensitivity of the photosensitive layer, where the exposure diameter Db of the light beam is the minimum diameter at 1/e,with respect to the peak value of the exposure distribution obtained by integrating the energy distribution of the light beam with the exposure time. In this manner, excellent gray-level image presentation can be obtained, and high-precision and stable image formation can be carried out by using a region of damping characteristics on the photosensitive member.

Image forming apparatus and image forming method for forming color images by gray-level image forming technique

An image forming apparatus having a plurality of image bearing members disposed parallel along a conveying direction of recording sheet and a drive power transmission mechanism that translates movement of a drive source to synchronized and uniform movement of the image bearing members is provided. One embodiment of the drive power transmission mechanism includes a plurality of drive power transmission members and a plurality of intermediate transmission members alternately arranged in groups that are offset relative to each other. The drive power and intermediate transmission members in each group are arranged within a predefined angular orientation to ensure synchronized, uniform movement of the image bearing members and uniform distribution of the toner for each color of the color image being recorded.

Color image forming apparatus with drive power transmission mechanism

A process discriminating unit allows an optimum converting process among a first magnification processing unit, a second magnification processing unit, a first reduction processing unit, a second reduction processing unit, and a third reduction processing unit to be executed on the basis of a conversion magnification (K), a resolution (D), and an image size. Particularly, each of the second magnification processing unit, first reduction processing unit, and second reduction processing unit magnifies an original image to a virtual image of a dot size obtained by magnifying a target image by 2 or 4 by an interpolation based on a simple repetition by a nearest neighborhood method and, after that, reduces to the target image in which the pixel value is obtained by averaging a plurality of pixels corresponding to one target pixel of the virtual image.

Apparatus and method for converting image size and recording medium

A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

Semiconductor device and semiconductor device unit for a stack

A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.

Semiconductor device and semiconductor device unit

A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.

Semiconductor device having an inner lead extending over a central

A method for controlling a tension of a metal strip in a heat treatment furnace, comprising (a) travelling the metal strip through a plurality of tapered rolls; (b) measuring a tension (.sigma.) working on the metal strip through at least one of the tapered rolls; (c) computing a critical tension (.sigma..sub.cr) which generates heat buckle based on a thickness of the metal strip, a width of the metal strip, an elastic modulus of the metal strip, a length of a flat roll portion and a roll taper under a hot state; and (d) controlling the tension measured by the step (b) to be over a tension (.sigma..sub.min) sufficient to prevent transverse displacement but less than the critical tension (.sigma..sub.cr) which generates heat buckle. The critical tension (.sigma..sub.cr) which generates heat buckle is calculated by the equation: .sigma..sub.cr =K.multidot.t.sup.A .multidot.(W-FL).sup.B .multidot..theta..sub.h.sup.c .multidot.E, where t is the thickness of the metal strip (mm), W is the width of the metal strip (mm), FL is the length of a flat roll portion, .theta..sub.h is the roll taper (rad) under a hot state, E is the elastic modulus of the metal strip (kgf/mm.sub.2), and K, A, B, C are constants. The tension (.sigma..sub.min) sufficient to prevent transverse displacement is obtained as a minimum value of the tension (.sigma.) satisfying the following equations: .DELTA.D&lt;(l-W))/2 and .DELTA.D=g(t, W, .mu., LS, E, .theta..sub.h, .sigma., Ra, Ra'), where .DELTA. D is the transverse displacement amount, l is the roll barrel length, .mu. is the coefficient of friction between the metal strip and roll, LS is the line speed, .sigma. is the tension of the metal strip, Ra is the surface roughness of the metal strip, and Ra' is the surface roughness of a roll.

Method for controlling a tension of a metal strip in a heat treatment

A semiconductor device includes a semiconductor chip having electrode pads on the semiconductor chip, the electrode pads including a predetermined electrode. A plurality of leads are electrically connected to the electrode pads on the semiconductor chip, the leads including a predetermined lead electrically connected to the predetermined electrode. A resin package encloses the semiconductor chip and partially encloses the leads. A bypass lead portion electrically connects one of the leads, not adjacent to the predetermined electrode, to a location adjacent to the predetermined electrode, the bypass lead portion being enclosed in the resin package. A supporting lead supports the bypass lead portion such that the supporting lead prevents a deformation of the bypass lead portion, the supporting lead being enclosed in the resin package.

Semiconductor device having a supporting lead to support a bypass lead

A tonality extractor analyzes a chord progression (CP) to determine an available pitch class set (PCS) at each chord time of CP using stored musical knowledge base. The available PCS is determined differently depending on musical situations. A resultant PCS succession is most accurate and assures a natural stream of musical tonality free of a spurious modulation. An automatic accompaniment apparatus utilizes the tonality extractor for desired accompaniment performance. A modulation compensator avoids generation of a pitch range shift in the accompaniment line at the time of modulation (change of key). A style-grouped pitch change table in combination with a style-grouped reference accompaniment pattern memory optimizes accompaniment pitch contents to respective musical styles while requiring only a small storage space. An accompaniment pitch forming device using stored accompaniment note index data and a pitch table linked to the note index and tonality data controls accompaniment pitch line so as to vary in a pleasing way depending on tonalities.

Music apparatus for determining tonality from chord progression for

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Tokyo, Japan

Hiroshi Yoshimura