Nisshinbo Industries, Inc.

Other

Nippon Steel Corporation

Mitsubishi Gas Chemical Company, Inc.

Kawasaki Steel Corporation

Nippon Steel Sumitomo Metal Corporation

Sensormatic Electronics Corporation

Nisshinbo Holdings Inc.

Itochu Corporation

Arcelor France

Hiroshi Yoshida

Takaya Sato

Tohru Yoshida

Tsutomu Uehara

Akihiro Uenishi

Jun Nitta

Shigeru Yonemura

Satoshi Shirakami

Kimiyo Hata

Kazutoshi Hayakawa

Nobuo Yoshikawa

Toshifumi Hashiba

Tatsuya Maruo

Mitsugu Kotani

Zenzo Hashimoto

Tatsuo Shimizu

Yoshiaki Yamamoto

Takashi Miyagi

Hiroshi Matsunaga

Tsuyoshi Tojo

Kazuto Ikemoto

Hideo Abe

Naruhiko Nomura

Toshiyuki Niwa

Masafumi Ozawa

Taketo Maruyama

Hideki Watanabe

Shunji Hiwatashi

Norio Takashima

Masaru Ohto

Toru Sasaki

Eiji Isogai

Michio Yamashita

Kanako Yuyama

Shinji Matsudaira

Kosuke Yasuda

Shin Kuwabara

Yuichi Yoshida

Koji Banno

Satomi Kudo

Soichiro Makiyama

Tsuneo Nagamine

Shuji Watanabe

Noboru Ishihara

Takuya Suzuka

Shigenori Minamiru

Hideto Mitsuhashi

Junichi Nakaho

Noriyuki Takai

Masao Ayabe

Hideo Kashiwagi

Shigeru Kuwashima

Hidenori Nakata

Kaori Satoh

A method for manufacturing a press-formed product includes: a first step of preparing a long material having a bending portion; and a second step of decreasing curvature of the bending portion while restricting both ends of the long material in a longitudinal direction.

Method for manufacturing press-formed product, device for manufacturing press-formed product, mandrel, and press-formed product

A stretch flange crack prediction method of predicting initiation of stretch flange cracks that occurs in a flange end section during stretch flange forming of a deformable sheet, includes: a measurement value acquisition process of acquiring, for each of a plurality of sheet-shaped test pieces, a fracture strain measurement value, a normal strain gradient measurement value, and a circumferential strain gradient measurement value; a CAE analysis process of acquiring a maximum major strain maximum element having a highest maximum major strain, a normal strain gradient of the maximum major strain maximum element, and a circumferential strain gradient of the maximum major strain maximum element; a fracture determination threshold acquisition process of acquiring a fracture determination threshold by converting the fracture strain measurement value; and a prediction process of predicting that stretch flange cracks will be initiated, when the maximum major strain is equal to or higher than the fracture determination threshold.

Stretch flange crack prediction method, stretch flange crack prediction apparatus, computer program, and recording medium

An evaluation method of a plastic material includes: a first shearing process of performing simple shearing deformation with respect to a first plastic sheet; a second shearing process of performing simple shearing deformation with respect to a second plastic sheet; a first partial stress-strain curve data obtaining process of obtaining first partial stress-strain curve data; a second partial stress-strain curve data obtaining process of obtaining second partial stress-strain curve data; and a synthesized stress-strain curve data obtaining process of obtaining synthesized stress-strain curve data based on the first partial stress-strain curve data and the second partial stress-strain curve data.

Evaluation method of plastic material and evaluation method of deformation processing of plastic material

According to exemplary embodiments of the present invention, using a fracture limit stress line obtained by converting a hole expansion ratio into a stress as a criterion for a fracture, the risk of fracture in a material can be evaluated quantitatively by comparing the relationship between data obtained from a numerical analysis using a finite element method and the fracture limit stress line. Thus, when determining a fracture limit in a stretch flange portion in a thin plate in a process including one or more deformation path variations, it is possible to obtain the fracture limit curve easily and efficiently and predict the fracture with high accuracy, and the risk of fracture upon press forming or crash can be evaluated.

Fracture prediction method, device, a program arrangement and computer-accessible medium therefor

Capacitor cell

According to exemplary embodiments of the present invention, a fracture prediction device for a spot welded portion can be provided. For example, the device may include an input arrangement configured to input all or some of a material strength, a plate thickness, a nugget diameter of a spot welding, a plate width of a joint, and a rotation angle of the joint in a tension test, based on a cross tension test and/or a shear tension test at a spot welded joint. The device can also include a first calculation arrangement configured to calculate a fracture strength parameter of the spot welded portion. A parameter storage arrangement may also be provided which can be configured to store the fracture strength parameter by each steel type. Further, the device may further have a second calculation arrangement configured to determine a fracture of the spot welded portion.

Fracture prediction device for spot welded portion, method of the same, software arrangement, and computer-accessible medium

A cleaning composition of a semiconductor device for laminating an organosiloxane-based thin film and a photoresist layer in this order on a substrate having a low dielectric interlayer insulation film and a copper wiring or a copper alloy wiring, then applying selective exposure and development treatments to the subject photoresist layer to form a photoresist pattern, subsequently applying a dry etching treatment to the organosiloxane-based thin film and the low dielectric interlayer insulation film while using this resist pattern as a mask and then removing the organosiloxane-based thin film, a residue generated by the dry etching treatment, a modified photoresist having been modified by the dry etching treatment and an unmodified photoresist layer located in a lower layer than the modified photoresist, the cleaning composition containing from 15 to 20% by mass of hydrogen peroxide, from 0.0001 to 0.003% by mass of an amino polymethylene phosphonic acid, from 0.02 to 0.5% by mass of potassium hydroxide and water and having a pH of from 7.5 to 8.5, is provided. Also, a method for manufacturing a semiconductor device using the subject cleaning composition is provided.

Cleaning composition and process for producing semiconductor device

A computer performs press forming analysis based on a shape of a formed product or of a member, a blank holder force, a friction coefficient, a tensile strength of a material, a yield strength, a stress-strain relation, and a sheet thickness, as press forming conditions, to calculate sheet thickness distribution and post-formation strain distribution of the formed product. The computer also performs performance analysis based on the sheet thickness distribution, the post-formation strain distribution, and the shape of the formed product or of the member, as state amounts of the formed product. This calculate performance of the member. The computer repeats the calculations performed in the process from the first step through the second step a predetermined number of times, with at least one of the press forming conditions being changed, to output an optimum press forming condition that gives a maximum value or a target value of the performance

Member designing method and apparatus

Flaky particles which are produced through easy conversion from mother particles by using an organic compound other than monomers having double bonds as the hardening and crosslinking agent and to which at least one mechanical or functional characteristic selected from among reactivity, close adhesion, and tackiness is imparted by the presence of part of the unreacted reactive groups of the organic compound inside and on the particles; and a process for the production of the flaky particles. More specifically, flaky particles composed of mother particles (A) having functional groups and an organic compound (B) which has groups reactive with the functional groups of the particles (A) and is soluble in a solvent, characterized in that at least part of the functional groups of the mother particles (A) and at least part of the reactive groups of the organic compound (B) react with each other to form crosslinks.

Flat particles and process for production thereof

A lithium based battery includes a cell structure group formed by stacking unit cells each including a positive electrode, a negative electrode, and a separator interposed therebetween, or formed by repeatedly folding or winding an integral body of the unit cells; a battery container for containing the cell structure group; and an electrolyte, which is poured in the battery container after the cell structure group is contained in the battery container. The outer peripheral surface of the battery container is covered with an ion impermeable and extensible high polymer sheet having a tensile elongation percentage of 1% or more. With this configuration, even if there happens such a severe accident that nail pieces the battery or the battery is crashed, it is possible to prevent a large short-circuit current from flowing between the positive and negative electrodes, and hence to ensure a higher safety of the battery.

Lithium-based battery having extensible, ion-impermeable polymer covering on the battery container

An electric double layer capacitor has a pair of current collectors, a positive polarizable electrode which is provided on one of the pair of current collectors, includes activated carbon of a weight Wand has a capacitance C, a negative polarizable electrode which is provided on the other of the pair of current collectors, includes activated carbon of a weight Wand has a capacitance C, a separator interposed between the positive and negative polarizable electrodes, and an organic electrolytic solution which impregnates at least the positive and negative polarizable electrodes and the separator, wherein C/C=0.6 to 1.0 and W/W=1.1 to 2.0. Even when continuously charged at a high applied voltage, the electric double layer capacitor has a high retention of capacitance and a low rise in internal resistance, and thus has an excellent durability.

Electric double layer capacitor

An electric double layer capacitor is composed of a pair of current collectors, a positive polarizable electrode provided on one of the pair of current collectors, a negative polarizable electrode provided on the other of the pair of current collectors, a separator between the positive and negative polarizable electrodes, and an organic electrolytic solution which impregnates at least the positive and negative polarizable electrodes and the separator. The capacitor has a theoretical amount of ions Qdefined as(moles)=&#xf7;96,500,wherein C is the rated capacitance (farads) of the capacitor and V is the rated voltage (volts), and an amount of ions Qin the organic electrolytic solution, such that Q/Q=1.7 to 3.5. The capacitor has a high voltage rating, excellent cycle characteristics during high-current charging and discharging, and a low internal resistance in low-temperature environments.

A composite particle that can be easily converted to cured particle or half cured particle by the use of carbodiimide resin without changing of the configuration of matrix particle of, for example a thermoplastic resin, excelling in mechanical and functional characteristics by virtue of the reaction capability inherently possessed by a carbodiimide group. In particular, a composite particle comprising matrix particle (A) having a functional group capable of reacting with a carbodiimide group and carbodiimide resin (B), characterized in that the functional group of the matrix particle (A) couples with the carbodiimide group of the carbodiimide resin (B) and that the composite particle is provided with an outer shell layer of carbodiimide resin (B) having an average thickness diameter (L), defined by the following formula [1], ranging from 0.01 to 20 &#x3bc;m: L=(L&#x2212;L)/2 [1] wherein L1 represents the average diameter of matrix particle, and L2 represents the average diameter of composite particle.

Composite particle with a carbodiimide resin layer and a process for producing the same

The present invention provides a burglar alarm system capable of accurately discriminating an alarm from a disturbance noise approximate to the alarm such as background music, ambient noises, etc. In a burglar alarm system comprising an alarm unit attached to an object to be protected from theft to emit an alarm of a particular frequency and an alarm sensor device for issuing an alarm signal upon sensing an alarm from the alarm unit, the alarm sensor device counts a predetermined number of waveform pulses of a received sound (S, S) more than once (S&#x2dc;S, S&#x2dc;S), determines, if it transpires that a differential between counted values falls within a predetermined time range, that the received sound is an alarm and issues an alarm signal (S).

Antitheft system

The present invention provides a burglar alarm system capable of accurately discriminating external noises approximate to an alarm such as background music, ambient noises, etc. and reverberations of an alarm attributable to an architectural design of the interior of a store, etc. from a legitimate alarm. A burglar alarm system of the present invention comprises an alarm unit attached to an object to be protected from theft to emit an alarm of a certain frequency in response to illegal conduct and an alarm sensor for emitting an alarm signal upon sensing an alarm from said alarm unit, wherein said alarm sensor has first and second determination means for evaluating an input signal containing an alarm from the alarm unit and external noises, and the first determination means evaluates a random external noise contained in the input signal (S, S) whereas the second determination means evaluates a reflected sound caused by reverberations of the alarm (S, S) to emit an alarm signal (S).

Growing community of inventors

Chiba, Japan

Hiroshi Yoshida