Panasonic Intellectual Property Management Co., Ltd.

Kyocera Corporation

Omron Corporation

Dainippon Screen Mfg. Co., Ltd.

Screen Holdings Co., Ltd.

Nidec Techno Motor Holdings Corporation

Hiroshi Yoshida

Yasuhiro Nakamura

Takashi Inoue

Kenji Ikeuchi

Noriyasu Kawakita

Yusuke Kishina

Tomoya Shimomura

Kazuhide Toda

Mitsuhisa Yoshimura

Kyohei Kobayashi

Yukiyasu Sugihara

Naomi Kurihara

Miwa Ogawa

Tatsuya Yoshida

Hiromi Sasaki

Yukari Shimamoto

Kenichiro Mori

Hiromi Nakanishi

Masami Tsubaki

Akitoshi Maeno

Takeshi Nakata

Yoshihiro Nagao

Masanobu Tanigami

Junichi Sato

Shosuke Nakano

A power management system including a management apparatus configured to assign divided computation processing constituting at least a part of predetermined computation processing to a distributed computing device placed in a facility, wherein the management apparatus includes a receiver configured to receive a message including an information element indicating a type of a power source configured to identify electrical power allowed as electrical power to be used by the distributed computing device, and a controller configured to perform assignment processing to assign the divided computation processing to the distributed computing device based on the type of the power source.

Power management system and power management method

A power management system including a management apparatus configured to assign divided computation processing constituting at least a part of predetermined computation processing to a distributed computing device placed in a facility, wherein the management apparatus includes a receiver configured to receive a message including an information element indicating executability of computation processing by the distributed computing device, and a controller configured to perform assignment processing configured to assign the divided computation processing to the distributed computing device based on the executability of the computation processing.

A power management system including a management apparatus configured to assign divided computation processing constituting at least a part of predetermined computation processing to a distributed computing device placed in a facility, wherein the management apparatus includes a receiver configured to receive a message including an information element indicating a type of corresponding computation processing that the distributed computing device is capable of handling, and a controller configured to perform assignment processing to assign the divided computation processing to the distributed computing device based on the type of the corresponding computation processing.

A power management system including a management apparatus configured to assign divided computation processing constituting at least a part of predetermined computation processing to a distributed computing device placed in a facility, wherein the management apparatus includes a controller configured to perform assignment processing configured to assign the divided computation processing to the distributed computing device based on at least one of a prediction value of an output power of a distributed power supply placed in the facility, a prediction value of power consumption of the facility, and a prediction value of a surplus power of the facility.

An electrode foil for an electrolytic capacitor including a metal porous portion, and a metal core portion continuous to the metal porous portion. When the metal porous portion is equally divided in three in a thickness direction of the metal porous portion into a first region, a second region, and a third region sequentially from the metal core portion side, the first region has a porosity P1, the second region has a porosity P2, and the third region has a porosity P3, satisfying P1<P2<P3.

Electrode foil for electrolytic capacitor, electrolytic capacitor, and methods for producing them

A solid electrolytic capacitor includes a capacitor element. The capacitor element includes an anode foil, a dielectric layer, a solid electrolyte layer, and a cathode lead-out layer. The anode foil includes a first part and a second part other than the first part. The first part has an etched surface, and a second part has an unetched surface. The dielectric layer is formed on the etched surface of the first part in the anode foil. The solid electrolyte layer is formed on at least a part of a surface of the dielectric layer. The cathode lead-out layer is formed on at least a part of a surface of the solid electrolyte layer. An insulating protective layer covers a boundary part between the first part and the second part as well as an end of the cathode lead-out layer and an end of the solid electrolyte layer.

Solid electrolytic capacitor and method for manufacturing same

A method for producing an electrode foil includes an electrolytic etching step of etching a metal foil containing first metal by applying current between the metal foil and an electrode in etching liquid while a principal surface of the metal foil faces the electrode. A masking member is disposed between the principal surface of the metal foil and the electrode so as to cover a partial region of the principal surface. The masking member is an electric conductor. The masking member is electrically connected with the metal foil.

Electrode foil production method and capacitor production method

A method for producing an electrode foil includes: a first step of preparing a metal foil, the metal foil having a strip shape; a second step of disposing a masking member so as to cover part of a principal surface of the metal foil; and a third step of partially etching the principal surface of the metal foil by applying current between the metal foil and an electrode while the metal foil faces the electrode via the masking member in etching liquid after the second step. The masking member has a strip shape. In the second step, the masking member is disposed along a longitudinal direction of the metal foil so as to be separated from both side edges of the metal foil.

A treatment liquid supply apparatus supplies a treatment liquid to a predetermined object for treatment of a substrate, and recovers the supplied treatment liquid for reuse. The apparatus includes: a first tank in which the treatment liquid to be supplied to the object is stored; a second tank in which the treatment liquid recovered from the object is stored; a transfer unit which transfers the treatment liquid from the second tank to the first tank; a first temperature regulating unit which regulates the temperature of the treatment liquid to be supplied from the first tank to the object; and a second temperature regulating unit which regulates the temperature of the treatment liquid to be transferred from the second tank to the first tank by the transfer unit.

Treatment liquid supply apparatus and substrate treatment apparatus including the same

A molded motor includes a stator, a resin casing, a rotor, a pair of bearings, a pair of bearing retainers, a resin bracket cover, and a control board. The rotor includes a shaft. The bearings are arranged to rotatably support the shaft. The bearing retainers are made of an elastic electrically insulating body. The bearing retainers are arranged to cover the bearings at radial outer sides of the bearings and to hold the bearings in place. The bracket cover is arranged to cover the open side of the casing. One of the bearings is attached to the bracket cover through one of the bearing retainers. The other bearing is attached to a bottom wall portion of the casing through the other bearing retainer.

Molded motor

A method of providing a program for a printed board packaging line is disclosed. A board packaging line coordinating computer downloads the service contract information and the application program contained in the contract information from an application server, and defines the board packaging line covered by the program and the device configuration of the line. The device configuration thus defined is uploaded to the application server, which, based on the device configuration thus uploaded, searches a prepared device driver group for a required device driver. This device driver is downloaded and set in each device by the board packaging line coordinating computer.

Growing community of inventors

Kyoto, Japan

Hiroshi Yoshida