The Furukawa Electric Co., Ltd.

Hiroshi Yatabe

Masaaki Yamamoto

Hajime Mochizuki

Kenzo Kobayashi

Shingoro Fukuoka

Ryu Maeda

The composite circuit board comprises a substrate made of an insulating material, a thick circuit conductor, embedded in this substrate, which includes a given portion for connecting components to the thick circuit conductor and has a predetermined circuit pattern, a thin circuit conductor, provided on the surface of the substrate, which includes a land corresponding to the parts-mounting section of the thick circuit conductor and has a predetermined circuit pattern, and a conductor for electrically connecting the land and the given portion of the thick circuit conductor. In this circuit board, the land and the given portion of the thick circuit conductor are connected by a conducting member provided in the through hole.

Composite circuit board having means to suppress heat diffusion and

This invention provides an aluminum enamel board having an electrically insulating glass layer formed on an Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having an aluminum or alloy layer formed on at least one side of a metal plate made of a metal other than aluminum. Since the Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having the aluminum or aluminum alloy layer is used as a board, the adhesion strength between the metal plate and the electrically insulating glass layer can be increased. At the same time, a predetermined material is used to form the electrically insulating glass layer, thereby minimizing a difference in thermal conductivity and thermal expansion coefficient between the electrically insulating glass layer and the metal plate. This improves the heat conduction characteristics of the board and prevents warping of the board.

Growing community of inventors

Yokohama, Japan

Hiroshi Yatabe