Ube Industries, Inc.

Meiko Electronics Co., Ltd.

Hiroshi Yasuno

Tsunetomo Nakano

Kazuaki Nishio

Seiji Ishikawa

Hiroyuki Sakurai

Toshimune Yoshinaga

Shigeru Yamamoto

Kohei Nakajima

Mitsushi Taguchi

Yoshiaki Watanabe

Masayuki Nakatani

Hiroshi Watanabe

Fumio Sakatani

Hiroyuki Fukuda

Takeshi Kanda

An imide-based photosensitive resin composition comprised of (1) a photosensitive imidosiloxane oligomer comprised of a reaction product of an imidosiloxane oligomer having a functional group reactive with an epoxy group and an epoxy compound having a photosensitive group, (2) an isocyanate having an unsaturated bond, (3) a photopolymerization initiator, and (4) an organic solvent, an insulating film obtained by curing the same, and a process for production of such an insulating film.

Photosensitive resin compositions, insulating films, and processes for formation of the films

An adhesive-applied tape prepared by coating a support film with a solution obtained by dissolving in an organic solvent a mixture of an epoxy resin and an amorphous polyimidosiloxane produced from an aromatic tetracarboxylic dianhydride or its derivative and a diamine comprising an aromatic diamine which comprises an aromatic diamine having a functional group which can react with an epoxy group and a diaminopolysiloxane, and then drying it at a temperature at which the epoxy resin is not cured to provide a tack-free adhesive layer with no surface tackiness. The tape is both flexible and heat resistant, and does not require high-temperature, high-pressure contact bonding conditions upon contact bonding.

Adhesive-applied tape

A photosensitive polyimidosiloxane composition comprising a polyimidosiloxane comprising 15-80 mole percent of the units, ##STR1## wherein X represents CO, O or a direct bond and R.sub.3 represents an aromatic residue containing a photosensitive group with an unsaturated hydrocarbon group, and 85-20 mole percent of the units, ##STR2## wherein X is as defined above, each R.sub.4 independently represents a divalent hydrocarbon residue, each R.sub.5 independently represents an alkyl group of 1-3 carbon atoms and 1 represents an integer of 3-30, a finely divided inorganic filler, and an organic solvent. The composition provides films having excellent light transmittance.

Photosensitive polyimidosiloxane compositions and insulating films made

A composition containing 100 parts by weight of a soluble polyimidosiloxane obtained by polymerization and imidation of an aromatic tetracarboxylic acid component and a component comprising a diaminopolysiloxane, an aromatic diamine with a hydroxyl group and optionally another aromatic diamine, 1 to 50 parts by weight of an epoxy resin, and optionally, also 2 to 150 parts by weight of an inorganic filler such as mica, silica or barium sulfate, and an organic solvent. The composition is homogeneously soluble in organic solvents, and when formed into a protective film on a flexible wiring board it has high heat resistance, flexing resistance, adhesion and chemical resistance (against soldering flux and tin plating solutions).

Polyimidosiloxane compositions

A polyimidosiloxane material useful for forming, on a flexible substrate material, a flexible protective coating layer with a high heat resistance, electrical insulating property and curl-resistance, comprises a polymerization-imidization product of an aromatic tetracarboxylic acid component comprising, as a principal ingredient, 2,3,3',4'-biphenyltetracarboxylic dianhydride with a diamine component comprising, as a principal ingredient, a diaminopolysiloxane compound of the formula (I) ##STR1## wherein R.sub.1 is a divalent hydrocarbon residue, R.sub.2 is an C.sub.1-3 alkyl or phenyl group, n is an integer of 3 to 30, and is preferably used, optionally together with an epoxy resin, in the form of a solution or dispersion in an organic solvent to coat a flexible substrate material, for example, a flexible circuit element, therewith.

Polyimidosiloxane resin and composition thereof and method of applying

A base for a printed circuit board is continuously produced by an apparatus comprising at least one degreasing vessel, at least one water pre-washing vessel, at least one electrodeposition coating vessel, at least one electrodepositing liquid-recovering vessel, at least one water post-washing vessel, and a transporting device for intermittently transporting the base successively through the above-mentioned vessels, which apparatus is provided with a device for conveying the base to a predetermined position above one of the above-mentioned vessels, stopping the base at that position, introducing the base into the vessel, keeping the base in the vessel for a predetermined time, and withdrawing the base from the vessel.

Apparatus for continuously producing a base for a printed circuit board

In a multilayer printed circuit board comprising an insulating substrate and a plurality of circuit elements provided thereon in layers, each of which is composed of a circuit pattern and an insulating resin layer provided over the circuit pattern, the circuit patterns arranged adjacently to each other being portionwise connected electrically through via at least one hole, the improvement in which said insulating resin layer comprises a photoset resin of an aromatic polyamide having at least 10 molar % of a constitutional unit of the formula (Ia): ##STR1## wherein each of R.sup.1 and R.sup.2 independently is a hydrogen atom or a residue of a reactive organic compound, Ar.sup.1 is a divalent aromatic residue, and Ar.sup.2 is a divalent aromatic residue possessing a photosensitive group.

Multilayer printed circuit board

An organic solvent-soluble photosensitive polyamide resin usable for producing photoset resin product having excellent heat resistance and electrical and mechanical properties, comprising a polycondensation product of an aromatic dicarboxylic acid component with an aromatic diamine component consisting of 10 to 100 molar % of a photosensitive diamine compound of the formula (I) and 10 to 90 molar % of a non-photosensitive diamine compound of the formula (II),

Organic solvent-soluble photosensitive polyamide resin

An organic solvent-soluble photosensitive polyimide resin having excellent heat resistance and electrical and mechanical properties, comprising a copolycondensation product of a biphenyltetracarboxylic acid component with an aromatic diamine component consisting of 40 to 90 molar % of a diamine compound of the formula (I) and 10 to 60 molar % of a diaminodiphenylether compound of the formula (II), ##STR1## wherein X=--CO--O-- or --CH.sub.2 --O--, R.sub.1 and R.sub.2 =an organic residue having an ethylenically unsaturated radical, and R.sub.3 =H or --NHCOR.sub.2.

Organic solvent-soluble photosensitive polyimide resin

A photosetting composition comprises an unsaturated acid-modified bisphenol type epoxy compound having an acryloyl radical; an oligoester diacrylate compound having a molecular weight of 420 or more; a photopolymerizable acrylate type monomeric compound having a molecular weight of 100 to 400; a bisphenol type epoxy resin having a softening point of 50.degree. C. to 150.degree. C. or a saturated acid-modified bisphenol type epoxy resin having a softening point of 50.degree. C. to 150.degree. C.; and a photopolymerization initiator, said composition having a proper viscosity and an excellent photocuring reaction rate and being able to form a photocured resinous film or article having a satisfactory Dupont impact strength, impact bending strength, and bonding property to metallic materials.

Photosetting composition containing modified epoxy resins and an

A photosetting composition useful as a coating varnish comprising a modified, epoxidized butadiene polymer, at least one photopolymerizable monomer and a photosensitizer, the modified, epoxidized butadiene polymer comprising (1) an epoxidized butadiene polymer backbone group, (2) 5 to 50 aromatic or cyclocyclic polybasic carboxylic ester side chain groups per 100 butadiene units, each having at least one acryloyl or methacryloyl terminal group and a linking group formed by a reaction between a carboxylic acid radical in the polybasic carboxylic ester and an epoxy radical in the epoxidized butadiene polymer and, optionally, (3) 0 to 50 phosphoric ester additional side chain groups per 100 butadiene units, each having a linking group formed by a reaction between a hydroxyl radical attached to a P atom in the phosphoric ester and an epoxy radical in the epoxidized butadiene polymer.

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Ichihara, Japan

Hiroshi Yasuno