Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroshi Yamauchi

Toshiaki Yamauchi

Shoriki Narita

Hiroaki Onishi

Yoshio Maruyama

Toshinori Mimura

Wataru Hirai

Koichi Nagai

Kazuki Fukada

Naoto Hosotani

Shinji Kadoriku

Katsuhiko Watanabe

Hideo Hongo

Jun Shirai

Naomi Kuromoto

Teruo Maruyama

Mikiya Nakata

Kazuhiro Mori

Hidenori Miyakawa

Minoru Yamamoto

Hidenobu Nishikawa

Ryoji Inutsuka

Muneyoshi Fujiwara

Yoshiyuki Nagai

Yasuo Izumi

Yoshinori Wada

Takashi Akiguchi

Takashi Sonoda

Syoji Sato

Shuji Ono

Mitsuhiro Ikeda

Mineo Tokunaga

Naoichi Chikahisa

Yoshiyuki Fujita

Masanori Iwasaki

Tatsuki Nogiwa

In printing of a bonding material in which a board is supported from a component mounting-side surface on which a plurality of components are mounted, and a bonding material is printed on a working-side surface which is a surface opposed to the component mounting-side surface of the board, an edge portion region of the board supported by a board transporting unit is included in a support region of the board during the printing so as to enlarge the support region of the board having the components mounted thereon in high density and to achieve reliable and high precision printing of the bonding material.

Printing apparatus and method for bonding material

A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.

Substrate support jig, circuit board production apparatus, and method of producing circuit board

A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.

Viscous material application apparatus

Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus

By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material feeding device with a pressure smaller than the discharge pressure imparted by the discharge-pressure adjusting device.

Method and apparatus for applying viscous material

An apparatus and a method for applying a fluid, which enable an application amount of the fluid to be stabilized even at the start of fluid discharge and at the end of the fluid discharge. The apparatus includes an application head and a control unit, whereby operational control is carried out so that a discharge member is rotated and moved in a discharge direction along an axial direction of the discharge member when the fluid is to be discharged, while the rotation of the discharge member is stopped and the discharge member is moved in a direction opposite to the discharge direction when the discharge is to be stopped. The application amount of the fluid to be applied can be stabilized even at the start of fluid discharge and at the end of the fluid discharge.

Apparatus and method for applying fluid

A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

Method of manufacturing article having electronic circuit

Three or more, or two or more types of electronic components are formed on one substrate, and these electronic components form an aggregated planar surface on a surface of the substrate.

Aggregate of electronic components and mounting method thereof

A board positioning method includes the steps of selecting one of a plurality of positioning sections or stations for positioning a particular type of board located in a specified position. The method allows positioning different types of boards in specified positional relationships by locating only a positioning section corresponding to the board to be positioned, so that the positioning section faces the board located in the specified position. The positioning section is moved into the specified location by means of a support member. Thereby, positioning various types of the boards in a specified common position is possible without the need to make adjustments to a single positioning station.

Board positioning apparatus

A component carrier assembly includes component holders each for holding a component therein and connected to one another in a form of a tape carrier. Each holder is provided with a cavity to accommodate the component, a closure for shutting an opening of the cavity, and a device for securing the lid structure in a closed position. An apparatus for feeding the component carrier includes a device for transferring the component carrier, a device for forcibly opening a closure of a component holder transferred to a predetermined position, and a device for forcibly closing the closure of the component holder after a component is removed from the cavity.

Component collective and component collective feeding apparatus

A component collective includes component holders respectively holding components therein and connected to one another in the form of a tape carrier. Each of holders is provided with a cavity to accommodate the component, a lid for shutting an opening of the cavity, and a keeping device for keeping the lid at a closed position. An apparatus for feeding the component collective includes a device for transferring the component collective, a device for forcibly opening the lid means of the component holder transferred to a predetermined position, and a device for forcibly closing the lid of the component holder after a component is removed from the cavity.

Board positioning method and apparatus of the methods

A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.

Method for connecting electronic component with substrate

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Katano, Japan

Hiroshi Yamauchi