Fujitsu Corporation

Hiroshi Yamaji

Tomoyuki Hongoh

Yuichi Sato

Tetsuya Takahashi

Tsutomu Takahashi

Hisao Hayashi

Riichi Magome

Shigeru Amagasa

Takashi Sato

Takashi Kanno

Yasushi Kojima

Hiroshi Kadoya

Mitsuo Kaetsu

Tetsuya Murayama

Koichi Namimatsu

Kazuaki Kashiwada

Jun Sakiura

Kouichi Namimatsu

Kiyoshi Minematsu

Sataroh Sawano

Kenji Joukou

Katsuyuki Arai

Tomoyuki Hongho

Mitsusada Toyama

A cover mounting structure for a shelf assembly which allows easy mounting of a cover to a shelf and can reliably prevent falling of the cover even when the cover is unlocked. The shelf assembly includes a shelf having a pair of side plates and a plurality of electronic circuit packages mounted in the shelf. The cover mounting structure includes a cover having a front plate, a pair of side plates bent from the front plate at a substantially right angle thereto, and a top plate bent from the front plate at a predetermined angle thereto; and a pair of shafts fixed in the vicinity of the upper ends of the side plates of the cover so as to project inside of the cover. A pair of recesses for receiving the shafts are formed at the upper ends of the side plates of the shelf, and a pair of guiding slant surfaces for guiding reception of the shafts into the recesses are formed at the front edges of the upper ends of the side plates of the shelf. The shafts are engaged with the recesses to thereby mount the cover on the shelf assembly.

Cover mounting structure for shelf assembly

This invention relates to a subrack device applicable for an SDH network, and more particularly to a subrack device which can be produced flexibly in response to a customer's need. The subrack device has a subrack body commonly used regardless of a type of the subrack device. The subrack body has a circuit-board-unit housing portion and an outer-connecting-board mounting portion. Circuit boards and outer-connecting-board connecting-boards of different types are prepared. The outer-connecting-board mounting portion has a plurality of outer-connecting-board mounting territories. The outer-connecting-boards are plugged in the outer-connecting-board mounting territories to produce the subrack device meeting the customer's need.

Subrack device

A heat pipe connector includes a housing having a hole shaped like a quadrangular pyramid with a large opening and a small opening. A plurality of clamp pieces are combined into a body that can be fitted into the hole shaped like a quadrangular pyramid. A heat pipe insertion opening, into which a heat pipe is inserted, is formed in the center of the combined pieces. Springs energize each clamp piece toward the small opening of the hole shaped like a quadrangular pyramid. The heat pipe is inserted into the heat pipe insertion opening from the side of the small opening of the housing hole shaped like a quadrangular pyramid. It is configured such that a spring force; of the springs as well as lateral surfaces of the hole shaped like a quadrangular pyramid apply a force to the clamp pieces to clamp the heat pipe.

Heat pipe connector and electronic apparatus and radiating fins having

Test connector for electronic circuit units

Heat radiation structure for semiconductor device

An optical fiber cable lead-in structure for a shelf (1) having a space (7) for receiving a remaining portion of the optical fiber cable (23), and an electronic circuit unit (12) mounted thereon having a board (14) and a surface plate (15) provided perpendicularly at one side of the board (14); the surface plate (15) covering the front side of the shelf (1) when mounting, comprising: an optical connection (21;25) for connection between the optical fiber cable (23) and the electronic circuit unit (12), which is provided on the board (14) adjacent to the backside of the surface plate (15); an outwardly protruding portion (33) that is provided in the surface plate (15) so as to correspond to the optical connection (21;25), such that an attaching and detaching operation of the optical connection (21;25) may be easily effected; and an opening (27) that is provided in the surface plate (15) such that the optical fiber cable (23) extending from the remaining fiber cable receiving space (7) is wired so as to extend along the surface plate (15) until it passes through the opening (27) of the surface plate (15) while describing a slight arch, and in turn to extend along the backside of the surface plate (15) while describing another slight arch until it reaches the optical connection (21;25) on the board (14) of the electronic circuit unit (12).

Optical fiber cable lead-in structure

Earth connection device in metal core printed circuit board

Growing community of inventors

Kawasaki, Japan

Hiroshi Yamaji