Namics Corporation

Hiroshi Yamaguchi

Raymond L Dietz

Noriyuki Sakai

Maciej Patelka

Cathy Shaw Trumble

Akito Yoshii

A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.

Method of manufacturing bonded body

A glass frit having a low melting point containing (A) AgO, (B) VO, and (C) at least one first oxide selected from the group consisting of MoO, ZnO, CuO, TiO, BiO, MnO, MgO, NbO, BaO and PO. The glass frit preferably contains 40 to 70% by mass of (A), 10 to 40% by mass of (B), and 0.5 to 30% by mass of (C) with respect to the total mass in terms of oxides. Furthermore, the glass frit preferably has a mass ratio (AgO/VO) of (A) to (B) of 1.8 to 3.2.

Glass frit

A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360&#xb0; C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) AgO, (B-2) VO, and (B-3) MoO. The conductive paste can achieve binding at a relatively low temperature (such as 370&#xb0; C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360&#xb0; C.).

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Niigata, Japan

Hiroshi Yamaguchi