Kabushiki Kaisha Toshiba

Canon Kabushiki Kaisha

Victor Company of Japan, Limited

Fujitsu Corporation

Hitachi, Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Kyushu Institute of Technology

Topy Kogyo Kabushiki Kaisha

Watanabe Tekko Kabushiki Kaisha

National Institutes of Health, a Component of the US Dept. of Health & Human Services

Chisso Corporation

Japan Casting & Forging Corporation

Hiroshi Yamada

Yutaka Onozuka

Tadahiro Sasaki

Nobuto Managaki

Yasutoshi Matsuo

Masayuki Saito

Keiji Takaoka

Masaki Oikawa

Akihiro Yamanaka

Torachika Osada

Atsuko Iida

Tomoyuki Inoue

Kazuki Tateyama

Atsushi Omura

Wataru Takahashi

Hideto Furuyama

Kazuhiko Itaya

Kenta Udagawa

Michinari Mizutani

Norihiro Ikebe

Miki Mori

Yoshihiro Hamada

Kunio Yoshihara

Yuji Iseki

Yasushi Shizuki

Yusaku Shinozawa

Ryo Nakano

Takasi Togasaki

Kuniharu Uchida

Seiichi Mikami

Yoshiaki Horinouchi

Kouji Okamoto

Yoshishige Sakurai

Soichi Honma

Kanekichi Suzuki

Koji Suzuki

Hideyuki Funaki

Keiichiro Tsukuda

Takuya Hatsui

Takashi Yamamoto

Satoshi Kimura

Kenji Furukawa

Dennis M Klinman

Hitoshi Matsushima

Yoshihiro Kondo

Kenichi Ishii

Manabu Uchida

Toshio Hatada

Yasunori Takei

Takashi Kato

Hiroshi Ito

Naoko Ikegaya

Tomoichi Ebata

Takuma Kodoi

Kenta Kumagai

Tomotsugu Kuroda

Hiromichi Ito

Takaharu Nakano

Shinichi Matsumoto

Yoshiyuki Toge

Tomoyuki Tenkawa

Naoko Ono

Akinori Hongu

Susumu Iwai

Kazuhiko Okito

Kishiro Abe

Takashi Togasaki

Monta Matsui

Masayuki Ohuchi

Kenji Shibayama

Shinichi Shimode

Masahiko Tsuruta

Masato Saito

Hiroyuki Kitamura

Takeshi Okauchi

Fumiharu Etoh

Kazuo Morita

Masaichiro Yoshioka

Koichi Kido

Akiyoshi Iida

Hironori Ochiai

Toshihiro Komatsu

Masayoshi Kamada

Yoshihiro Kamata

Yasuo Inoue

Kousuke Nakahata

Hironori Akasaka

Yutaka Isobe

Ryoji Nakamatsu

Yosuke Maegawa

Ryota Watanabe

Mitsuhiro Adachi

Shouhei Fuse

Tetsuro Homma

Ryoichi Ishii

Ryoichi Ishii, Deceased

By Kyoko Ishii, Administrator

Atuyoshi Komatu

Iori Maeda

Masahiro Okada

A liquid discharge head having an element board including an element configured to discharge a liquid includes a first storage element and a second storage element. The first storage element is a fuse element or an anti-fuse element. The second storage element is a semiconductor memory capable of holding a larger capacity than the first storage element. The second storage element is provided on an area other than the element board.

Liquid discharge head and method of manufacturing the same

A wiring board of an embodiment includes a through via, a first insulating film disposed around the through via, a second insulating film disposed around the first insulating film, a third insulating film disposed around the second insulating film and a resin disposed around the third insulating film. The resin includes fillers. The second insulating film has a relative permittivity lower than a relative permittivity of the first insulating film. The third insulating film has a relative permittivity higher than a relative permittivity of the second insulating film.

Wiring board and method of manufacturing the same

According to an embodiment, an electronic device includes a housing, metal patches, and a first metal member. The housing includes a bottom, a lid, and a side unit. The side unit is disposed to enclose a space between the bottom and the lid. A circuit substrate is disposed on a bottom surface of the bottom. The side unit is conductive and connected to a ground potential. The metal patches are disposed on a lid surface of the lid. The metal patches are arranged periodically in a first direction and a second direction. The second direction intersects the first direction. The metal patches are connected to the ground potential. The first metal member is disposed on the lid surface. The first metal member is connected to the ground potential. The first metal member includes a first portion. The first portion contacts a first surface of the side unit.

Electronic device having a housing for suppression of electromagnetic noise

An antenna device of the present embodiment includes: a first conductive layer connected to a ground potential, a semiconductor device provided above the first conductive layer, a second conductive layer provided above the semiconductor device, a first via connecting the second conductive layer and the first conductive layer, a third conductive layer provided above the second conductive layer, a second via passing through the first opening, and an antenna provided above the third conductive layer. A dielectric is provided between the second conductive layer and the semiconductor device, between the third conductive layer and the second conductive layer, and between the antenna and the third conductive layer. The second conductive layer includes a first opening. The second via connects the third conductive layer and the first conductive layer.

Antenna device

A liquid discharge head includes a print element substrate provided with discharge ports, through which liquid is discharged; and a support member having a liquid chamber, which is provided with a communicating opening that communicates with the discharge ports, wherein the liquid chamber has a first surface provided with the communicating opening, and a second surface facing the first surface, the second surface is provided with a buffer chamber, which is a hollow space for storing gas, and the buffer chamber has, in the second surface, an opening having a projecting portion projecting toward the inner side of the opening.

Liquid discharge head

Provided is a liquid ejection head, including: an ejection unit including: a recording element substrate including a plurality of recording elements configured to generate energy; and a support member formed of a plate-like member and configured to support the recording element substrate, the support member including: a liquid chamber configured to store liquid therein, and an inlet formed in the liquid chamber so as to allow the liquid to flow into the liquid chamber; a flow path unit including a liquid path through which the liquid is supplied into the ejection unit from a liquid tank storing the liquid therein; a joint member sandwiched between the support member and the flow path unit and configured to seal the liquid; and a buffer chamber formed in a space defined by the joint member, the ejection unit, and the flow path unit and configured to retain gas therein.

Liquid ejection head

A semiconductor device includes a first semiconductor unit including a plurality of first semiconductor chips, an organic resin provided between the first semiconductor chips, a wiring layer provided above the first semiconductor chips to electrically connect the first semiconductor chips to each other, and a plurality of connecting terminals provided on an upper portion of the wiring layer and a second semiconductor unit fixed to a wiring layer side of the first semiconductor unit, the second semiconductor unit fixed to a region sandwiched between the connecting terminals, the second semiconductor unit having a second semiconductor chip, the second semiconductor unit electrically connected to the first semiconductor unit.

Semiconductor device having semiconductor chips in resin and electronic circuit device with the semiconductor device

A semiconductor device includes a first conductive portion, a second conductive portion, a first layer, and a second layer. The first conductive portion includes a first end portion and a first extending portion. The first extending portion extends in a first direction. The length of the first extending portion in a second direction is shorter than a length of at least a part of the first end portion in the second direction. The first layer includes multiple semiconductor chips, multiple passive chip components, and a resin. The first extending portion includes a first portion and a second portion. The first layer is provided around the first portion. The first layer expands along a first plane. The first plane intersects the first direction. The second layer includes a first multilayer wiring. The second layer expands along a second plane intersecting the first direction.

Semiconductor device having a cylindrical shaped conductive portion

A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.

Connection member, semiconductor device, and stacked structure

A semiconductor device according to an embodiment includes a semiconductor chip, a cap disposed to face the semiconductor chip, and having a through-hole electrode arranged in a through hole, and a bump electrode provided between the semiconductor chip and the cap, wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through-hole electrode, and wherein at least a portion of the bump electrode is included in the through-hole electrode, and electrically connected thereto, so that the adhesive performance between the cap and the bump electrode can be increased.

Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap

An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the first insulating layer, a second metal patch provided on the first insulating layer, a second insulating layer provided on the first and second metal patches, an interconnect layer provided on the second insulating layer, a third insulating layer provided on the interconnect layer, a first via connected to the electrode plane and the first metal patch, and a second via connected to the electrode plane and the second metal patch. The second metal patch is separately adjacent to the first metal patch. The interconnect layer has a first opening and a second opening. The first via penetrates through the first opening. The second via penetrates through the second opening.

EBG structure, semiconductor device, and circuit board

According to an embodiment, a semiconductor device comprises an insulative resin, an interconnect, a plurality of semiconductor elements, a first conductive unit, a first connector, and a first metal layer. The insulative resin includes a first region and a second region. At least a portion of the interconnect is arranged with at least a portion of the first region in a first direction. The first conductive unit pierces the second region in the first direction. At least a portion of the first connector is arranged with at least a portion of the first conductive unit in the first direction. At least a portion of the first connector is arranged with at least a portion of the interconnect in a second direction intersecting the first direction. The first metal layer is provided between the first conductive unit and the first connector. The first metal layer contacts the insulative resin.

Plurality of semiconductor devices in resin with a via

The invention provides a liquid ejection head equipped with an energy generating element generating energy utilized for ejecting a liquid, a liquid supply port provided at a surface on which the energy generating element is provided for supplying the liquid to the energy generating element, a liquid flow path for supplying the liquid to the energy generating element from the liquid supply port and a rib extending from the liquid supply port toward an inlet of the liquid flow path, wherein an end portion of the rib on the side of the liquid flow path is provided at a position deviated from a center line of the liquid flow path.

Mobile nodes are allowed to move around within an intermittent communication environment. A mobile node wirelessly communicates with an access node when approaching the access node, and stores data. The access node stores an action history for each mobile node, and generates a forwarder list in association with a destination node, based on action histories of the mobile nodes. The forwarder list stores one or more identifies each identifying a first mobile node in the order of an arrival probability indicating a probability that the first mobile node succeeds in delivering the data to the destination node. The access node selects second mobile nodes that are to carry the data to the destination node, based on the forwarder list, and transfers the data to one of the second mobile nodes when a communication link is established between the access node and the one of the second mobile nodes.

System and method for delivering data in an intermittent communication environment

Growing community of inventors

Yokohama, Japan

Hiroshi Yamada