Kyocera Corporation

Unitika Ltd.

Nintendo Co., Ltd.

Suntory Holdings Limited

Hiroshi Yamada

Akihiko Funahashi

Yoshiaki Echigo

Isao Tomioka

Yoshiaki Iwaya

Takuji Okamura

Tomokazu Matsue

Yousuke Moriyama

Daiji Imai

Isamu Uchida

Shoji Okamoto

Minoru Saito

Takahito Kita

Hsien-Chang Chang

Akinori Ueno

Motomasa Kondo

Ryu Nadatani

Yasuyuki Kusui

Naoko Tanase

Daiji Haruna

An electronic element mounting substrate includes: a first wiring substrate configured to be a frame defining an interior portion as a first through-hole, the first wiring substrate including a lower surface including an external circuit connection electrode; a metal plate disposed on the lower surface of the first wiring substrate so as to cover an opening of the first through-hole, an outer edge thereof being located between an outer edge of the first wiring substrate and an inner edge of the first wiring substrate, an electronic element mounting portion being disposed in a region of an upper surface of the metal plate which region is surrounded by the first wiring substrate; and a second wiring substrate which is disposed in a peripheral region of the metal plate on the lower surface of the first wiring substrate and is electrically connected to the external circuit connection electrode.

Electronic element mounting substrate and electronic device

A substrate for mounting an imaging element is a substrate for mounting an imaging element that includes a base. The base has: a through-hole having an opening in a top surface of the base; a cover mounting region provided on the top surface, in a rim of the opening of the through-hole; a lens-housing mounting regionprovided on the top surface, on an outer side of the cover mounting region; an intermediate region provided on the top surface, between the cover mounting region and the lens-housing mounting region; a connecting section that enables the intermediate region to communicate with an inside wall of the through-hole; and an imaging element mounting section provided on a bottom surface of the base.

Substrate for mounting imaging element, and imaging device

There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet.

Substrate for mounting electronic element and electronic device

An imaging device accommodating package includes an insulating base body and an imaging device connecting pad. The insulating base body includes a lower surface, a through-hole and a bonding area on the bottom surface of the recess. The lower surface includes a recess. The through-hole is formed in a bottom surface of the recess in a perspective plan view. The bonding area is used for an imaging device. The imaging device connecting pad is formed on an upper surface of the insulating base body or on an inner surface of the through-hole.

Image pickup element housing package, and image pickup device

A display control program executed on a computer of a display having a first display portion capable of providing stereoscopic display and a second display portion configured to provide two-dimensional display is provided. The display control program includes object display instructions for controlling the first display portion and the second display portion such that a plurality of objects are displayed at respective arrangement positions set by arrangement position setting instructions and an object group is displayed across the first display portion and the second display portion. The object display instructions include instructions for determining on which of the first and second display portions objects included in the object group are to be displayed, and for providing stereoscopic display of an object determined to be displayed on the first display portion and providing two-dimensional display of an object determined to be displayed on the second display portion.

Storage medium encoded with display control program, display, display system, and display control method

A wrapping member attaching device for attaching a wrapping member to a container includes a container preheating device, a wrapping member arranging device, and a wrapping member heating device. Due to the foregoing, the wrapping member is attached to the container without being tilted, wrinkles and unevenness of color. The container preheating device may include a container rotating device.

Wrapping member attaching method and wrapping member attaching device

This invention provides a poly(amic acid) solution which does not contain aprotic polar solvents such as DMF, NMP, DMAc, DMSO, as well as a polyimide film obtained therefrom having appropriate flexibility and a small coefficient of linear thermal expansion and a coated material in which the polyimide film is formed on a substrate. More particularly, it provides a poly(amic acid) solution which has an aromatic poly(amic acid) and a tertiary amine as the solute and a water soluble alcohol compound and/or a water soluble ether compound as the solvent and contains substantially no aprotic polar solvent, as well as a polyimide film obtained from the poly(amic acid) solution and a coated material obtained by forming the film on a substrate.

Poly(amic acid) solution and polyimide film or polymide-coated material

A film forming solution which does not require aprotic polar solvents, a porous film of poly(4,4'-oxydiphenylenepyromellitimide) obtained from the film forming solution which has excellent heat and chemical resistances, which is controllable in terms of porosity and pore size of the film and which has excellent electrical characteristics, and a coated material where the porous film is formed on a base material. Particularly, a film forming solution of a precursor of poly(4,4'-oxydiphenylenepyromellitimide) and a mixture of at least three solvents which are poor solvents for the precursor when each solvent is used alone, a porous film of poly(4,4'-oxydiphenylenepyromellitimide) obtained from the film forming solution and a coated material where the porous film is formed on a base material.

Film forming solution, porous film obtained therefrom and coated

A conjugated enzyme electrode comprising diaphorase and an amino-acid dehydrogenase immobilized on a conductive support by a polyfunctional aldehyde is disclosed, by which amino acids can be rapidly determined with high sensitivity.

Growing community of inventors

Kyoto, Japan

Hiroshi Yamada