Agc Inc.

Sumitomo Bakelite Company Limited

Hiroshi Utsugi

Yasunori Ito

Koji Nakamura

Yoshiyuki Takahashi

Masao Ikeda

Yasuaki Watanabe

Etsuro Yamabe

Hideaki Matsunami

Yuki Hori

Takuya Hayashi

Tsubasa Kondo

Yuki Tateyama

An endoscopic clip device including a clip, a treatment instrument body comprising a sheath, an operation wire, and a distal connection portion, a sleeve accommodated inside the sheath and accommodating the connection portion in distal portion of the wire such that portion of inner diameter of the sleeve is smaller than outer diameter of the locking portion when the connection portion is drawable from the accommodation portion. The sleeve has diameter enlargement portion on distal side of the sleeve and elastically self-openable, a diameter reduction step portion on proximal side of the enlargement portion, and a sleeve body positioned on the proximal side of the enlargement portion from the step portion and having radial rigidity higher than that of the enlargement portion, and the inner diameter of the sleeve body is smaller than the outer diameter of the locking portion when the connection portion is drawable from the accommodation portion.

Endoscopic clip device and clip

A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substratealong the direction in which delamination progresses.

Device for delaminating laminate, delamination method, and method for manufacturing electronic device

In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.

Method for creating separation start portion for layered bodies, device for creating separation start portion, and electronic device manufacturing method

The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity.

Resin compact, method for producing resin compact, resin composition, method for producing resin composition and electronic component device

Growing community of inventors

Tokyo, Japan

Hiroshi Utsugi