Kabushiki Kaisha Shinkawa

Kabushiki Kaisha Toshiba

Tosbac Computer System Company Limited

Tokyo Shibaura Denki Kabushiki Kaisha

Hiroshi Ushiki

Kazuo Sugiura

Hirofumi Moroe

Tetsuaki Iwasaki

Koichi Takahashi

Nobuto Yamazaki

Kenji Kitakubo

Takashi Endo

Akira Masuda

Yoshimitsu Terakado

Minoru Torihata

Tooru Mochida

Yuji Ohashi

Noboru Fujino

Shigeru Shiozawa

Eiichi Munetsugu

Tetsuya Kobaru

Kenji Katakubo

Hiroyuki Matuno

Kazunori Ota

Mikiya Yamazaki

A plate-form member conveying apparatus that includes an upper claw and a lower claw for clamping a plate-form member in between from above and below and conveying the plate-form member, in which each of the upper claw and the lower claw is formed by a clamping plate made of an elastic material and brought into contact with an upper or lower surface of the plate-form member, and a claw holding plate and a claw counter plate that sandwich the clamping plate; and the clamping plate and claw holding plate are detachably fastened by bolts to the claw counter plate.

Conveying apparatus for plate-form members

Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Method and apparatus for positioning a semiconductor pellet

A tension mechanism that applies a back tension to a wire in a bonding apparatus including: a first nozzle which has a through-hole through which the wire passes, second and third nozzles which have diameters that are larger than the diameter of the through-hole of the first nozzle and which are disposed above and below the first nozzle, a first air passage formed in the joining surfaces of the first nozzle and second nozzle, and a second air passage formed in the joining surfaces of the second nozzle and third nozzle. A compressed air supply device is connected to the tension mechanism and supplies compressed air to the first air passage from an air supply source, and a vacuum suction device is also connected to the tension mechanism and applies vacuum suction to the second air passage from a vacuum supply source.

Wire bonding apparatus

Apparatus for positioning a semiconductor pellet

There is provided a low power consumption liquid crystal driving circuit which is able to achieve reduction in the power consumption. In this liquid crystal driving circuit, first charges are supplied to a charge pump capacitor,by connecting one end of the capacitor,to an output of a first regulator and other end of the capacitor,to an output of the second regulator. Then, the capacitor,can be connected in parallel with any one of charge storage capacitors,to,by controlling ON/OFF of analogue switches,to,based on the time division signals &phgr; A to &phgr; E. Then, charges in the capacitor,are supplied to the selected charge storage capacitor to generate a liquid crystal driving intermediate potential.

Liquid crystal driving circuit

A bump bonding apparatus comprising: a loader section that holds trays which accommodate semiconductor pellets and an unloader section that holds trays which accommodate semiconductor pellets to which bumps have been applied, the loader and unloader sections being provided next to each other on one side of a bonding stage; a buffer station and a supply and holding station provided so as to positionally correspond to the loader section and unloader section, respectively; a first pusher for sending trays from the loader section to the buffer station, a second pusher for sending trays from the supply and holding station to the unloader section, a third pusher for sending trays from the buffer station to the supply and holding station, and a pellet transfer mechanism for picking up a semiconductor pellet in the tray in the supply and holding station, transferring it to the bonding stages and then returning the semiconductor pellets to which bumps have been applied on the bonding stages back to the tray in which the semiconductor pellet has been accommodated.

Bump bonding apparatus

In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed.

Bonding apparatus

A substrate transporting device used in the process of manufacturing, for instance, semiconductor chips including a substrate guide comprised of a substrate guide rail which guides one side of each substrate and a substrate supporting plate which supports another side of the substrate, feeding claws for feeding a substrate to, for instance, a bonding position, the feeding claws being provided on a feeding claw holder and extending in the direction perpendicular to the substrate supporting plate, a claw X-direction feeder which moves the feeding claw holder in a direction in which the substrate is conveyed along the substrate guide, and a claw Y-direction feeder which moves the feeding claw holder in a direction perpendicular to the direction in which the substrate is conveyed along the substrate guide; thus, the substrates are conveyed one pitch at a time by means of a rectangular motion of the feeding claws on a horizontal plane effected by the claw X-direction feeder and the claw Y-direction feeder.

Substrate transporting device

A conveyor system used in semiconductor manufacturing line, etc. including guide rails which guide workpieces in one direction and a pair of magazine stackers for workpieces installed at both ends of the workpiece guide rails and has magazine guide rails, in which the workpiece guide rails and magazine guide rails are movable in a direction perpendicular to a workpiece feed direction and are connected via a connecting assembly so that the workpiece guide rails and magazine guide rails are moved together.

Conveying devices used in a semiconductor assembly line

In a lead frame conveying device for bringing lead frames into a storage magazine, a pusher claw is swingably mounted to a claw mover. When a lead frame is brought into the magazine, the claw mover moves towards the magazine, and this releases an engagement of the pusher claw with a stopper; as a result, the pusher claw swings down (by its own weight) so that the tip end of the push claw comes into contact with the trailing edge of the lead frame so that the pusher claw pushes the lead frame completely into the magazine.

Pushing mechanism in a lead frame conveying apparatus

An apparatus for feeding plate-form parts such as lead frames used in, for example, semiconductor assembling machines including a plurality of frame feeder which have upper and lower claws for feeding the plate-form parts, a slider to which the frame feeder is mounted, a moving piece connected to the slider, a drive shaft screw-engaged with the moving piece, and a claw moving motor which rotates the drive shaft and therefore moves the moving piece. The feeding apparatus of this invention allows the drive shaft which moves the frame feeder to be shorter than in conventional apparatus so that each frame feeder can be fed with high precision.

Apparatus for feeding plate-form parts

A calculation method suitable for use in statistics calculations and a calculator using the method are disclosed. The method has the steps of storing a memory content from a memory in a first register of a calculation circuit; storing input data in a second register of the calculation circuit; performing a calculation on the contents of the first register and the second register, and storing the result of the calculation in the first register; determining that the calculation result stored in the first register has not overflowed; transferring the content of said first register to the memory and overwriting the memory content therewith, if the calculation result has not overflowed after the processes have been repeated a specified number of times. The calculator has an input section for inputting data; a calculation section for performing a specified calculation on the data; an overflow determination section for determining whether or not a calculation result that is the result of the calculation has overflowed; a calculation totalling section for determining whether or not the calculation has been performed a specified number of times; and a memory section for storing the calculation result obtained by the calculation means, if the calculation totalling means has determined that the calculation has been performed the specified number of times.

Overflow detection calculator and method of overflow determination

A lead frame holding apparatus for wire bonding machines forcing an upward movement of a heater block and a frame retainer by a heater block raising-and-lowering cam and a frame retainer raising-and-lowering cam and a downward movement of the heater block and frame retainer via a spring force. When the heater block is raised and approaches its upper limit position, the frame retainer is raised by this upward motion of the heater block, thus positioning the lead frame at a standard bonding level.

Lead frame holding apparatus for use in wire bonders

A workpiece supply device used in semiconductor assembly machines such as wire bonding device, pellet bonding device, etc. including an elevator section having an elevator table that is raised and lowered and carries a magazine accommodated therein plate-form workpieces, a magazine stacker which guides the magazine, and a pusher assembly including a pusher arm pushing the workpiece out of the magazine one at a time. The magazine stacker is made up with a fixed guide and a movable guide. The movable guide is adjustable size wise in a direction wherein the workpiece is pushed out, and the pusher device is provided on the movable guide. Power source for the pusher device is installed parallel to the workpieces piled up in the magazine.

Supply device used in a semiconductor assembly apparatus

A bonding height detecting device used in a wire bonding machine which includes a rotatable axle provided on a bonding head, a moving block pivotally mounted on the rotatable axle, a bonding arm fixed on the rotatable axle, and a bonding tool attached to one end of the bonding arm through which a bonding wire is passed. The detecting device includes a lever fixed on the rotatable axle and having a first stopper and a detecting surface, a second stopper fixed on the moving block so that the second stopper is urged to contact the first stopper, a sensor fixture attached to the second stopper, and a proximate sensor mounted on the sensor mixture and facing the detecting surface of the lever.

Growing community of inventors

Iruma, Japan

Hiroshi Ushiki