Towa Corporation

Fujitsu Corporation

Hiroshi Uragami

Tsuyoshi Amakawa

Muneo Miura

Hirokazu Okada

Shinji Takase

Noboru Hayasaka

Toru Nishino

Osamu Nakagawa

Koichi Meguro

Kinya Fujino

Hideki Tokuyama

The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.

Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member

The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate, a chip(s), a resin, a plate-like memberhaving a surface(s), a bump(s)that includes a deformable portionA, and a wiring pattern. The method includes: disposing the chip(s)on the surface(s); and encapsulating the bump(s)in the resin. The encapsulating includes: encapsulating the chip(s)in the resinbetween a bump-formed surface of the plate-like memberon which the bump(s)is formed and a wiring pattern-formed surface of the substrateon which the wiring pattern is formed; and causing the bump(s)to be in contact with the wiring pattern

Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

Growing community of inventors

Kyoto, Japan

Hiroshi Uragami