Nippon Gasket Company, Ltd.

Sumitomo Electric Industries, Limited

Aisin Seiki Kabushiki Kaisha

Toyota Jidosha Kabushiki Kaisha

Toyota Jidosha Kogyo Kabushiki Kaisha

Kobe Steel, Ltd.

Tsubaki Nakashima Co., Ltd.

Nikkato Corporation

Kabushiki Kaisha Kobe Seiko Sho

Rohto Pharmaceutical Co., Ltd.

Hiroshi Uemura

Keiji Tanaka

Fumio Fujimori

Kunitoshi Inoue

Juichi Shibatani

Toshio Kondo

Yoshikazu Shinpo

Yoshiharu Adachi

Masakazu Ishikawa

Akira Shirai

Kenji Kubouchi

Kazuya Nakata

Masahiko Miura

Shigeru Kawaguchi

Kaoru Tsubouchi

Hiroshi Onishi

Hiroshi Ikeda

Hiroshi Sugitatsu

Taichi Misawa

Tomoyoshi Ogaeri

Kazukuni Takada

Kazuaki Sugimura

Masatada Yokoi

Hideki Ono

Hiroki Takimoto

Kenji Yamada

Hiroyuki Matsuyama

Kazukuni Takata

Takao Harada

Isao Kobayashi

Kazuya Yoshijima

Hidetoshi Tanaka

Tomoyuki Nogami

Hiroyuki Oka

Sumito Hashimoto

Toshiyuki Okumura

Takeo Yamazaki

Kiyoshi Sugimoto

Itsuo Miyahara

Yutaka Furuta

Akiyoshi Hirai

Tomio Tachino

Naoki Ii

Kenji Ishida

Yoichi Honma

Masashi Ban

Takuya Inaba

Kazuyuki Geshi

Yuji Fukui

Harumi Oohori

Yoshihiro Nakagiri

Kazuaki Kikuchi

Satoshi Inaoka

Shuichi Tsunetsugu

Yoshinori Habuta

An optical module includes: a housing having a first face and a second face parallel to the first face; a first block fixed to the first face of the housing by a first adhesive; an integrated circuit (IC) fixed to the first block by a second adhesive having a thickness larger than a thickness of the first adhesive; a thermoelectric cooler (TEC) fixed to the second face of the housing; an optical circuit element fixed to the TEC; and an interconnection board mounted on the IC and the optical circuit element, the interconnection board being configured to electrically couple the IC to the optical circuit element. The first block is sandwiched between the housing and the IC. The TEC is sandwiched between the housing and the optical circuit element.

Optical module and manufacturing method of optical module for optical communication

An output circuit includes: an inductor, an amplifier circuit that outputs an output signal via the inductor, an output terminal that outputs the output signal to an outside, a voltage divider circuit including a series circuit constituted by a first capacitive element and a second capacitive element connected in series to the first capacitive element, the series circuit generating a first voltage-divided signal by dividing a voltage of the output signal, a first band-adjusting element having a resistance component for generating a first band-adjusted signal by adjusting frequency characteristics of the first voltage-divided signal, and a first peak detection circuit that detects a peak voltage of the first band-adjusted signal and output a first peak voltage in accordance with the detected peak voltage.

Output circuit with peak voltage detection

According to one embodiment, an optical module includes: a lid having a first face and a second face, the lid including a bump, a wiring, and a through via; an optical circuit element; a first integrated circuit (IC); a first block bonded to the first IC by a first adhesive; a temperature control element bonded to the optical circuit element; and a housing having an opening and a third face provided inside the opening, the housing being configured to house the first IC, the optical circuit element, the first block, and the temperature control element, the third face being bonded to the first block and the temperature control element by a second adhesive, the housing being hermetically sealed with the lid.

A variable gain amplifier circuit includes first and second input terminals, first and second output terminals, first and second transistors respectively having bases electrically connected to the first and second input terminals and having collectors electrically connected to the first and second output terminals, and a degeneration circuit connected between emitters of the first and second transistors. The degeneration circuit has first and second MOS transistors each having two current terminals connected in series between the emitters of the first and second transistors, series resistor circuits, first and second current sources, two resistive elements connected between the first and second current sources and gates of the first and second MOS transistors, and two resistive elements connected between the first and second current sources and two nodes of the series resistor circuits.

Variable gain amplifier circuit and semiconductor integrated circuit

An electrostatic protection circuit includes first and second output terminals, a first diode circuit connected between the first output terminal and a common node, a second diode circuit connected between the second output terminal and the common node, an intermediate voltage circuit that is connected between the first output terminal and the second output terminal and that is configured to generate, at the common node, an intermediate voltage having an intermediate voltage value between a voltage value of the first output terminal and a voltage value of the second output terminal, and a clamp circuit configured to electrically connect the common node to a ground line in accordance with the intermediate voltage.

Electrostatic protection circuit and semiconductor integrated circuit

A driving circuit includes first and second input signal terminals, first and second output signal terminals, constant current sources, first and second transistors having control terminals connected to the first and second input signal terminals, third and fourth transistors each having a control terminal to which a first bias voltage is applied, first and second inductors each having a first inductance, and third and fourth inductors each having a second inductance larger than the first inductance. The driving circuit further includes fifth and sixth transistors each having a control terminal to which a second bias voltage is applied, outflow terminals connected to inflow terminals of the third and fourth transistors via the first and second inductors, and inflow terminals connected to the first and second output signal terminals via the third and fourth inductors.

Driving circuit and semiconductor integrated circuit for use in an optical communication device

An electrostatic protection circuit includes first and second output terminals, a first diode circuit connected between the first output terminal and a first node, a second diode circuit connected between the second output terminal and the first node, a first intermediate voltage circuit that is connected between the first output terminal and the second output terminal and that is configured to generate, at a second node different from the first node, a first intermediate voltage having an intermediate voltage value between a voltage value of the first output terminal and a voltage value of the second output terminal, a detection circuit configured to generate a trigger signal in accordance with the first intermediate voltage, and a switch circuit configured to electrically connect the first node to a ground line in accordance with the trigger signal.

An amplitude modulation circuit includes: first, second, and third input terminals; first and second output terminals; a current source; first and second transistors including a base electrically connected to the first and second input terminals, a collector electrically connected to the first and second output terminals, and an emitter electrically connected to a grounding terminal via the current source; first and second resistive elements electrically connected between the first and second output terminals and a power line; and a first MOS transistor including a drain connected to the first output terminal, a source connected to the second output terminal, and a gate connected to the third input terminal. The MOS transistor is configured to operate in a non-saturated region, and a resistance between the source and the drain of the MOS transistor is larger than resistances of the first and second resistive elements.

Amplitude modulation circuit and semiconductor integrated circuit for optical communication system

Provided are a sintered ceramic and a ceramic sphere which are inhibited from suffering surface peeling due to fatigue resulting from repetitions of loading and can attain an improvement in dimensional accuracy when subjected to surface processing and which have excellent wear resistance and durability.

Sintered ceramic and ceramic sphere

Provided are a sintered ceramic and a ceramic sphere which are inhibited from suffering surface peeling due to fatigue resulting from repetitions of loading and can attain an improvement in dimensional accuracy when subjected to surface processing and which have excellent wear resistance and durability. A ceramic-sphere inspection device is also provided with which a ceramic sphere is inspected for a flaw present in the surface layer and for snow flakes without destroying the ceramic sphere. The device is a ceramic-sphere inspection device () in which a ceramic sphere (S) is rotatably supported in a given position and illuminating light emitted from a light projector () is detected with a light receiver () to evaluate the state of the inner part of the surface layer, and has been configured so that the light receiver () does not detect the light emitted from the light projector () and reflected at the surface of the ceramic sphere.

Device for inspecting ceramic sphere

The present invention provides a method for efficiently manufacturing a titanium oxide-containing slag from a material including titanium oxide and iron oxide, wherein a reduction of titanium dioxide is suppressed and the electric power consumption is minimized. The method includes the steps of: heating a raw material mixture including titanium oxide, iron oxide, and a carbonaceous reductant, or the raw material mixture further including a calcium oxide source, in a reducing furnace; reducing the iron oxide in the mixture to form reduced iron; feeding the resultant mixture to a heating melting furnace; heating the resultant mixture in the heating melting furnace to melt the reduced iron and separate the reduced iron from a titanium oxide-containing slag; and discharging and recovering the titanium oxide-containing slag out of the furnace.

Method for manufacturing titanium oxide-containing slag

The present invention relates to a novel peptide having a specified amino acid sequence or its derivative, or a salt thereof. Further, the present invention relates to a composition containing the novel peptide or the like, a method of utilizing the novel peptide or the like, use of the novel peptide or the like, a polynucleotide encoding the novel peptide, or the like. The novel peptide of the present invention or its derivative, or a salt thereof can be utilized for enhancing production of at least one member selected from the group consisting of collagen and hyaluronic acid in a cell.

Peptides that increase collagen or hyaluronic acid production

An annular rail is fixed on the lower surface of a moving hearth , and the rail is supported from below by support rollers provided with elevating devices . The moving hearth is continuously or intermittently moved downward by the elevating devices depending on the thickness of a metal oxide layer formed by the deposition of powder of metal oxide agglomerates mixed into the furnace together with the metal oxide agglomerates so that a gap is provided between the surface of the metal oxide layer and the edge of the blade of a discharge screw during operation. A means for preventing the formation of a metal plate and a method for operating the same are provided instead of a means and method including the vertical movement of a discharger for reduced metal, so that the maintenance work can be significantly reduced in a moving-hearth heating furnace, in which metal oxide agglomerates containing a carbonaceous material is placed on a moving hearth, the metal oxide agglomerates are heated and reduced to form reduced metal agglomerates, and the reduced metal agglomerates are discharged from the furnace by a discharger to produce reduced metal.

Moving-hearth heating furnace and method for making reduced metal agglomerates

A metal gasket used in an engine with a chain case, using a foam-rubber seal member shaped to withstand in practical use and having excellent long-lasting reliability and excellent durability. A total constitutive plate of the metal gasket is extended along the chain case to form an extended part. This extended part has a chain case hole. The foam-rubber seal member seals a chain case opening and a three-surface joining portion defined by the chain case, a cylinder block and a cylinder head. The foam-rubber seal member is a separate and distinct member and is a sheet-like and loop-like combination of layers of foam rubber and a metal core plate interposed between these foam rubber layers.

Metal gasket for use in engine with chain case

In a method for making molten metal, reduced metal which is produced in a direct reduction furnace is melted in a melting furnace located in the close vicinity of the direct reduction furnace to produce the molten metal. The method includes the steps of putting the reduced metal into a metallic container, and loading the container containing the reduced metal into the melting furnace. The method may further includes, before the step of loading the container containing the reduced metal into the melting furnace, a step of cooling the surface of the container so that the surface temperature of the container is 500&deg; C. or less.

Method for making molten metal

Growing community of inventors

Osaka, Japan

Hiroshi Uemura