Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Minolta Company, Ltd.

Idemitsu Kosan Company, Limited

Dow Toray Co., Ltd.

Dow Corning Toray Silicone

Hiroshi Ueki

Yoshitsugu Morita

Haruhiko Furukawa

Minoru Isshiki

Koji Nakanishi

Koji Shiromoto

Tomoko Kato

Tadashi Okawa

Hidekatsu Hatanaka

Kazuo Kobayashi

Hideaki Yasunaga

Hiroyuki Fukuda

Hiroji Enami

Makoto Kobayashi

Hiroshi Fukui

Masaaki Amako

Takaaki Hikosaka

Tomoharu Nishikawa

Koichi Takenaka

Shuji Sakamoto

Yoshinori Taniguchi

Kyoko Toyama

Akihiro Nakamura

Atsushi Togashi

Norihisa Kishimoto

Ryuko Manzoji

Yasuaki Horikawa

Osamu Tanaka

Provided is a curable organopolysiloxane composition for forming a film, which has low viscosity before curing, has excellent mechanical strength and dielectric breakdown strength after curing, and can provide a uniform and thin organopolysiloxane cured film. The curable organopolysiloxane composition comprises: a curing reactive organopolysiloxane, a curing agent, (D1) reinforcing fine particles having a BET specific surface area exceeding 100 m/g, which have been surface treated with an organic silicon compound, and (D2) reinforcing fine particles having a BET specific surface area within a range of 10 to 100 m/g, which have been surface treated with an organic silicon compound. The mass ratio of components (D1) and (D2) is within a range of 50:50 to 99:1, and the sum of components (D1) and (D2) is within a range of 10 to 40 mass %. A method of manufacturing an organopolysiloxane cured film using the curable organopolysiloxane composition is also provided.

Curable organopolysiloxane composition for forming films, and method for producing organopolysiloxane cured film

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein Rdesignates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; Rdesignates identical or different, substituted or unsubstituted alkylene groups; Rdesignates substituted or unsubstituted monovalent hydrocarbon groups; Rdesignates alkyl groups or hydrogen atoms; 'a' is a positive number that satisfies the following condition: 0=a=3; and 'x', &#x2018;y&#x2019;, and &#x2018;z&#x2019; are positive numbers that satisfy the following conditions: 0&#x3c;x&#x3c;0.1; 0&#x3c;y&#x3c;1; 0=z&#x3c;0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.

Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition

A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups that react with the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity.

Curable silicone composition and cured product thereof

A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (RSiO)(RSiO)(RSiO)(SiO)(wherein R, R, and Rare each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of Rare aryl groups, and a, b, c, and d are numbers that satisfy 0&#x2266;a&#x2266;0.8, 0&#x2266;b&#x2266;0.8, 0.2&#x2266;c&#x2266;0.9, 0&#x2266;d&#x3c;0.8, and a+b+c+d=1), and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a compound that has a group capable of reacting with the epoxy group; (C) a cure accelerator; and (D) a thermally conductive filler, has excellent handling characteristics and that cures rapidly to give a cured product that is highly thermally conductive, very flexible, highly adhesive, and very flame retardant.

Curable silicone composition and cured product therefrom

A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 &#x3bc;m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.

Curable epoxy resin composition and cured product thereof

A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor

An adhesion-promoting agent represented by the following average formula: RSiO(where Ris a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R; and 'a' is a number that satisfies the following condition: 1.0&#x2266;a&#x3c;4) is a novel adhesion-promoting agent, and a curable organopolysiloxane composition that contains the aforementioned adhesion-promoting agent, has excellent adhesion to various organic-resin substrates and suitable for forming a cured body having high refractive index and high light transmissivity.

Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device

A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Curing silicone composition and cured product thereof

A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO)[RSiO](where R represents a cycloalkyl group, and Rrepresents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one Rin one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0&#x3c;a&#x2266;3; x&#x3e;0; y&#x3e;0; and x+y=1).

Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter

A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [RSiO][RSiO][RSiO](where R, R, and Rare univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of Rare aryl groups; a+b+c equals 1; on average, 'a' satisfies the following condition: 0&#x2266;a&#x2266;0.8; on average, 'b' satisfies the following condition: 0.2&#x2266;b&#x2266;0.8; and, on average, &#x201c;c&#x201d; satisfies the following condition: 0.2&#x3c;c&#x3c;1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.

Silicone resin composition, curable resin composition, and curable resin

A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Curable epoxy resin composition

A flame-retardant thermoplastic resin composition comprising (A) 100 weight parts of a thermoplastic resin, (B) 10 to 300 weight parts of particulate metal hydroxide; (C) 0.01 to 50 weight parts of a branched polyorganosiloxane having alkoxy groups and described by average unit formula R (R O) SiO , where R and R are monovalent hydrocarbon groups selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number; b is a positive number; and a&plus;b is a number from 0.75 to 2.5; (D) 0.01 to 50 weight parts of a branched polyorganosiloxane having silanol groups and described by average unit formula R (HO) SiO , where R is a monovalent hydrocarbon group selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number, b is a positive number, and a&plus;b is a number from 0.75 to 2.5; and (E) 0.01 to 10 weight parts of a condensation reaction promoting catalyst. The present invention further relates to a method for manufacturing the flame-retardant thermoplastic resin composition.

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Ichihara, Japan

Hiroshi Ueki