Mitsubishi Denki Kabushiki Kaisha

Advanced Display, Inc.

Mitsubishi Electric Corporation

Hiroshi Ueda

Hitoshi Morishita

Shigeaki Noumi

Hirofumi Iwanaga

Kenichi Watanabe

Yuichi Masutani

Takehisa Yamaguchi

Seiji Takaki

Hiroshi Tachibana

The object of the present invention is to provide a technic for accurately measuring a connection state between a flexible board and a circuit board. A measurement apparatus includes a flexible board connected to a plurality of electrode terminals in a state of being superimposed on the plurality of electrode terminals provided on a circuit board, and a laser displacement meter configured to measure a height distribution of a surface of a connection portion of the plurality of electrode terminals of the circuit board. The plurality of electrode terminals are linearly arranged at a predetermined pitch, and the laser displacement meter is configured to continuously measure a height position of the surface of the connection portion while scanning from one side to an other side in an arrangement direction of the plurality of linearly arranged electrode terminals.

Measurement apparatus, circuit board, display device, and measurement method

A display device comprises a metallic wiring formed on an insulating substrate, an inorganic insulating film formed on the metallic wiring, an organic resin film formed on the inorganic insulating film, a transparent conductive film formed in a portion on the metallic wiring where the inorganic insulating film and the organic resin film are removed, a connection terminal formed in a region for mounting a driving IC external to the display region on the insulating substrate, and a bump of the driving IC connected to the connection terminal by an anisotropic conductive film in order to supply a signal to the display region. The region for mounting a driving IC includes a region where the inorganic insulating film and the organic resin film are formed on the metallic wiring and a region where the inorganic insulating film and the organic resin film are removed from the metallic wiring.

Display device

The present invention provides a display device which has a narrow screen border, and excellent display equality. The display device according to the present invention comprises a display panel comprising a glass substrate and a source driver IC which is provided along the edge of the glass substrate. The FPC is connected between the source driver ICs. At the substrate end side of the source driver IC, a bump for GND, a bump for analog power supply, a bump for digital power supply, a bump for reference voltage at the positive polarity side, and a bump for reference voltage at the negative polarity side are formed sequentially from the outer side along the flow of current. These bumps for input and the FPC are connected with the lines for input on the glass substrate. The logic signal lines and are formed along the short side of the source driver IC and along the long side at the display area side.

An object of the present invention is to provide an image display device that is free from disconnection in a connection structure between given substrates even when operated in a hot and humid environment. An image display device according to a preferred embodiment of the invention has a TFT substrate and an FPC. The TFT substrate has a plurality of first terminals capable of application of potential. The FPC has second terminals that are connected respectively with the first terminals through an anisotropic conductive film and that are thicker than the first terminals. The second terminals include a high-potential terminal, a low-potential terminal, and a dummy terminal. The high-potential terminal is supplied with a relatively high potential that contributes to the display operation. The low-potential terminal is supplied with a relatively low potential that contributes to the display operation. The dummy terminal is positioned between the high-potential terminal and the low-potential terminal and is supplied with a potential not contributing to the display operation.

Image display device

The present invention provides a flexible printed circuit that is less likely to suffer from erosion (corrosion) of electrode terminals even in severe environments and a display device using the flexible printed circuit. According to the present invention, a flexible printed circuit includes a flexible FPC film, FPC interconnections formed of a given pattern on the FPC film, a solder resist covering the FPC interconnections, and FPC terminals provided at ends of the FPC interconnections to make external connection. According to the invention, the FPC terminals include at least one terminal that has an end located inside of an outline of the FPC film.

Flexible printed circuit and display device using the same

A display including: a scan line for driving pixels formed on an insulating substrate; a signal line which crosses the scan line; and a driving circuit connected to the signal line and, in a region other than a display region constructed by the pixels, directly mounted on the insulating substrate. A warp amount of a portion corresponding to the region in which the driving circuit is mounted, in a face opposite to the side of the insulating substrate, on which the driving circuit is mounted, is 2 &#x3bc;m or less. The warp amount of the insulating substrate, which occurs when the driving circuit is directly mounted on a terminal on the insulating substrate, is set to 2 &#x3bc;m or less, and the display realizing suppressed luminance nonuniformity and high display quality can be obtained.

Display, method of manufacturing display and apparatus for manufacturing display

A display apparatus has an insulating substrate, a signal line for transmitting a signal to a pixel formed in a display area on the insulating substrate, a driver integrated circuit (IC) mounted outside of the display area of the insulating substrate and electrically connected to the signal line, and an inspection pad formed outside of the display area and electrically connected to the signal line. The inspection pad is covered with resin.

Display apparatus with inspection and method of manufacturing the same

A liquid crystal display of the present invention comprises a display portion having two opposed insulating substrates (an electrode substrate () and an opposed substrate) holding a liquid crystal layer to form a plurality of display elements, wires () formed on at least one of the insulating substrates, for supplying signals to the plurality of display elements, a driver LSI () provided in a peripheral portion of the insulating substrate, being connected to terminals of the wires () to drive a plurality of display elements, and a conductive film pattern portion formed on the wires () in the peripheral portion of the insulating substrate with a first insulating layer interposed therebetween. With this constitution, a liquid crystal display which allows inspection of output signals of the driver LSI in a failure analysis, without extending wires or exposing electrode portions connected to the wires and a method of inspecting the liquid crystal display are provided.

Liquid crystal display and method of inspecting the same

The display device includes the lead line connected to pixels, the line terminal connected to the lead line and connected to the terminal of the drive circuit mounted directly on the insulating substrate by the conductive material through the transparent conductive film, the external terminal to be connected to an external unit, an external line connected to the external terminal, and an external line terminal connected to the external line and connected directly to the terminal of the drive circuit by the conductive material. The surface of the line terminal to be connected to the transparent conductive film is formed by the high resistance conductive film, and the surface of the external line terminal to be connected to the terminal of the drive circuit by the conductive material is formed by the low resistance conductive film.

Display device having a terminal that has a transparent film on top of a high resistance conductive film

The present invention is directed to a liquid crystal display including: a plurality of electrode terminals arranged on one of end faces of a TFT glass substrate in such a manner as to be aligned on an imaginary line; and a plurality of lead terminals of a tape carrier package aligned on the electrode terminals, said plurality of lead terminals connected through an anisotropic conductive film; wherein the electrode terminals near the end face of the glass substrate is formed obliquely in such a manner as to be extended in the direction of both right and left with respect to the plurality of electrode terminals.

Liquid crystal display having different shaped terminals configured to become substantially aligned

A display including: a scan line for driving pixels formed on an insulating substrate; a signal line which crosses the scan line; and a driving circuit connected to the signal line and, in a region other than a display region constructed by the pixels, directly mounted on the insulating substrate. A warp amount of a portion corresponding to the region in which the circuit is mounted, in a face opposite to the side of insulating substrate, on which the driving circuit is mounted, is 2 &#x3bc;m or less. The warp amount of the insulating substrate, which occurs when the driving circuit is directly mounted on a terminal on the insulating substrate, is set to 2 &#x3bc;m or less, and the display realizing suppressed luminance nonuniformity and high display quality can be obtained.

A pressure-welded structure of flexible circuit boards in a liquid crystal display device having a group of lead terminals of flexible circuit boards connected with a plurality of terminals aligned on an end surface of a TFT glass substrate via anisotropic conductive films. A resin is applied on a surface opposite to the terminal surface of the flexible circuit boards, and an end portion of the resin is 0.1 to 10 mm away from an end portion of a resin applied on the terminal surface of the flexible circuit boards, thereby both resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm. It is possible to improve not only the yield in module assembly but also the quality and reliability of the product.

Growing community of inventors

Kumamoto, Japan

Hiroshi Ueda