Tokyo Electron Limited

Hiroshi Tsukada

Kunihiro Furuya

Toshihiro Yonezawa

Yoichi Nakagomi

A temperature managing apparatus according to the invention comprises cooling jackets provided in each of a plurality of test containers, a tank for storing a cooling medium for the cooling jackets, first pumps, second pump, constant pressure valves for making constant the amount of the transferred cooling medium, and a heat exchanger. The tank has partitions that are horizontally and vertically movable. The partitions partition the interior of the tank into a first storage area, a second storage area, and a third area interposed therebetween.

Temperature managing apparatus for multi-stage container

A vacuum coupling system according to the present invention is a mechanism that is used accurately to position and connect a vacuum coupling to a valve mechanism of a shell, which is formed by integrally attracting a wafer and a contactor to a wafer chuck by vacuum suction, in conducting a reliability test or other tests on IC chips that is formed on the wafer. This system comprises an air cylinder for advancing the vacuum coupling toward the valve mechanism, a positioning member to be advanced together with the vacuum coupling, a guide member for guiding the vacuum coupling to the valve mechanism in cooperation with the positioning member, a guide rail for guiding the around the wafer chuck while the positioning member is advancing, and a pair of POGO pins for returning the air cylinder to its neutral position.

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Kitakoma-gun, Japan

Hiroshi Tsukada