Denso Corporation

Hiroshi Tsuda

Jun Kondo

Tomiko Fujino

Fuminori Suzuki

Yutaka Miyamoto

A stem is installed to an injector body and is resiliently deformable upon receiving a pressure of high pressure fuel conducted through a high pressure passage of the injector body. A strain gauge is installed to the stem to sense a strain generated in the stem. A molded IC device executes an amplifying operation, which amplifies a signal received from the strain gauge. The stem, the strain gauge and the molded IC device are integrally assembled together to form a fuel pressure sensing unit, which is installed to the injector body by threadably fastening a threaded portion, which is formed at the stem, to the injector body.

Fuel injection valve

A stem is installed to an injector body and is resiliently deformable upon receiving a pressure of high pressure fuel conducted through a high pressure passage of the injector body. A strain gauge is installed to the stem to sense a strain generated in the stem. A molded IC device executes an amplifying operation, which amplifies a signal received from the strain gauge. A retainer is threadably fastened to the injector body and is configured to be rotatable relative to the stem. The stem, the strain gauge the molded IC device are integrally assembled together to form a fuel pressure sensing unit, which is installed to the injector body by threadably fastening a threaded portion of the retainer to the injector body.

A pressure sensor can be mounted to an object with a pressure to be measured by a mounting structure. The mounting structure includes bonding a first member and a second member, a medium passageway formed on one of the bonding face thereof, a flexible printed wiring board interposed between both bonding faces through gaskets, and a pressure sensor element electrically connected to the flexible printed wiring board by an electrically conductive member so that the sensor element electrically connects to the outside of the object. The pressure sensor element is disposed in a recess that is formed on the bonding face. The presser medium is transferred through an introduction hole from the medium passageway to the pressure sensor element.

Growing community of inventors

Nagoya, Japan

Hiroshi Tsuda