Micron Technology Incorporated

Makino Milling Machine Company, Ltd

Hiroshi Toyama

Kiyonori Oyu

Shigeru Sugioka

Raj K Bansal

Jung Chul Park

Muneaki Beppu

Mitsunari Sukekawa

Nobuaki Igi

Hisashi Onodera

Yasutaka Okada

Hiroyuki Uno

An apparatus includes a base structure having a first portion including a plurality of transistors and a second portion surrounding the first portion; a storage structure on the first portion of the base structure, the storage structure including a plurality of storage capacitors each coupled to a corresponding one of the plurality of transistors; an interface structure on the second portion of the base structure; and a peripheral structure on the interface structure; wherein the interface structure is divided into a plurality of insulating films and the plurality of insulating films are arranged away from each other to have a plurality of voids between the second portion of the base structure and the peripheral structure.

Semiconductor device and method of forming the same

The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction.

Method for measuring inclination of waterjet of laser machining device

In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening. The developed RIM is used as masking material while etching the target material through the RIM opening to form the target-material opening to have at least one pair of laterally-opposing ledges laterally-outward of a mid-portion in the target-material opening in the vertical cross-section elevationally between a top and a bottom of the target-material opening. Other aspects and constructions independent of manufacture are disclosed.

Integrated circuit structures and methods of forming an opening in a material

This laser processing machine, which moves a work piece, which is mounted on a table, and an optical head, which shines a laser light, relative to each other, and processes the work piece by irradiating the work piece with the laser light, is provided with: a calibration camera that is fixed to the optical head; a probe that is fixed to the optical head; and a calibration unit that has measurement reference points (Pc, Pc, Pc, Pp, Pp, Pp) for measuring the position of the calibration camera and the probe, and a processing portion that forms a processing mark (L, L) due to the laser light.

Laser beam machine and alignment adjusting meihod

This laser processing machine, which processes a work piece mounted on a table by irradiating the work piece with a laser light, is provided with: an optical head having a nozzle that sprays a liquid to form a columnar liquid flow and introducing a laser light into the nozzle and shining said light; and an alignment adjustment device having a reflector that is disposed so as to face the optical head and reflects the laser light, and a light-shielding portion around the portion of the reflector that reflects the laser light, and adjusting the position or orientation of introduction of the laser light into the columnar liquid flow.

Laser beam machine and alignment adjusting method

A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad. The insulator material has a minimum elevational thickness from the conductive-test-pad uppermost surface to an uppermost surface of the insulator material that is immediately-adjacent the insulator-material opening and that is less than said minimum elevational thickness of the insulating material. Methods are disclosed.

Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate

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Kanagawa, Japan

Hiroshi Toyama