Hitachi Automotive Systems, Ltd.

Hiroshi Tokuda

Masato Higuma

Keiji Kawahara

Atsushi Koshizaka

Shinji Hiramitsu

A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.

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Hitachinaka, Japan

Hiroshi Tokuda