Sony Corporation

Hiroshi Toi

Nobuyuki Yasuda

Shinichi Fujita

Akio Mishima

Tamiaki Matsuura

Toshio Tamura

Toru Takamiya

Motosuke Usui

Kiyohiko Akanuma

Tsuneyoshi Kon

Makoto Uragaki

A multilayer wiring board and a method for manufacturing the same are disclosed. The wiring board comprises an insulating substrate having a first and second conductor layers formed on major surfaces of the insulating substrate, a blind hole formed through the first conductor layer and the insulating substrate to expose the second conductor layer at the bottom of the blind hole, and a connecting conductor provided to cover the exposed surface of the second conductor layer wall portion of the blind hole and the first conductor layer. Since the connecting conductor and the second conductor are made in surface contact, connection reliability is very much improved. The blind hole is made by blasting a fine abrasive powder beam to selectively remove the insulating substrate. The end of selective removal can be easily controlled by the difference of working speed against the insulating substrate and the conductor layer to successfully expose the second conductor layer at the bottom of the blind hole.

Method for manufacturing a multilayer wiring board

An electronic component mounting apparatus wherein any unflatness value such as skew at each of predetermined points on the surface of a substrate supported at a component mounting position is measured by a non-contact type measuring instrument. Such unflatness value and a predetermined height of each electronic component to be mounted are calculated, and the descent stroke of each suction nozzle is adjusted in accordance with the result of such calculation in such a manner that the bottom face of the component is set exactly at the predetermined position on the substrate surface, thereby ensuring accurate mounting of the component on the substrate surface without causing any impact thereto to consequently attain proper attachment.

Electronic component mounting apparatus

Automatic disk handling device with overturn plate

A manufacturing apparatus for a tape cassette includes: a rotary table having at least one pair of hub chucks for demountably holding a pair of hubs supplied to the rotary table; a mechanism for clamping an initial end of a supplied tape to one of the hubs held by the hub chucks; a tape winding member for winding a predetermined length of the supplied tape onto the one hub; a cutting member for cutting the trailing side of the wound tape on the one hub; another mechanism for clamping the terminal end of the cut tape to the other of the hubs; and an assembling mechanism for transporting the hubs to which the ends of the tape are clamped and on which the tape is wound, to a position adjacent to a mounted cassette half, demounting the hubs from the hub chucks and assembling the hubs into the mounted cassette half.

Manufacturing apparatus for tape cassette

Growing community of inventors

Kanagawa, Japan

Hiroshi Toi