Sony Corporation

Sony Semiconductor Solutions Corporation

Dexerials Corporation

Sony Group Corporation

Hiroshi Tazawa

Minoru Ishida

Nobutoshi Fujii

Suguru Saito

Hiroyasu Matsugai

Hiroyuki Itou

Keiji Ohshima

Toshiaki Shiraiwa

Shunichi Kajiya

Kazuya Hayashibe

Masanori Iwasaki

Toshihiko Hayashi

Shuzo Sato

Yusuke Moriya

Yoshiya Hagimoto

Takashi Oinoue

Toshihiro Kurobe

Hiroshi Tanaka

Sohmei Endoh

Atsushi Yamamoto

Koji Sasaki

Koichi Takeuchi

Masanao Kikuchi

Kazuhiko Noda

Kyoko Sakurai

Rie Tsubo

Toru Yatabe

Fumihiko Iida

Kei Obata

Munekatsu Fukuyama

Mitsuo Arima

Yu Nomura

Masaki Okamoto

Hiroyuki Kiso

Yutaka Muramoto

Kotaro Shima

Hidetoshi Takahashi

Asahiko Nogami

Hiroshi Sugata

Akito Kuriyama

Kunihiko Hikichi

Junichi Inoue

Hirotaka Yoshioka

Sotetsu Saito

Ryo Nishimura

Takashi Mabuchi

Keitaro Kitada

A laminate includes a thin film structural body and retention films. A first retention film is stacked on one face of the thin film structural body and a second retention film is stacked on another face of the thin film structural body. The thin film structural body has a first fine irregularity structure at a face that is in contact with the first retention film and has a second fine irregularity structure at a face that is in contact with the second retention film. The first retention film has a third fine irregularity structure at a face that is in contact with the thin film structural body. The second retention film has a fourth fine irregularity structure at a face that is in contact with the thin film structural body. The laminate includes a half cut section. The second retention film contains a UV-curable resin.

Laminate, method of producing laminate, method of forming optical body, and camera module-equipped device

Provided are a concave-convex structure including more complicated concave-convex structure, an optical member, and an electronic apparatus. The concave-convex structure includes a plurality of group portions each including a plurality of concavities or convexities provided in a surface of a base material, in which average widths of areas occupied by the concavities or convexities at the surface of the base material are smaller than or equal to a wavelength belonging to a visible light band.

Concave-convex structure, optical member, and electronic apparatus

Provided are a master in which a more complicated microstructure is formed, a transferred object obtained by using the master, and a method of producing the master. A plurality of concave-convex groups each including a plurality of concavities or convexities are provided on a base material apart from each other. Average widths of areas occupied by the concavities or convexities at a surface of the base material are smaller than or equal to a wavelength belonging to a visible light band. Formed lengths of the concavities or convexities from the surface of the base material in each of the concave-convex groups each belong to any of at least two or more groups having different central values.

Master, transferred object, and method of producing master

An optical filter includes a transmission portion transmitting light and an absorption portion absorbing light between a plane of incidence and a plane of emission, and the volume of the transmission portion is larger than the volume of the absorption portion. For the optical filter, when the transmission spectrum Sof light incident at an incidence angle of 0° and the transmission spectrum Sof light incident at an incidence angle of 60° are superimposed, the transmittance (%) at an incidence angle of 60° is lower than the transmittance (%) at an incidence angle of 0° by 15% or more for a first wavelength band, and the difference between the transmittance (%) at an incidence angle of 60° and the transmittance (%) at an incidence angle of 0° is 10% or less for a second wavelength band.

Optical filter and light-emitting device

There is provided a novel and improved resin laminated optical body and a method for manufacturing the same that can easily adjust an optical property other than an optical property derived from a micro concave-convex structure, and eventually can reduce manufacturing costs of an optical device. The resin laminated optical body includes: an optical base material having a curved surface; and a resin layer provided on the curved surface of the optical base material. A micro concave-convex structure is formed in a surface of the resin layer, and the resin laminated optical body has a first optical property derived from the micro concave-convex structure and a second optical property derived from a property of the resin layer other than the micro concave-convex structure, the second optical property being different from an optical property of the optical base material.

Resin laminated optical body and method for manufacturing the same

The optical deviceaccording to the present disclosure includes substratesprovided opposite to each other, a partition wallformed between opposing faces of the substratesand separating adjacent spaces, and a fluidfilled in each spaceseparated by the partition wall and containing an electric field control material, wherein the optical device further includes, between at least one of the substratesand the partition wall, a fine uneven layerhaving fine uneven shapes and a conductive layerformed according to a shape of the fine uneven layer.

Optical device having fluid-filled partitioned spaces with electric field control material

There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

AF module, camera module, and electronic apparatus

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Stacked lens structure, method of manufacturing the same, and electronic apparatus

[Object] To provide a display apparatus that makes it possible to improve visibility. [Solution] A display apparatus according to an embodiment of the present disclosure includes: a display body device including a plurality of pixels, the plurality of pixels each including a plurality of light-emitting elements as light source elements; and an irregular structure formed on a front surface of the display body device.

Display apparatus

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.

Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method

A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.

Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate

Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.

Lens substrate, semiconductor device, and electronic apparatus

Growing community of inventors

Kanagawa, Japan

Hiroshi Tazawa