Mitsubishi Heavy Industries Limited

Nec Corporation

Mitsubishi Electric Corporation

Canon Kabushiki Kaisha

Japan Display Inc.

Mitsubishi Denki Kabushiki Kaisha

Fuji Photo Film Company, Limited

Kabushiki Kaisha Toshiba

International Business Machines Corporation

Sony Corporation

Fujifilm Corporation

Hitachi, Ltd.

Olympus Corporation

Renesas Electronics Corporation

Renesas Technology Corp.

Hiroshi Tanaka

Takuya Hirata

Tatsuya Tsujiuchi

Takashi Kamijo

Tsuyoshi Oishi

Hiromitsu Nagayasu

Masahiko Tatsumi

Yasuyuki Yagi

Atsuhiro Yukumoto

Masayuki Inui

Susumu Okino

Naoyuki Kamiyama

Tatsuto Nagayasu

Masaru Chiyomaru

Satoshi Osuga

Shinya Kishimoto

Koji Nakayama

Takahito Yonekawa

Keiji Fujikawa

Masaki Iijima

Kazuhiro Hishinuma

Hajime Takemura

Michiaki Adachi

Tetsuya Imai

Nobuyoshi Nakajima

Kazuo Shimura

Takashi Ishikawa

Hideya Takeo

Masahiro Yamamoto

Masahiro Teramoto

Naohiko Ukawa

Shoji Hara

Kimiyoshi Usami

Takeo Hattori

Kazuo Takagi

Shinichi Okamoto

Masaki Umayabashi

Motohisa Miyawaki

Katsuhiko Murayama

Mutsunori Igarashi

Akira Sakurai

Yuko Yoshida

Yoshimichi Kawai

Masahiro Kanazawa

Yasushi Yokochi

Mitsugu Takezaki

Takashi Suzuki

Hiroyuki Abe

Akihiro Kojima

Hiroki Yamamoto

Tsutomu Furuhashi

Sanehiro Furuichi

Keiji Sato

Takashi Saito

Masahiro Suzuki

Takashi Ueno

Junichi Tamura

Takashi Takahashi

Yoshihiro Ito

Hiroaki Ito

Fumio Suzuki

Yujiro Ando

Seimei Ushiro

Fumio Arakawa

Hiroshi Ohnishi

Kazune Matsumura

Tetsuo Kimura

Kazunari Tezuka

Yoshisuke Nakasato

Yoshihiko Morimoto

Shuichi Ishii

Kazunori Sato

Toshio Takano

Takamichi Hoshino

Kaori Yoshida

Kenji Ohmori

Haruaki Hirayama

Akihiro Fujii

Shinji Takayama

Hiroyuki Takagi

Ryuji Yoshiyama

Seiji Muranaka

Masakazu Sakaguchi

Kouki Ogura

Itaru Nishioka

Takanobu Tsunoda

Noboru Ishikawa

Masahito Toyama

Takeo Fujiyama

Yuki Okumura

Hiroyuki Kumazawa

Yoshio Fukushima

Masami Murakata

Kouji Horizoe

Seiichi Tanaka

Masayoshi Uehata

Zhenlong Cui

Nobuo Momose

Yasunori Aihara

Kazuya Takeuchi

A gas heating apparatus includes a heating element having a flat plate shape, a heat-resistant enclosure in which a space having a flat plate shape is provided, the heating element being disposed in the space with a gap provided between the heating element and the heat-resistant enclosure, a gas inlet joint connected to the heat-resistant enclosure to allow gas to flow into the space, a gas outlet joint connected to the heat-resistant enclosure to allow the gas that has passed through the space to flow out, and an induction coil disposed in parallel with the heating element on a lower surface of the heat-resistant enclosure, the induction coil inductively heating the heating element on the basis of electric power supplied.

Gas heating apparatus, semiconductor manufacturing apparatus, heating element, and semiconductor manufacturing method

A COrecovery unit includes a COabsorber that brings a gas having a low COconcentration into countercurrent contact with a COabsorbent to remove COfrom the gas. The COrecovery unit further includes a first absorbent circulation line that supplies a COabsorbent from a first COabsorption section as a first circulation solution to an upper side of a first COabsorption section; a second absorbent circulation line that supplies a COabsorbent from a second COabsorption section as a second circulation solution to an upper side of a second COabsorption section; and an absorbent discharge line that discharges a part of the first circulation solution from the first absorbent circulation line and supply the part of the first circulation solution as a discharged solution to the second absorbent circulation section.

COrecovery unit and COrecovery method

A composite amine absorbent to absorb at least one of COand HS in a gas includes: a chain monoamine; a diamine; a cyclic compound represented by the following chemical formula: where R: any one of hydrogen, a hydrocarbon group having a carbon number of 1 to 4, and a hydroxyalkyl group, R: oxygen or N—R, and R: any one of hydrogen, a hydrocarbon group having a carbon number of 1 to 4, and a hydroxyalkyl group; and water.

Composite amine absorbent, removal unit, and removal method

A pneumatic tool includes a drive mechanism configured to drive by an air pressure of compressed air, a head valve having a first chamber configured to reserve compressed air that is supplied from an air source, and configured to drive the drive mechanism, according to a state of the compressed air in the first chamber, a trigger valve configured to actuate the head valve by exhausting the compressed air in the first chamber, and a control valve configured to disable actuation of the trigger valve.

Pneumatic tool

According to the present disclosure, a semiconductor manufacturing apparatus includes a rotation stage that rotates a wafer, a nozzle that supplies a chemical solution to the wafer and a nozzle movement section that moves the nozzle on a scan trajectory, wherein the nozzle movement section moves the nozzle along a first trajectory and a second trajectory on the scan trajectory, the first trajectory is a trajectory to turn around at a first turnaround point on one side and a second turnaround point on the other side with respect to a portion closest to a rotation axis of the rotation stage in the scan trajectory, and the second trajectory is a trajectory to turn around at a third turnaround point and a fourth turnaround point provided on the same side as the third turnaround point with respect to the portion closest to the rotation axis in the scan trajectory.

Semiconductor manufacturing apparatus

An air pollution control unit is configured to bring particle-containing gas and washing liquid into contact with each other to collect particles in the particle-containing gas. The air pollution control unit includes a gas washing column having a gas cleaning section in which the particle-containing gas and the washing liquid are brought into co-current contact with each other, a gas cooling column disposed downstream of the gas washing column along the gas flow and having a gas cooling section in which the particle-containing gas that has been cleaned (cleaned gas) and cooling liquid are brought into countercurrent contact with each other, and a gas communication path.

Air pollution control unit and air pollution control method, and CO2 recovery unit and CO2 recovery method

A pneumatic tool includes a trigger configured to perform a first operation of operating a drive part, a contact member configured to perform a second operation of operating the drive part, a timer configured to measure the time during which the drive part can be operated by the second operation of the contact member and to switch the operation mode of the drive part after the time has elapsed, and a timer switch configured to control the operation of the timer. The first operation of the trigger is transmitted to the timer switch using a transmitting member.

A pneumatic tool includes a drive mechanism configured to drive by an air pressure of compressed air, a head valve configured to control supply of the compressed air to the drive mechanism, a trigger valve configured to actuate the head valve, a control valve configured to disable actuation of the trigger valve or the head valve, and a timer valve configured to be actuated based on an operation on a trigger and to disable actuation of the trigger valve or the head valve by actuating the control valve at a predetermined timing. The timer valve has a valve body configured to act on the control valve and is provided with a throttle portion configured to regulate a flow rate of a fluid generated in conjunction with movement of the valve body.

Semiconductor manufacturing equipment includes a thickness calculation function, the thickness calculation function including a measurement value acquisition unit configured to acquire a plurality of measurement values at different measurement positions of the wafer from a thickness measurement function configured to measure a thickness of the wafer, a histogram data creation unit configured to create histogram data based on the plurality of measurement values, and a grade group extraction unit configured to extract a grade group from the histogram data, the grade group including sequential grades having frequencies equal to or greater than a predetermined frequency, the thickness calculation function further including a representative value calculation unit configured to calculate a representative value of a thickness of a measurement region based on the grades included in the extracted grade group.

Semiconductor manufacturing equipment and semiconductor manufacturing method

[Problem] The present invention is directed to a higher-performance and higher-quality curved diaphragm speaker system without deficiency of performance for both a hearing-impaired person and a normal hearing person. [Solution] A speaker unitaccording to the present invention includes at least a first diaphragmhaving a corn shape, a second diaphragmhaving a curved sheet shape, and a driver unitthat drives both the first diaphragm and the second diaphragm. A small diameter sideof the first diaphragm and one end sideof the second diaphragm are coupled to the driver unit. When the speaker unit is mounted in a housingto be a speaker, a large diameter sideof the first diaphragm is coupled to a support plateof a support memberthat is a part of the housing, and the other end sideof the second diaphragm is coupled to a support legof the support member that is a part of the housing.

Speaker unit and speaker

[Problem] To provide a higher performance and higher quality curved diaphragm speaker system that has sufficient performance for hard-of-hearing people and also for hearing people. [Solution] A speaker unitaccording to the present invention at least includes: a first diaphragmin a cone shape; a blade piecein a plate shape to which a second diaphragm in a sheet shape forming a rounded surface portion that is curved from one end side to the other end side; and a driver unitthat drives those cone shaped diaphragm and blade piece together. The blade piece is connected via a center cap attached to a tip end of a voice coil of the driver unit so as to protrude from a small diameterside to a large diameterside of the first diaphragm. In the first diaphragm, the small diameter side is connected to the driver unit, and also the large diameter side is attached to a cone support frame. Additionally, the second diaphragm is arranged such that the one end side is overlapped with one surface of the blade piece.

A semiconductor manufacturing apparatus includes a chuck stage, a scrubber nozzle, a scrubber nozzle scan mechanism, a stage rotation mechanism, and a holding stage including a holding fluid nozzle and a top plate, the top plate having one main surface facing an opposite surface of a wafer, and the holding fluid nozzle being disposed adjacent to a center rather than a periphery portion of the top plate. A holding fluid discharged from the holding fluid nozzle is caused to flow through an area between the opposite surface of the wafer and the one main surface of the top plate to produce holding force, and the holding force causes the opposite surface to hold pressure applied to a processing surface of the wafer by a scrubbing fluid discharged from the scrubber nozzle.

Semiconductor manufacturing apparatus and semiconductor manufacturing method

A pneumatic tool includes a drive part configured to be driven by compressed air, a control valve configured to switch the presence or absence of operation of the drive part, and a timer part configured to switch the presence or absence of operation of the control valve after a lapse of a predetermined time. The timer part includes a timer piston configured to move in one direction, a timer piston cylinder configured to support the timer piston such that the timer piston can slide, and an on-off valve part configured to switch the presence or absence of operation of the control valve in conjunction with the timer piston. The on-off valve part includes a shaft portion configured to move in conjunction with the timer piston, and compressed air flowing into the on-off valve part presses the shaft portion in the one direction.

A composite amine absorbent according to the present invention is an absorbent for absorbing COor HS, or both of COand HS in a gas. The absorbent is obtained by dissolving (1) a linear monoamine, (2) a diamine, and (3) propylene glycol alkyl ether, for example, represented by the following chemical formula (I) in water. In the composite amine absorbent, the components complexly interact, and the synergistic effect thereof provides good absorbability of COor HS, or both of COand HS and good releasability of COor HS absorbed during regeneration of the absorbent. Furthermore, the amount of water vapor in a reboilerused during regeneration of the absorbent in a COrecovery unitcan be reduced.R&#x2014;O&#x2014;(R&#x2014;O)&#x2014;R&#x2003;&#x2003;(I)

Composite amine absorbent, and device and method for removing CO2 or H2S, or both of CO2 and H2S

A pneumatic tool includes a drive part configured to be driven by compressed air, a control valve configured to switch the presence or absence of operation of the drive part, an on-off valve part configured to switch the presence or absence of operation of the control valve, and a timer part configured to control the operation of the on-off valve part and switch the presence or absence of operation of the control valve after a lapse of a predetermined time. The timer part comprises a timer piston configured to move in one direction and perform timekeeping, and a timer piston housing configured to support a shaft of the timer piston. The timer piston housing is provided with a groove on a guide surface of the shaft of the timer piston, the groove being configured to expand a flow path formed between the shaft and the guide surface.

Growing community of inventors

Tokyo, Japan

Hiroshi Tanaka