Casio Computer Co., Ltd.

Hiroshi Takenaka

Ichiro Mihara

Yutaka Aoki

Masayoshi Tanazawa

A semiconductor device of a CSP structure is obtained by forming projection electrodes on a plurality of circuit element forming areas of a semiconductor wafer substrate, and then dividing the wafer into chips. Wiring patterns connected to connection pads for signal transmission are provided on the upper surface of an insulating film formed on the circuit element forming areas, and a conductive layer connected to a connection pad connected to a ground potential is provided on the resultant structure except for on the wiring patterns and on areas near the wiring patterns. Further, a thin film circuit element may be provided at the same layer as the conductive layer or below the conductive layer.

Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise

A detecting device includes a device body having a containing chamber formed therein, a plurality of electrode members which are provided in the containing chamber in parallel to one another, a conductive movable body which is movably arranged in a space surrounded by the plurality of electrode members, and a magnet which generates a magnetic holding force for holding the conductive movable body. When an external force is applied to the device body, the conductive movable body is moved against the magnetic holding force of the magnet and is brought into electrical contact with at least two of the plurality of electrode members, thereby causing a detection signal corresponding to the electrical contact to be output.

Detecting device, method for manufacturing the detecting device and

A baseplate-free module includes a circuit board 1 held between housings 41 and 42. The circuit board 1 has engaging holes 17 in which hooks 41a, 42a of the housings 41 and 42 are engaged for assembling purposes to thereby eliminate the need for a baseplate.

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Iruma, Japan

Hiroshi Takenaka