Hitachi Chemical Company, Ltd.

The Yokohama Rubber Co., Ltd.

Hitachi, Condenser Co., Ltd.

Hiroshi Takahashi

Shin Takanezawa

Kiyoshi Nakao

Akishi Nakaso

Toshiro Okamura

Yorio Iwasaki

Masao Kanno

Nobuo Uozu

Masaaki Katagiri

Yutaka Nakahara

Hideo Watanabe

Takayuki Saito

Naoki Fukutomi

Hiroyuki Kawakami

Tohru Kikuchi

Kiyoshi Hasegawa

Hajime Yamazaki

Hiroyuki Wakamatsu

Makoto Fujikura

Masaki Yagi

Hiroyoshi Yokoyama

Toshinobu Takahashi

Toshirou Okamura

Koichi Tsuyama

Naohiro Morozumi

A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.

Process for producing printed wiring board

By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.

Process for producing printed wiring boards

A synthetic resin composition comprising a synthetic resin and a special phenolic polymer is stabilized for a long period of time and excellent in heat resistance and light resistance.

Stabilized synthetic resin composition

An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process.

Adhesive clad insulating substrate used for producing printed circuit

A process for preparing a chemically platable thermosetting powder coating characterized by preliminarily kneading a composition comprising 3 to 50% by weight of a thermosetting resin, 5 to 60% by weight of an inorganic filler and up to 80% by weight of a rubber component comprising at least 10% by weight of a rubber having ethylenic double bonds and polar groups in the molecule, the amount of which rubber component constitutes the total amount of rubber component in the final powder coating, the rubber component content of the composition to be subjected to the preliminary kneading being at least twice the rubber component content of the final powder coating, said composition being heated at a temperature of at least the melting point of the thermosetting resin at least once during the course of the preliminary kneading, thereby to effect efficient dispersion of the components. The powder coating prepared according to the process of the present invention is substantially homogeneous due to the uniform dispersion of its components, thus providing good applicability thereof on an article, excellent levelling of a coated film of the powder coating when molten in the step of heat hardening and an improved peeling strength between the coated and heat-hardened film of the powder coating and a metal deposited thereon by chemical plating. The chemically platable thermosetting powder coating prepared according to the process of the present invention may further comprise a catalyst for chemical plating, at least 50% by weight of catalyst in the final powder coating being kneaded together with the above-mentioned composition in the step of preliminary kneading.

Process for preparing chemically platable thermosetting powder coating

A baseboard having through-holes for a printed circuit board which baseboard is made from a metal as a substrate, comprising at least one resin coat layer formed on the overall surface of the metal substrate including the inner wall surfaces of the through-holes and having, at the circumferential angular portions of the through-holes, a thickness larger than that on said upper and said lower surface of the metal substrate, and featured by its increased insulation characteristics at the circumferential angular portions of the through-holes.

Baseboard for printed circuit board

A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

Method of improving adhesion between insulating substrates and metal

A baseboard having through-holes for a printed circuit board which baseboard is made from a metal as a substrate, comprising at least one resin coat layer formed on the overall surface of the metal substrate including the inner wall surfaces of the through-holes and having, at the circumferential angular portions of the through-holes, a thickness larger than that on said upper and said lower surface of the metal substrate, and featured by its increased insulation characteristics at the circumferential angular portions of the through-holes, and a method of producing the same.

Baseboard for printed circuit board and method of producing the same

Growing community of inventors

Kasama, Japan

Hiroshi Takahashi