Ricoh Company, Ltd.

Sony Corporation

Nissan Motor Company Limited

Kabushiki Kaisha Toshiba

Nec Corporation

Fuji Photo Film Company, Limited

Panasonic Corporation

Fujitsu Corporation

Panasonic Intellectual Property Corporation of America

Sony Semiconductor Solutions Corporation

Hitachi, Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Kyocera Corporation

Shin-etsu Chemical Co., Ltd.

Sony Group Corporation

Hiroshi Takahashi

Taku Umebayashi

Naganori Shirakata

Tetsuya Fujioka

Jun Uchimura

Kazunori Bannai

Reijiroh Shohji

Kazushige Taguchi

Masataka Irie

Keishi Inoue

Shunichi Sukegawa

Junichi Morita

Kazuhiro Ando

Fumio Kishi

Kazunari Tonami

Yoshio Urabe

Masato Kobayashi

Takashi Saitoh

Nobuyuki Satoh

Shingo Yamaguchi

Takamitsu Sunaoshi

Ikuo Yoshihara

Yuichi Sakurada

Yasuo Sakurai

Tomoya Urushihara

Yukio Sakano

Shinji Yamakawa

Mikiro Yanaka

Koichi Noguchi

Hiroyuki Enari

Keisuke Shiba

Shigeru Suzuki

Toshimi Abo

Masahiro Kikuchi

Yoshiichi Horikoshi

Michiyoshi Tachikawa

Kazuo Murai

Yukio Hara

Satoshi Kanbayashi

Takashi Ida

Hideaki Suzuki

Makoto Kimura

Takeshi Ogawa

Hiroyuki Kayano

Kiyoshi Suzuki

Takehiko Kagoshima

Toru Yamazaki

Toshio Sato

Takeshi Ueno

Junya Tanaka

Shigeo Kurotaka

Tomonori Kimura

Yoshimasa Aotani

Noritsugu Shiokawa

Koichi Tsunoda

Takashi Harada

Masashi Takenaka

Tatsuji Higashi

Kyoji Omi

Hisashi Aoki

Hiromi Okubo

Tamio Kawaguchi

Kouji Ishigaki

Kazuo Watabe

Akihito Ogawa

Minoru Ishida

Hiroyuki Motozuka

Takenori Sakamoto

Masaaki Yamada

Keiji Kojima

Takashi Usui

Hideo Nakamura

Tsumoru Hirano

Ichiro Kadota

Nobuyuki Kita

Tomotoshi Nakahara

Yasuki Ishikawa

Hirokazu Sakaki

Toshihiko Hayashi

Koji Takinami

Hideichi Nakamoto

Takashi Yamamoto

Toshiyuki Utsuki

Hiroshi Yoshioka

Hidetoshi Ema

Akira Higashimata

Shuji Manda

Toshihiro Kanematsu

Hiroyasu Matsugai

Masaya Nagata

Yasushi Narita

Yoshiki Yasuno

Kenji Kawakita

Masashi Kobayashi

Naohiro Kamijo

Takahiro Kokubo

Toshiaki Ohnishi

Chikashi Ohishi

Yuji Yasuda

Hiroyuki Tamaki

An imaging device according to an embodiment of the present disclosure including a first chip; a support substrate; and a second chip. The support substrate includes an excavated portion in a region opposed to the first chip. The excavated portion has a shape of a recess or a shape of a hole. The second chip is disposed in the excavated portion of the support substrate. The second chip is electrically coupled to the first chip. At least one of the first chip or the second chip has a photoelectric conversion function.

Imaging device

Provided is an object detection system including: a ranging device that emits light so as to pass through a detection region and receives reflected light in which the ranging device is configured to perform a scan by changing an optical path of emitted light; and a reflection member that is provided in a scan range so as to reflect light passing through the detection region toward the ranging device.

Object detection system and article display shelf

Provided is a sensor device including: a sensor device including: a sensor unit that emits light and receives light reflected by an object; and a reflection mirror unit that reflects light emitted from the sensor unit. A reflection surface of a reflection mirror included in the reflection mirror unit includes a first part and a second part having lower reflectance than the first part.

Sensor device and article display shelf

A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.

Semiconductor device and method of manufacturing the same, and electronic apparatus

A transport device includes: a vehicle body including a fork portion that supports a load, a lift portion that drives the fork portion up and down, a movable carriage portion that supports the lift portion, and is movable on a traveling surface by driving a drive wheel, and an auxiliary leg portion that is provided in the movable carriage portion, is movable along a longitudinal direction of the fork portion, and has an auxiliary wheel having a variable position with respect to the movable carriage portion; and a control unit that, in a case where a step is present on the traveling surface, controls operations of the lift portion, the movable carriage portion, and the auxiliary leg portion such that the movable carriage portion climbs the step, based on the position of the center of gravity calculated by a calculation unit.

Transport device, control method, and computer program product

According to one embodiment, a vibration generator includes first and second integrated elastic support bodies, a vibrator, and a coil. Each of the first and second integrated elastic support bodies includes an elastic beam part configured to undergo elastic deformation, and a support part supporting the elastic beam part, the elastic beam part and support part being integrally formed. The vibrator includes a magnet and a magnetic material, and is interposed between the first and second integrated elastic support bodies and supported so as to vibrate. The coil is located inside the vibrator, and interposed and supported between the first integrated elastic support body and the second integrated elastic support body.

Vibration generator with two S-shaped elastic beam parts overlapping 180 degrees

According to one embodiment, an inspection system of an embodiment is an inspection system for inspecting a bogie including a plurality of side beams extending in a front-rear direction and disposed apart from each other in a left-right direction and a cross beam connecting the plurality of side beams. The inspection system includes one or more sensors and a position locator. The one or more sensors are installed on at least one of the plurality of side beams and the cross beam and detect elastic waves. The position locator identifies a beam in which the elastic waves have been generated or locates a position of an elastic wave source on the basis of the elastic waves detected by the one or more sensors.

Inspection system, inspection apparatus, and inspection method

This position estimation system comprises a first wireless node for forming a wireless area; second wireless nodes which move within the wireless area; a plurality of third wireless nodes which are provided within the wireless area; and a position estimation device which estimates the position of the second wireless nodes on the basis of information indicating wireless reception quality at the third wireless nodes and the second wireless nodes. The position estimation device determines, for each of section areas, and on the basis of information pertaining to time resource capacity for wireless communication directed towards second wireless nodes, section areas which collect, in place of the first wireless node, information containing wireless reception quality at the second wireless nodes, and transmits, to one of third wireless nodes provided in the determined section area, and instruction to collect wireless reception quality at second wireless nodes within said section area.

Position estimation system, position estimation device, and position estimation method

A compression molding device, which can obtain a high compression molding force without lowering the efficiency of article production, and whose molding means has a long service life, is provided. In the compression molding device, a one-side mold assembly moving means () includes a toggle link mechanism including two links () and (), and a toggle link mechanism operating means (), while an opposite-side mold assembly moving means () includes a hydraulic cylinder mechanism. When a one-side mold assembly () and an opposite-side mold assembly () are to be brought from an open state into a closed state, the one-side mold assembly () is first moved to a nearly closed state by the one-side mold assembly moving means (), and then the opposite-side mold assembly () is moved from the nearly closed state to the closed state by the opposite-side mold assembly moving means ().

Compression molding device

Provided is a passenger monitoring system comprising: a ranging sensor that is provided in a vehicle and capable of outputting a distance information corresponding to a distance to a passenger in the vehicle; and a control unit that estimates a state of congestion of the vehicle based on the distance information.

Passenger monitoring system and method

Provided is a sensor apparatus including: a laser ranging device that scans a predetermined scan range with a laser light such that at least a part of the emitted laser light passes through a region including a predetermined detection region; and a reflection mirror that reflects at least a part of the laser light to a direction not parallel to an incident direction and is provided so that the laser light occurring after reflection passes through the detection region.

Sensor apparatus, article display shelf, and production management system

Provided is a sensor device including: a sensor unit that emits light and receives light reflected by an object; and a reflection mirror that is a columnar reflection mirror having a reflection surface on a side face and is configured to be rotated on an axis of the reflection mirror as a rotation axis, in which at least a part of the reflection surface forms a logarithmic spiral having the center at the rotation axis in a cross section perpendicular to the rotation axis, and when light emitted from the sensor unit and reflected by the reflection surface moves in parallel in response to rotation of the reflection mirror, the light reflected by the reflection surface is swept.

Sensor device

Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.

Solid-state imaging device

A condition monitoring system includes a power generator and a condition monitoring apparatus. The condition monitoring apparatus includes, voltage measuring circuit which measures a voltage value of power generated by the power generator, a data memory which stores a past voltage value measured by the voltage measuring circuit, a calculation circuit which calculates a difference between a current voltage value measured by the voltage measuring circuit and at least one past voltage value stored in the data memory, and a controller which determines an issue period indicating a period of time until a trigger signal is issued based on the difference calculated by the calculation circuit, and issues the trigger signal to the condition monitoring apparatus based on the issue period.

Condition monitoring system and storage medium storing thereon condition monitoring program

Growing community of inventors

Kanagawa, Japan

Hiroshi Takahashi