Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Sumitomo Pharmaceuticals Company Limited

Fukui Prefectural University

Hiroshi Takagi

Yukio Sakabe

Masaru Fujino

Akira Shiratori

Takashi Fujii

Hirofumi Sunahara

Yoshiaki Mori

Akira Ando

Michiaki Iha

Kazuo Kishida

Yasutaka Sugimoto

Seiji Kanba

Shizuharu Watanabe

Makoto Kumatoriya

Takenori Sekijima

Akira Nagai

Shozo Kobayashi

Kiyoshi Hase

Osamu Chikagawa

Koichi Hayashi

Kunisaburo Tomono

Hiroshi Marusawa

Hiromichi Kawakami

Sadaaki Sakamoto

Akinori Nakayama

Takehiro Konoike

Hiroaki Taira

Osamu Yokokura

Toshiki Tanaka

Yu Tokuda

Yoshihito Niwa

Kazuya Kawabata

Harufumi Mandai

Harunobu Sano

Hiroji Tani

Yasuyuki Naito

Mitsuyoshi Nishide

Masahiko Kimura

Tsuguo Fukuda

Nobuyuki Wada

Yoshihiko Takano

Tadashi Morimoto

Takuo Wakaoka

Satoru Shinmura

Jun Harada

Shinobu Mizuno

Koji Murayama

Mikio Geho

Terunobu Ishikawa

Yoshio Abe

Hiroaki Ichikawa

Yasuaki Kainuma

Haruya Miyata

Yuki Yamamoto

Masayuki Yamada

Katsuro Hirayama

Kimihide Sugou

Koichi Ishida

Yoshimitsu Hamano

Kohichi Hayashi

Shouzo Kobayashi

Terunobi Ishikawa

A method for manufacturing a functional material including a porous metal complex with nanoparticles included therein, the method including a configuration of adding more than one particle constituent raw material constituting the nanoparticles and a porous metal complex to a solvent, and then synthesizing nanoparticles included in the porous metal complex by heating to a desired temperature. In addition, provided is an electronic component including an electronic component element using a functional material including a porous metal complex with nanoparticles included therein.

Method for manufacturing functional material and electronic component

In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.

Electronic component including a shielding metal film disposed on a resin layer

An enzyme capable of reducing the antibiotic activity (i.e., toxicity) of streptothricin with respect to eukaryotic cells without sacrificing antibiotic activity with respect to prokaryotic cells is provided along with a streptothricin derivative having reduced toxicity with respect to eukaryotic cells while retaining antibiotic activity with respect to prokaryotic cells, and a manufacturing method thereof. By opening the lactam ring of streptothricin, a protein having the amino acid sequence according to SEQ ID NO: 2, 4, 6, 8, 10, 12, 14 or 16 of the invention can reduce the antibiotic activity of streptothricin D with respect to eukaryotic cells without sacrificing antibiotic activity with respect to prokaryotic cells.

Lactam ring-opening enzyme and use thereof

A method for manufacturing a multilayer ceramic substrate includes a firing step wherein low-temperature-sinterable ceramic material contained in green base layers and inorganic material contained in green constraining layers chemically react each other, whereby a reaction layer is formed along an interface between the green base layer and the green constraining layer. The reaction layer acts to enhance a bonding force between the green base layer and the green constraining layer.

Multilayer ceramic substrate, method for manufacturing the same, and electronic device

A method for measuring the viscosity of a green compact sample includes the steps of finding a corrected value V&prime; of the sample volume of the green compact sample, where the corrected value V&prime; of the sample volume is a volume occupied by the inorganic powder in the green compact sample; finding a corrected value (dh/dt)&prime; of the sample deformation rate of the green compact sample, where the corrected value (dh/dt)&prime; of the sample deformation rate is the difference between the apparent sample deformation rate and the sample deformation rate due to sintering shrinkage; separating a temperature range X in which sintering shrinkage dominates and a temperature range Y in which plastic deformation dominates with respect to the displacement of the green compact sample; substituting the corrected value V&prime; of the sample volume for the sample volume V and substituting the corrected value (dh/dt)&prime; of the sample deformation rate for the sample deformation rate dh/dt in the Gent equation with respect to the temperature range X; and substituting the corrected value V&prime; of the sample volume for the sample volume V in the Gent equation with respect to the temperature range Y.

Method and apparatus for measuring viscosity of green compact sample, and computer readable medium for storing method for measuring viscosity of green compact sample

A crystallized glass composition contains a principal ingredient comprising SiO , MgO and Al O and contains about 2 to 20 parts by weight of B O relative to 100 parts by weight of the principal ingredient. In a ternary diagram, the weight ratio (SiO , MgO, Al O ) lies within a region surrounded by point A (44.0, 55.0, 1.0), point B (34.5, 64.5, 1.0), point C (35.0, 30.0, 35.0) and point D (44.5, 30.0, 25.5).

Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same

A method for measuring the viscosity of a green compact includes the steps of finding a corrected value V&prime; of the sample volume of the green compact, where the corrected value V&prime; of the sample volume is a volume occupied by the inorganic powder in the green compact; finding a corrected value (dh/dt)&prime; of the sample deformation rate of the green compact, where the corrected value (dh/dt)&prime; of the sample deformation rate is the difference between the apparent sample deformation rate and the sample deformation rate due to sintering shrinkage; separating a temperature range X in which sintering shrinkage dominates and a temperature range Y in which plastic deformation dominates with respect to the displacement of the green compact; substituting the corrected value V&prime; of the sample volume for the sample volume V and substituting the corrected value (dh/dt)&prime; of the sample deformation rate for the sample deformation rate dh/dt in the Gent equation with respect to the temperature range X; and substituting the corrected value V&prime; of the sample volume for the sample volume V in the Gent equation with respect to the temperature range Y.

Method and apparatus for measuring viscosity of green compact, and computer readable recording medium for storing method for measuring viscosity of green compact

There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B O , about 28% to 44% by weight of SiO , 0% to about 20% by weight of Al O , and about 36% to 50% by weight of MO (where MO is at least one selected from the group consisting of CaO, MgO, and BaO), and a powdered ceramic; in which the amount of the powdered borosilicate-based glass is about 40% to 49% by weight based on the total amount of the composition for a ceramic substrate, and the amount of the powdered ceramic is about 60% to 51% by weight based on the total amount of the composition for a ceramic substrate.

Composition for ceramic substrate and ceramic circuit component

A ceramic substrate composition includes about 26 to 48% by weight of a CaO&mdash;Al O &mdash;B O &mdash;SiO type glass, about 35 to 68% by weight of at least one of alumina, mullite, cordierite and forsterite, and about 3 to 24% by weight of quartz, said glass being capable of being crystallized to wollastonite by firing of the composition at a temperature of about 800 to 1000&deg; C. A ceramic circuit component contains a circuit formed on the ceramic substrate obtained by firing the composition.

Ceramic substrate composition and ceramic circuit component

Disclosed is an insulating glass paste capable of forming an over glaze layer having a low rate of occurrence of cracks and excellent reliability. The insulating glass paste is used for forming an over glaze layer on an insulating substrate exhibits a fracture toughness strength of about 1.0 MN/m or more after burning.

Insulating glass paste and thick-film circuit component

Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100&deg; C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as &frac12; and a thermal expansion coefficient of as high as 12 ppm/&deg; C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO,, MgO and CaO, the composition ratio of SiO,, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.

Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board

A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated ceramic green sheets containing a ceramic insulating material and wiring conductors and preliminarily providing spaces in the inside such that the compact blocks fit into the spaces, arranging sheet type bases made from a raw ceramic not sintered at the baking temperature of the composite laminated member on the principal plane at both ends with respect to the lamination direction of the raw composite laminated member, baking the raw composite laminated member with the raw composite laminated member interposed by the sheet type bases so as to restrain the contraction at a temperature not more than about 1000&deg; C., and eliminating the unsintered sheet type bases.

Method of producing a multi-layer ceramic substrate

An inorganic composition for low temperature firing comprising about 15 to 40 weight % of glass powder and about 60 to 85 weight % of cordierite, is disclosed. The glass powder is composed of about 20 to 60 weight % of SiO,, about 30 to 50 weight % of B,O,, about 5 to 30 weight % of MgO, 0 to about 15 weight % of Al,O,, and about 1 to 5 weight % of R,O (R is alkali metal). The inorganic composition is capable of being fired at a relative low temperature, and has a low thermal expansion coefficient and permittivity, as well as high mechanical strength.

Inorganic composition for low temperature firing

A dielectric ceramic composition which has a high dielectric constant and a high Q value, as well as excellent temperature stability, and which is sinterable at a relatively low temperature. The dielectric ceramic composition of the present invention is formed of a mixture of a BaO--TiO.sub.2 --REO.sub.3/2 --BiO.sub.3 ceramic composition wherein RE represents a rare earth element, and a glass composition. The glass composition contains about 13-50 wt. % SiO.sub.2, about 3-30 wt. % B.sub.2 O.sub.3, about 40-80 wt. % alkaline earth metal oxide and about 0.1-10 wt. % Li.sub.2 O.

Dielectric ceramic composition and ceramic electronic element using the

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Otsu, Japan

Hiroshi Takagi